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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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20 records · Page 2

Technology Development for 3-D Wide Swath Imaging Supporting ACE

The National Academy of Sciences Decadal Survey (DS) Aerosol-Cloud-Ecosystems Mission (ACE) aims to advance our ability to observe and predict changes to the Earth's hydrological cycle and energy balance in response to climate forcing, especially those changes associated with the effects of aerosol on clouds and precipitation. ACE is focused on obtaining measurements to reduce the uncertainties in current climate models arising from the lack in understanding of aerosol-cloud interactions. As part of the mission instrument suite, a dual-frequency radar comprised of a fixed-beam 94 gigahertz (W-band) radar and a wide-swath 35 gigahertz (Ka-band) imaging radar has been recommended by the ACE Science Working Group.In our 2010 Instrument Incubator Program project, we've developed a radar architecture that addresses the challenge associated with achieving the measurement objectives through an innovative, shared aperture antenna that allows dual-frequency radar operation while achieving wide-swath (100 kilometers) imaging at Ka-band. The antenna system incorporates 2 key technologies; a) a novel dual-band reflectorreflectarray and b) a Ka-band Active Electronically Scanned Array (AESA) feed module. The dual-band antenna is comprised of a primary cylindrical reflectorreflectarray surface illuminated by a point-focus W-band feed (compatible with a quasi-optical beam waveguide feed, such as that employed on CloudSat); the Ka-band AESA line feed provides wide-swath across-track scanning. The benefits of this shared-aperture approach include significant reductions in ACE satellite payload size, weight, and cost, as compared to a two aperture approach. Four objectives were addressed in our project. The first entailed developing the tools for the analysis and design of reflectarray antennas, assessment of candidate reflectarray elements, and validation using test coupons. The second objective was to develop a full-scale aperture design utilizing the reflectarray surface and to detail specific requirements and trades for the Ka-band AESA line feed. As part of the third objective a subscale antenna, similar to the full-scale aperture design, was developed, integrated, and flown with the Cloud Radar System during the 2014 Integrated Precipitation and Hydrology Experiment. The fourth and ongoing objective entails developing a GaN MMIC (Gallium Nitride Monolithic Microwave Integrated Circuits) power amplifier for use in the Ka-band AESA. An overview of the progress made on this project and a look ahead at the 2013 IIP (Instrument Incubator Program) award selection will be presented.

Antenna↗

Atomically Flat Surfaces Developed for Improved Semiconductor Devices

New wide bandgap semiconductor materials are being developed to meet the diverse high temperature, -power, and -frequency demands of the aerospace industry. Two of the most promising emerging materials are silicon carbide (SiC) for high-temperature and high power applications and gallium nitride (GaN) for high-frequency and optical (blue-light-emitting diodes and lasers) applications. This past year Glenn scientists implemented a NASA-patented crystal growth process for producing arrays of device-size mesas whose tops are atomically flat (i.e., step-free). It is expected that these mesas can be used for fabricating SiC and GaN devices with major improvements in performance and lifetime. The promising new SiC and GaN devices are fabricated in thin-crystal films (known as epi films) that are grown on commercial single-crystal SiC wafers. At this time, no commercial GaN wafers exist. Crystal defects, known as screw defects and micropipes, that are present in the commercial SiC wafers propagate into the epi films and degrade the performance and lifetime of subsequently fabricated devices. The new technology isolates the screw defects in a small percentage of small device-size mesas on the surface of commercial SiC wafers. This enables atomically flat surfaces to be grown on the remaining defect-free mesas. We believe that the atomically flat mesas can also be used to grow GaN epi films with a much lower defect density than in the GaN epi films currently being grown. Much improved devices are expected from these improved low-defect epi films. Surface-sensitive SiC devices such as Schottky diodes and field effect transistors should benefit from atomically flat substrates. Also, we believe that the atomically flat SiC surface will be an ideal surface on which to fabricate nanoscale sensors and devices. The process for achieving atomically flat surfaces is illustrated. The surface steps present on the "as-received" commercial SiC wafer is also illustrated. because of the small tilt angle between the crystal "basal" plane and the polished wafer surface. These steps are used in normal SiC epi film growth in a process known as stepflow growth to produce material for device fabrication. In the new process, the first step is to etch an array of mesas on the SiC wafer top surface. Then, epi film growth is carried out in the step flow fashion until all steps have grown themselves out of existence on each defect-free mesa. If the size of the mesas is sufficiently small (about 0.1 by 0.1 mm), then only a small percentage of the mesas will contain an undesired screw defect. Mesas with screw defects supply steps during the growth process, allowing a rough surface with unwanted hillocks to form on the mesa. The improvement in SiC epi surface morphology achievable with the new technology is shown. An atomic force microscope image of a typical SiC commercial epilayer surface is also shown. A similar image of an SiC atomically flat epi surface grown in a Glenn laboratory is given. With the current screw defect density of commercial wafers (about 5000 defects/cm2), the yield of atomically free 0.1 by 0.l mm mesas is expected to be about 90 percent. This is large enough for many types of electronic and optical devices. The implementation of this new technology was recently published in Applied Physics Letters. This work was initially carried out in-house under a Director's Discretionary Fund project and is currently being further developed under the Information Technology Base Program.

Powell, J. Anthony↗