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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Additively Printed Flexible Temperature Sensor for Wearable Applications

The flexible sensor has the capability to be mounted on any curved surfaces of applications and be used for portable devices. Additively printed sensors have received attention owing to their compact design and ability of application to non-planar surfaces. Wearable applications require capability of integration into a variety of surfaces with ability to flex, fold, twist and stretch under the stresses of daily motion. There is scarcity of data on the interaction of the process parameters with the realized performance. In addition, there is need for data focused on sensor accuracy, repeatability, and reliability. In this study, experimental analysis on function of the fabricated sensing board is conducted. The temperature sensors are made by direct write printing method with nScrypt printer. A calibration of the sensors has been conducted to confirm that resistance is well related to actual temperature and find TCR (temperature coefficient to resistance). The evolution of resistance has been correlated with the environmental temperature. The sensor hysteresis has been quantified using upswing and downswing of the environmental temperature. In addition, the effect of humidity on the temperature sensor accuracy and performance has been quantified. The effect of a polymide coat on the sensor to prevent humidity effects has also been quantified.

Pradeep Lall↗
NASA NTRS1986

Applications of heat pipes to cool PWBS and hybrid microcircuits

Some of the advanced thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions are discussed. Heat pipes in actual electronic packaging applications, and those under development, are discussed. Performance characteristics of heat pipes are given, and examples are described of how thermal problems in electronic packaging are solved through the use of heat pipes.

Sekhon, K. S.↗
NASA NTRS1989

Survey Of Cooling Techniques

Methods of maintaining electronics at best operating temperatures reviewed. Paper surveys cooling techniques for electronic components and sensors that must be kept at temperatures ranging from thousandths of kelvin to room temperature. Discusses characteristics of various coolers in terms of ground and space applications, cooling capacity, reliability, and temperature range. Also discusses briefly, cooling of conventional electronic circuitry operating few degrees above environmental temperature by natural or forced convection of air or liquid. At greater length, discusses passive and active refrigeration of "cold" electronic circuitry operating below environmental temperature.

Chan, Chung K.↗
NASA NTRS1991

Superalloy for high-temperature hydrogen environmental applications

A nickel-based superalloy is provided which is resistant to deterioration in hydrogen at high operating temperatures and pressures, and which thus can be used in hydrogen-fueled spacecraft such as the Space Shuttle. The superalloy is characterized by a two-phase microstructure and consists of a gamma-prime precipitated phase in a gamma matrix. The gamma matrix phase is a primary solid solution and the gamma precipitated phase will be an intermetallic compound of the type A.sub.3 B, such as nickel aluminide or titanide. Both phases are coherent, ordered, and compatible, and thus will retain most of their strength at elevated temperatures. The alloy consists essentially of (by weight): Ni 50-60%, Cr 10-20%, Al 2-6%, Co 2-5%, Ti 3-8%, W 5-12%, Mo 5-10%, Nb 1-3%, wherein the ratio W/MO is approximately equal to 1, and Ti/Al ranges from about 1 to about 2.

McKannan, Eugene C.↗
NASA NTRS2014

High Temperature Multilayer Environmental Barrier Coatings Deposited Via Plasma Spray-Physical Vapor Deposition

Si-based ceramic matrix composites (CMCs) require environmental barrier coatings (EBCs) in combustion environments to avoid rapid material loss. Candidate EBC materials have use temperatures only marginally above current technology, but the addition of a columnar oxide topcoat can substantially increase the durability. Plasma Spray-Physical Vapor Deposition (PS-PVD) allows application of these multilayer EBCs in a single process. The PS-PVD technique is a unique method that combines conventional thermal spray and vapor phase methods, allowing for tailoring of thin, dense layers or columnar microstructures by varying deposition conditions. Multilayer coatings were deposited on CMC specimens and assessed for durability under high heat flux and load. Coated samples with surface temperatures ranging from 2400-2700F and 10 ksi loads using the high heat flux laser rigs at NASA Glenn. Coating morphology was characterized in the as-sprayed condition and after thermomechanical loading using electron microscopy and the phase structure was tracked using X-ray diffraction.

Plasma↗
NASA NTRSDate not supplied

Transient Liquefaction on the Lunar or Martian Surface Operational Demonstration

As developments of local production of cryogenic fluids on the Lunar or Martian Surface progress, it is important to understand transient system responses to help with the balancing of process plant power and understanding system level operations. During the Cryogenic Fluid In-situ Liquefaction for Landers (CryoFILL) testing, a series of transient oxygen liquefaction tests were completed. These tests included varying liquefaction flow rate, environmental temperature, tank fill level, and effective cryocooler lift while allowing the tank pressure to respond to the input controls. An additional transient test was run at the 90% fill level to determine the impact of injecting the gaseous oxygen at the bottom of the tank, allowing the vapor to bubble up through the liquid. Tests were run in a cyclical nature varying one variable at a time. The control variable was set in a manner to increase tank pressure for a period of time and then subsequently changed in a manner to decrease the tank pressure back to its original value with multiple cycles run for all tests. Tank pressure and system temperature responses were tracked as a function of time with an emphasis on repeatability. Results indicate that of the four variables tested, the environmental temperature is the least important. As expected, the bubbling of the liquefaction gas significantly decreased the pressurization and depressurization rates in the tank at the 90% full level.

Liquefaction↗
NASA NTRSDate not supplied

High-Temperature Slurry Environmental Barrier Coating With Graded HfO 2 -HfSiO 4 Topcoat

Environmental barrier coatings (EBCs) have enabled the use of silicon carbide (SiC)-based ceramic matrix composites (CMCs) in gas turbine engines by protecting the underlying CMC from corrosive combustion species. Current-generation EBCs consist of a rare earth silicate topcoat and a silicon bond coat. The relatively low melting point of the silicon bond coat (1414°C) limits the upper use temperature of these coatings. To protect SiC-based CMCs at temperatures beyond that achievable by the current state-of-the-art, an oxide-based bond coat capable of withstanding temperatures of up to 1482°C has been developed at NASA Glenn Research Center. Hafnia (HfO2) is a promising EBC topcoat material due to its stability in high-temperature steam; however, its coefficient of thermal expansion (CTE) is highly anisotropic and much larger than that of SiC. In this study, a graded HfO2-HfSiO4 topcoat was deposited via a slurry process on the NASA-developed oxide-based bond coat. The oxidation resistance of this EBC system was evaluated at 1482°C in a steam cycling environment. The durability and stability of this slurry-deposited HfO2-HfSiO4 topcoat was compared to that of HfO2 deposited by plasma spray physical vapor deposition (PS-PVD).

EBC↗
NASA NTRS1975

Stress modification of the toxicity of antimotion sickness drugs and Aspirin

The effect of environmental temperature on the toxicity of cyclizine, trimethobenzamide, and Aspirin were studied in mice. LD-50s were compared at 30 C, 22 C, and 15 C. At 30 C the toxicity of all three drugs increased, with that to Aspirin being affected most. Cooling decreased the toxicity of cyclizine and had no significant effect on that of trimethobenzamide or aspirin. These findings indicate that alterations in environmental temperature markedly affect drug toxicity. They emphasize that such alterations, and particularly increases in temperature, do not have to be particularly drastic, but that 'mild' variations in the environment are effective in altering an animal's sensitivity to a drug.

Shields, D.↗
NASA NTRS1985

Numerical simulation of precipitation induced downbursts

Using the Terminal Area Simulation System (TASS), numerical simulations of downburst structure and sensitivity, based on vertical profiles of environmental temperature, humidity and wind velocity observed during the June and August 1982 JAWS project, are presented. Two-dimensional axisymmetric simulations examining downburst evolution, structure and sensitivity, assume a 40-m constant grid size on a 10-km diameter 5-km deep cylindrical domain. The three-dimensional experiment, examining the effects of vertical wind shear and other asymmetrical aspects of the downpour, assumed a 500-m constant horizontal grid size and a 35 x 35 x 18.5-km area. In the downburst primary structure depicted, outflow speeds were found to be sensitive to environmental temperature and humidity, as well as to precipitation radius and intensity. A vortex ring was found to propagate downwards, and maximum outflow winds occur when the vortex ring first reaches the surface.

Proctor, F. H.↗
NASA NTRS2008

Qualification Testing of Engineering Camera and Platinum Resistance Thermometer (PRT) Sensors for Mars Science Laboratory (MSL) Project under Extreme Temperatures to Assess Reliability and to Enhance Mission Assurance

Package Qualification and Verification (PQV) of advanced electronic packaging and interconnect technologies and various other types of qualification hardware for the Mars Exploration Rover/Mars Science Laboratory flight projects has been performed to enhance the mission assurance. The qualification of hardware (Engineering Camera and Platinum Resistance Thermometer, PRT) under extreme cold temperatures has been performed with reference to various project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times (3x) the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations and mission phases. Qualification has been performed by subjecting above flight-like qual hardware to the environmental temperature extremes and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experiments of flight like hardware qualification test results have been described in this paper.

package reliability↗
NASA NTRS2012

Qualification of Engineering Camera for Long-Duration Deep Space Missions

Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS2010

Reliability and Qualification of Hardware to Enhance the Mission Assurance of JPL/NASA Projects

Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.

PRTs↗
NASA NTRS1964

Producibility of potting compounds

Effect of environmental temperatures and relative humidities on curing times of polyurethane and polysulfide potting compounds

HUMIDITY MEASUREMENT↗
NASA NTRS2011

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗
NASA NTRS1975

Equivalent blackbody temperature of the top of a severe storm

An RB-57F high-altitude aircraft equipped with Wilde RC-8 cameras and an infrared spectrometer was used in the investigations. A storm was overflown over Graham, Texas, on April 29, 1970. In the experiment, the average radiometric temperature was determined to be very near the environmental temperature near the cloud tops. However, hot and cold regions in and near the updrafts and downdrafts were found to be significantly out of equilibrium. It is recommended that caution should be exercised in determining cloud top altitude from equivalent blackbody temperature.

Pitts, D. E.↗
NASA NTRS2006

Statistical Characterization of Environmental Error Sources Affecting Electronically Scanned Pressure Transducers

Minimization of uncertainty is essential to extend the usable range of the 15-psid Electronically Scanned Pressure (ESP) transducer measurements to the low free-stream static pressures found in hypersonic wind tunnels. Statistical characterization of environmental error sources inducing much of this uncertainty requires a well defined and controlled calibration method. Employing such a controlled calibration system, several studies were conducted that provide quantitative information detailing the required controls needed to minimize environmental and human induced error sources. Results of temperature, environmental pressure, over-pressurization, and set point randomization studies for the 15-psid transducers are presented along with a comparison of two regression methods using data acquired with both 0.36-psid and 15-psid transducers. Together these results provide insight into procedural and environmental controls required for long term high-accuracy pressure measurements near 0.01 psia in the hypersonic testing environment using 15-psid ESP transducers.

Green, Del L.↗
NASA NTRS2006

Statistical Characterization of Environmental Error Sources Affecting Electronically Scanned Pressure Transducers

Minimization of uncertainty is essential to extend the usable range of the 15-psid Electronically Scanned Pressure [ESP) transducer measurements to the low free-stream static pressures found in hypersonic wind tunnels. Statistical characterization of environmental error sources inducing much of this uncertainty requires a well defined and controlled calibration method. Employing such a controlled calibration system, several studies were conducted that provide quantitative information detailing the required controls needed to minimize environmental and human induced error sources. Results of temperature, environmental pressure, over-pressurization, and set point randomization studies for the 15-psid transducers are presented along with a comparison of two regression methods using data acquired with both 0.36-psid and 15-psid transducers. Together these results provide insight into procedural and environmental controls required for long term high-accuracy pressure measurements near 0.01 psia in the hypersonic testing environment using 15-psid ESP transducers.

Green, Del L.↗