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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Auger electron spectroscopy study of surface segregation in the binary alloys copper-1 atomic percent indium, copper-2 atomic percent tin, and iron-6.55 atomic percent silicon

Auger electron spectroscopy was used to examine surface segregation in the binary alloys copper-1 at. % indium, copper-2 at. % tin and iron-6.55 at. % silicon. The copper-tin and copper-indium alloys were single crystals oriented with the /111/ direction normal to the surface. An iron-6.5 at. % silicon alloy was studied (a single crystal oriented in the /100/ direction for study of a (100) surface). It was found that surface segregation occurred following sputtering in all cases. Only the iron-silicon single crystal alloy exhibited equilibrium segregation (i.e., reversibility of surface concentration with temperature) for which at present we have no explanation. McLean's analysis for equilibrium segregation at grain boundaries did not apply to the present results, despite the successful application to dilute copper-aluminum alloys. The relation of solute atomic size and solubility to surface segregation is discussed. Estimates of the depth of segregation in the copper-tin alloy indicate that it is of the order of a monolayer surface film.

Ferrante, J.↗
NASA NTRS1992

Indium Helps Strengthen Al/Cu/Li Alloy

Experiments on Al/Cu/Li alloys focus specifically on strengthening effects of minor additions of In and Cd. Indium-bearing alloy combines low density with ability to achieve high strength through heat treatment alone. Tensile tests on peak-aged specimens indicated that alloy achieved yield strength approximately 15 percent higher than baseline alloy. Alloy highly suitable for processing to produce parts of nearly net shape, with particular applications in aircraft and aerospace vehicles.

Blackburn, Linda B.↗
NASA NTRS1977

Method for attaching a fused-quartz mirror to a conductive metal substrate

A fused-quartz mirror is attached to a conductive metal substrate by the following steps: tinning one surface of a fused-quartz mirror with a solder of substantially pure indium; tinning a metallic substrate with an indium eutectic alloy consisting essentially of indium bismuth, lead and tin having a melting point substantially below that of indium; heating the eutectic alloy to a temperature substantially above its melting point, but below that of the solder; floating the mirror into place, and subsequently cooling the alloy to a temperature substantially below its melting point.

Sonnenschein, G.↗
NASA NTRS1989

Microstructure-mechanical property relationships for Al-Cu-Li-Zr alloys with minor additions of cadmium, indium or tin

Minor amounts of cadmium, indium or tin were added to a baseline alloy with the nominal composition of Al-2.4Cu-2.4Li-0.15Zr. These elements were added in an attempt to increase the age-hardening response of the material such that high strengths could be achieved through heat-treatment alone, without the need for intermediate mechanical working. The alloy variant containing indium achieved a higher peak hardness in comparison to the other alloy variations, including the baseline material, when aged at temperatures ranging from 160 C to 190 C. Tensile tests on specimens peak-aged at 160 indicated the yield strength of the indium-bearing alloy increased by approximately 15 percent compared to that of the peak-aged baseline alloy. In addition, the yield strength obtained in the indium-bearing alloy was comparable to that reported for similar baseline material subjected to a 6 percent stretch prior to peak-aging at 190 C. The higher strength levels obtaied for the indium-bearing alloy are attributed to increased number densities and homogeneity of both the T1 and theta-prime phases, as determined by TEM studies.

Blackburn, L. B.↗
NASA NTRS1989

Age hardening characteristics and mechanical behavior of Al-Cu-Li-Zr-In alloys

An investigation was conducted to determine the age-hardening response and cryogenic mechanical properties of superplastic Al-Cu-Li-Zr-In alloys. Two alloys with compositions Al-2.65Cu-2.17Li-O.13Zr (baseline) and Al-2.60Cu-2.34Li-0.16Zr-0.17In were scaled-up from 30 lb permanent mold ingots to 350 lb DC (direct chill) ingots and thermomechanically processed to 3.2 mm thick sheet. The microstructure of material which contained the indium addition was partially recrystallized compared to the baseline suggesting that indium may influence recrystallization behavior. The indium-modified alloy exhibited superior hardness and strength compared to the baseline alloy when solution-heat-treated at 555 C and aged at 160 C or 190 C. For each alloy, strength increased and toughness was unchanged or decreased when tested at - 185 C compared to ambient temperature. By using optimized heat treatments, the indium-modified alloy exhibited strength levels approaching those of the baseline alloy without deformation prior to aging. The increase in strength of these alloys in the T6 condition make them particularly attractive for superplastic forming applications where post-SPF parts cannot be cold deformed to increase strength.

Wagner, John A.↗
NASA NTRS1972

Influence of alloying elements on friction and wear of copper

The friction and wear characteristics were determined for copper binary alloys containing 10 atomic percent aluminum, silicon, indium, and tin. A ternary alloy containing 10 atomic percent aluminum and 5 atomic percent silicon was also examined. The effectiveness of each of the alloying elements aluminum and silicon were very effective in reducing friction. Silicon, however, also reduced wear appreciably. With lubrication, silicon, indium, and tin were all effective alloying elements in reducing friction and wear from values obtained for copper. Silicon was the most effective single element in reducing friction and wear in dry sliding and with lubrication.

Buckley, D. H.↗
NASA NTRS1977

Spar I liquid mixing experiment

The Liquid Mixing Experiment had as its objective the observation of effects of residual acceleration on a confined fluid system. The fluid system was chosen to be similar geometrically and in fluid properties to a range of materials science experiments. Samples were constructed as cylinders 2.2 cm long by 0.6 cm diameter. Half of each cylinder was composed of pure indium, and the other half of each was an alloy of 80 wt% indium and 25 wt% lead. The samples were enclosed in aluminum cartridges and placed in heaters mounted in three mutually perpendicular directions. The experimental procedure consisted of melting the samples when the low-g phase of the payload trajectory was attained, holding the samples in a molten state for approximately 200 seconds, and then quenching to resolidification before leaving low-g. Two of the samples exhibited very little fluid motion. The third sample, which was oriented nearly parallel to a payload radius, showed a great deal of flow.

Schafer, C. F.↗
NASA NTRS2004

T-shaped emitter metal heterojunction bipolar transistors for submillimeter wave applications

We report on the development of submillimeter wave transistors at JPL. The goal of the effort is to produce advance-reliable high frequency and high power amplifiers, voltage controlled oscillators, active multipliers, and high-speed mixed-signal circuits for space borne applications. The technology in development to achieve this is based on the Indium Phosphide (InP) Heterojunction Bipolar Transistor (HBT). The HBT is well suited for high speed, high power and uniform (across wafer) performance, due to the ability to tailor the material structure that electrons traverse through by well-controlled epitaxial growth methods. InP with its compatible lattice matched alloys such as indium gallium arsenide (InGaAs) and indium aluminium arsenide (InAlAs) provides for high electron velocities and high voltage breakdown capabilities. The epitaxial methods for this material system are fairly mature, however the implementation of high performance and reliable transistors are still under development by many laboratories. Our most recently fabricated, second generation mesa HBTs at JPL have extrapolated current gain cutoff frequency (FJ of 142GHz and power gain cutoff frequency (Fm,) of approximately 160GHz. This represents a 13% and 33% improvement of Ft and F, respectively, compared to the first generation mesa HBTs [l]. Analysis based on the University of California, Santa Barbara (UCSB) device model, RF device characteristics can be significantly improved by reducing base contact resistance and base metal contact width. We will describe our effort towards increasing transistor performance and yield.

transistor↗
NASA NTRS1990

Deformation and fracture of thin sheet aluminum-lithium alloys: The effect of cryogenic temperatures

The objective is to characterize the fracture behavior and to define the fracture mechanisms for new Al-Li-Cu alloys, with emphasis on the role of indium additions and cryogenic temperatures. Three alloys were investigated in rolled product form: 2090 baseline and 2090 + indium produced by Reynolds Metals, and commercial AA 2090-T81 produced by Alcoa. The experimental 2090 + In alloy exhibited increases in hardness and ultimate strength, but no change in tensile yield strength, compared to the baseline 2090 composition in the unstretched T6 condition. The reason for this behavior is not understood. Based on hardness and preliminary Kahn Tear fracture experiments, a nominally peak-aged condition was employed for detailed fracture studies. Crack initiation and growth fracture toughness were examined as a function of stress state and microstructure using J(delta a) methods applied to precracked compact tension specimens in the LT orientation. To date, J(delta a) experiments have been limited to 23 C. Alcoa 2090-T81 exhibited the highest toughness regardless of stress state. Fracture was accompanied by extensive delamination associated with high angle grain boundaries normal to the fatigue precrack surface and progressed microscopically by a transgranular shear mechanism. In contrast the two peak-aged Reynolds alloys had lower toughness and fracture was intersubgranular without substantial delamination. The influences of cryogenic temperature, microstructure, boundary precipitate structure, and deformation mode in governing the competing fracture mechanisms will be determined in future experiments. Results contribute to the development of predictive micromechanical models for fracture modes in Al-Li alloys, and to fracture resistant materials.

Wagner, John A.↗
NASA NTRS2012

Low TCR nanocomposite strain gages

A high temperature thin film strain gage sensor capable of functioning at temperatures above 1400.degree. C. The sensor contains a substrate, a nanocomposite film comprised of an indium tin oxide alloy, zinc oxide doped with alumina or other oxide semiconductor and a refractory metal selected from the group consisting of Pt, Pd, Rh, Ni, W, Ir, NiCrAlY and NiCoCrAlY deposited onto the substrate to form an active strain element. The strain element being responsive to an applied force.

Gregory, Otto J.↗
NASA NTRS1970

High-temperature nickel-brazing alloy

Gold-nickel brazing alloy, with 5 percent indium added to depress the melting point, is used for brazing of nickel-clad silver electrical conductors which operate at temperatures to 1200 deg F. Alloy has low resistivity, requires no flux, and is less corrosive than other gold-nickel, gold-copper alloys.

Powell, A. H.↗
NASA NTRS1972

Indium sealing techniques.

Gold films are used as an alloying flux to form 5-micron-thick indium film seals at temperatures below 300 C. Pyrex was sealed to quartz, ULE, CER-VIT, Irtran 2, Ge, GaAs, Invar, Kovar, Al, and Cu. The seals can also be used as current feedthroughs and graded seals.

Hochuli, U.↗
NASA NTRS1975

Oxygen reduction of several gold alloys in 1-molar potassium hydroxide

With rotated disk-and-ring equipment, polarograms and other electrochemical measurements were made of oxygen reduction in 1-molar potassium hydroxide on an equiatomic gold-copper (Au-Cu) alloy and a Au-Cu alloy doped with either indium (In) or cobalt (Co) and on Au doped with either nickel (Ni) or platinum (Pt). The results were compared with those for pure Au and pure Pt. The two-electron reaction dominated on all Au alloys as it did on Au. The polarographic results at lower polarization potentials were compared, assuming exclusively a two-step reduction. A qualified ranking of cathodic electrocatalytic activity on the freshly polished reduced disks was indicated: anodized Au Au-Cu-In Au-Cu Au-Cu-Co is equivalent or equal to Au-Pt Au-Ni. Aging in distilled water improved the electrocatalytic efficiency of Au-Cu-Co, Au-Cu, and (to a lesser extent) Au-Cu-In.

Miller, R. O.↗
NASA NTRS1973

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗
NASA NTRS1989

Aluminum alloy

At least about 0.1 percent by weight of indium is added as an essential component to an alloy which precipitates a T 1 phase (Al 2 CuLi). This addition enhances the nucleation of the precipitate T 1 phase, producing a microstructure which provides excellent strength as indicated by Rockwell Hardness values and confirmed by standard tensile tests.

Linda B Blackburn↗
NASA NTRS1989

Cryogenic mechanical properties of low density superplastically formable Al-Li alloys

The aerospace industry is considering the use of low density, superplastically formable (SPF) materials, such as Al-Li alloys in cryogenic tankage. SPF modifications of alloys 8090, 2090, and 2090+In were tested for strength and Kahn tear toughness. The results were compared to those of similar tests of 2219-T87, an alloy currently used in cryogenic tankage, and 2090-T81, a recently studied Al-Li alloy with exceptional cryogenic properties (1-9). With decreasing temperature, all materials showed an increase in strength, while most materials showed an increase in elongation and decrease in Kahn toughness. The indium addition to 2090 increased alloy strength, but did not improve the strength-toughness combination. The fracture mode was predominantly intergranular along small, recrystallized grains, with some transgranular fracture, some ductile rupture, and some delamination on large, unrecrystallized grains.

Verzasconi, S. L.↗