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At least 37 records · Page 2

Tissue Photolithography

Tissue lithography will enable physicians and researchers to obtain macromolecules with high purity (greater than 90 percent) from desired cells in conventionally processed, clinical tissues by simply annotating the desired cells on a computer screen. After identifying the desired cells, a suitable lithography mask will be generated to protect the contents of the desired cells while allowing destruction of all undesired cells by irradiation with ultraviolet light. The DNA from the protected cells can be used in a number of downstream applications including DNA sequencing. The purity (i.e., macromolecules isolated form specific cell types) of such specimens will greatly enhance the value and information of downstream applications. In this method, the specific cells are isolated on a microscope slide using photolithography, which will be faster, more specific, and less expensive than current methods. It relies on the fact that many biological molecules such as DNA are photosensitive and can be destroyed by ultraviolet irradiation. Therefore, it is possible to protect the contents of desired cells, yet destroy undesired cells. This approach leverages the technologies of the microelectronics industry, which can make features smaller than 1 micrometer with photolithography. A variety of ways has been created to achieve identification of the desired cell, and also to designate the other cells for destruction. This can be accomplished through chrome masks, direct laser writing, and also active masking using dynamic arrays. Image recognition is envisioned as one method for identifying cell nuclei and cell membranes. The pathologist can identify the cells of interest using a microscopic computerized image of the slide, and appropriate custom software. In one of the approaches described in this work, the software converts the selection into a digital mask that can be fed into a direct laser writer, e.g. the Heidelberg DWL66. Such a machine uses a metalized glass plate (with chrome metallization) on which there is a thin layer of photoresist. The laser transfers the digital mask onto the photoresist by direct writing, with typical best resolution of 2 micrometers. The plate is then developed to remove the exposed photoresist, which leaves the exposed areas susceptible to chemical chrome etch. The etch removes the unprotected chrome. The rest of the photoresist is then removed, by either ultraviolet organic solvent or over-development. The remaining chrome pattern is quickly oxidized by atmospheric exposure (typically within 30 seconds). The ready chrome mask is now applied to the tissue slide and aligned manually, or using automatic software and pre-designed alignment marks. The slide plate sandwich is then exposed to UV to destroy the DNA of the unwanted cells. The slide and plate are separated and the slide is processed in a standard way to prepare for polymerase chain reaction (PCR) and potential identification of cancer sequences.

Wade, Lawrence A.↗

Patterning of dispenser cathode surfaces to a controlled porosity

A process to pattern slots approximately 1.25 microns in width into 25-micron-thick W films that have been deposited onto flat or concave surfaces is discussed. A 25-micron-thick W film with a high degree of (100) orientation is chemically vapor deposited (CVD) onto a flat or concave Mo mandrel. A 5-micron-thick Al film is deposited onto the CVD W, followed by 2 microns of photoresist. On concave cathodes, XeCl2 laser ablation or X-ray lithography is used to pattern the photoresist, whereas on flat cathodes deep UV lithography can be used. The patterned photoresist serves as the mask in a Cl ion-beam-assisted etching (IBAE) process to pattern the Al. An alternative process is to deposit Al2O3 films onto the W and pattern the Al2O3 using laser ablation. The W film is then patterned to 3-6-micron slot widths using IBAE + ClF3 with the patterned Al or Al2O3 as the mask. Finally, a sputter deposition step is required to close up the slots to approximately 1 micron. The process described is capable of patterning concave dispenser cathodes to a controlled and precise porosity.

Garner, Charles E.↗

Nanoscale Fabrication of Microwave Detectors from Commercially-Available CVD-Grown Monolayer Graphene

Using commercially-available monolayer graphene, synthesized by means of chemical vapor deposition, microwave power sensing elements have been nanofabricated and integrated with microwave-grade test structures suitable for on-wafer probing. The graphene, situated on a thermal oxide, was first cleaned of stray contaminants in a forming gas environment briefly held at 250 degrees Celsius using a rapid thermal annealer. Immediately following this step, the graphene was passivated with a protective aluminum oxide layer (approximately S nm in thickness). Micrometer-scale Corbino disc test structures were then fabricated in direct contact with the graphene using a self-aligned process, which relies on the fact that tetramethylammonium hydroxide develops the photoresist while removing the aluminum oxide. Graphene nanoribbons (with widths as small 400 nm) were then fabricated across the Corbino disc gaps using electron-beam writing in conjunction with a negative tone resist. The same developer exposed the majority of the graphene while defining nanometer-scale lines of photoresist stacked upon aluminum oxide. These stacks served as etch-stops while the unprotected graphene was ion-milled in an oxygen plasma. Finally, the photoresist was removed leaving behind passivated graphene nanoribbons. Damage caused by the fabrication was evaluated by comparing the Raman spectra of the grapheme before and after processing.

detectors↗

Method of constructing dished ion thruster grids to provide hole array spacing compensation

The center-to-center spacings of a photoresist pattern for an array of holes applied to a thin metal sheet are increased by uniformly stretching the thin metal sheet in all directions along the plane of the sheet. The uniform stretching is provided by securely clamping the periphery of the sheet and applying an annular force against the face of the sheet, within the periphery of the sheet and around the photoresist pattern. The technique is used in the construction of ion thruster grid units where the outer or downstream grid is subjected to uniform stretching prior to convex molding. The technique provides alignment of the holes of grid pairs so as to direct the ion beamlets in a direction parallel to the axis of the grid unit and thereby provide optimization of the available thrust.

Banks, B. A.↗

Integrated structure vacuum tube

High efficiency, multi-dimensional thin film vacuum tubes suitable for use in high temperature, high radiation environments are described. The tubes are fabricated by placing thin film electrode members in selected arrays on facing interior wall surfaces of an alumina substrate envelope. Cathode members are formed using thin films of triple carbonate. The photoresist used in photolithography aids in activation of the cathodes by carbonizing and reacting with the reduced carbonates when heated in vacuum during forming. The finely powdered triple carbonate is mixed with the photoresist used to delineate the cathode locations in the conventional solid state photolithographic manner. Anode and grid members are formed using thin films of refractory metal. Electron flow in the tubes is between grid elements from cathode to anode as in a conventional three-dimensional tube.

Dimeff, J.↗

Measurement of the performance of a spiral wound polyimide regenerator in a pulse tube refrigerator

A regenerator for use in a pulse tube refrigerator has been constructed from a polyimide (polypyromellitimide or PPMI) whose small ratio of thermal conductivity to heat capacity make it a good candidate for a regenerator material in cryocoolers. The regenerator was fabricated using 25 micron thick photoresist strips bonded to a 50 micron thick sheet of PPMI. This composite sheet was wound in jelly-roll fashion around a mandrel and inserted into the regenerator housing. The photoresist strips, formed using a photolithographic technique, provided a 25 micron spacing for the axial flow of gas between each layer of PPMI. Ineffectiveness results are presented for this material under actual operating conditions in a pulse tube refrigerator and compared with a numerical model. The numerical model indicated that a polyimide regenerator would perform much better than one constructed of stainless steel screen, but the experimental results showed the opposite behavior. Measured values for the ineffectiveness were 0.003 for the stainless steel screen and 0.017 for the polyimide.

Rawlins, Wayne↗

SURPHEX (tm): New dry photopolymers for replication of surface relief diffractive optics

High efficiency, deep groove, surface relief Diffractive Optical Elements (DOE) with various optical functions can be recorded in a photoresist using conventional interferometric holographic and computer generated photolithographic recording techniques. While photoresist recording media are satisfactory for recording individual surface relief DOE, a reliable and precise method is needed to replicate these diffractive microstructures to maintain the high aspect ratio in each replicated DOE. The term 'high aspect ratio' means that the depth of a groove is substantially greater, i.e. 2, 3, or more times greater, than the width of the groove. A new family of dry photopolymers SURPHEX was developed recently at Du Pont to replicate such highly efficient, deep groove DOE's. SURPHEX photopolymers are being utilized in Du Pont's proprietary Dry Photopolymer Embossing (DPE) technology to replicate with very high degree of precision almost any type of surface relief DOE. Surfaces relief microstructures with width/depth aspect ratio of 1:20 (0.1 micron/2.0 micron) were faithfully replicated by DPE technology. Several types of plastic and glass/quartz optical substrates can be used for economical replication of DOE.

Shvartsman, Felix P.↗

Stirling Microregenerators Fabricated and Tested

A mesoscale Stirling refrigerator patented by the NASA Glenn Research Center is currently under development. This refrigerator has a predicted efficiency of 30 percent of Carnot and potential uses in electronics, sensors, optical and radiofrequency systems, microarrays, and microsystems. The mesoscale Stirling refrigerator is most suited to volume-limited applications that require cooling below the ambient or sink temperature. Primary components of the planar device include two diaphragm actuators that replace the pistons found in traditional-scale Stirling machines and a microregenerator that stores and releases thermal energy to the working gas during the Stirling cycle. Diaphragms are used to eliminate frictional losses and bypass leakage concerns associated with pistons, while permitting reversal of the hot and cold sides of the device during operation to allow precise temperature control. Three candidate microregenerators were fabricated under NASA grants for initial evaluation: two constructed of porous ceramic, which were fabricated by Johns Hopkins Applied Physics Laboratory, and one made of multiple layers of nickel and photoresist, which was fabricated by Polar Thermal Technologies. The candidate regenerators are being tested by Johns Hopkins Applied Physics in a custom piezoelectric-actuated test apparatus designed to produce the Stirling refrigeration cycle. In parallel with the regenerator testing, Johns Hopkins is using deep reactive ion etching to fabricate electrostatically driven, comb-drive diaphragm actuators. These actuators will drive the Stirling cycle in the prototype device. The top photograph shows the porous ceramic microregenerators. Two microregenerators were fabricated with coarse pores and two with fine pores. The bottom photograph shows the test apparatus parts for evaluating the microregenerators, including the layered nickel-and-photoresist regenerator fabricated using LIGA techniques.

Moran, Matthew E.↗

Taguchi Method Applied in Optimization of Shipley SJR 5740 Positive Resist Deposition

Taguchi Methods of Robust Design presents a way to optimize output process performance through an organized set of experiments by using orthogonal arrays. Analysis of variance and signal-to-noise ratio is used to evaluate the contribution of each of the process controllable parameters in the realization of the process optimization. In the photoresist deposition process, there are numerous controllable parameters that can affect the surface quality and thickness of the final photoresist layer.

Taguchi Method Shipley SJR 5740 orthogonal arrays ↗

Low-temperature thermionic emitter

An improved photodelineatable cathode material is disclosed comprising a combination of triple carbonate (TC) and a hydrocarbon polymeric photoresist PR. A mixture of TC powder and PR is applied to a cathode by spraying, spinning or dipping and is then subjected to activation at a temperature from about 800.degree. C up to the melting temperature. The cathodes can be activated at a temperature as low as 800.degree. C and still deliver a 0-field, temperature-limited current density of 750 milliamperes per sq. centimeter at 600.degree. C. If a pattern is desired, the coating is exposed through a suitable mask to actinic light to harden the photoresist in the desired areas. Following exposure, the exposed image areas are developed and the unexposed portions of the coating are removed with solvent. When dry, the cathode is ready for activation.

Remington, Richard W.↗

Luminal surface fabrication for cardiovascular prostheses

A method is provided for forming a mold surface with microscopic upstanding pillars for molding the inside surface of a vascular prostheses (synthetic blood vessel). The mold article is formed from a quantity of Teflon (polytetrafluoroethylene) which has a polished, flat surface on which a gold film has been sputter deposited. A photoresist layer, which cannot adhere directly to Teflon, adheres to the gold. The photoresist is exposed and developed leaving a sputter resistant mask defining the desired pillar locations, and the resulting workpiece is ion etched to form the pillars in the Teflon. A synthetic blood vessel material is cast against the Teflon mold to form blind recesses on the inside of the synthetic blood vessel, with the recesses being of predetermined uniform cross section and present in a predetermined uniform pattern.

Deininger, William D.↗

Focal-Plane Arrays of Quantum-Dot Infrared Photodetectors

Focal-plane arrays of semiconductor quantum-dot infrared photodetectors (QDIPs) are being developed as superior alternatives to prior infrared imagers, including imagers based on HgCdTe devices and, especially, those based on quantum-well infrared photodetectors (QWIPs). HgCdTe devices and arrays thereof are difficult to fabricate and operate, and they exhibit large nonunformities and high 1/f (where f signifies frequency) noise. QWIPs are easier to fabricate and operate, can be made nearly uniform, and exhibit lower 1/f noise, but they exhibit larger dark currents, and their quantization only along the growth direction prevents them from absorbing photons at normal incidence, thereby limiting their quantum efficiencies. Like QWIPs, QDIPs offer the advantages of greater ease of operation, greater uniformity, and lower 1/f noise, but without the disadvantages: QDIPs exhibit lower dark currents, and quantum efficiencies of QDIPs are greater because the three-dimensional quantization of QDIPs is favorable to the absorption of photons at normal or oblique incidence. Moreover, QDIPs can be operated at higher temperatures (around 200 K) than are required for operation of QWIPs. The main problem in the development of QDIP imagers is to fabricate quantum dots with the requisite uniformity of size and spacing. A promising approach to be tested soon involves the use of electron-beam lithography to define the locations and sizes of quantum dots. A photoresist-covered GaAs substrate would be exposed to the beam generated by an advanced, high-precision electron beam apparatus. The exposure pattern would consist of spots typically having a diameter of 4 nm and typically spaced 20 nm apart. The exposed photoresist would be developed by either a high-contrast or a low-contrast method. In the high-contrast method, the spots would be etched in such a way as to form steep-wall holes all the way down to the substrate. The holes would be wider than the electron beam spots perhaps as wide as 15 to 20 nm, but may be sufficient to control the growth of the quantum dots. In the low-contrast method, the resist would be etched in such a way as to form dimples, the shapes of which would mimic the electron-beam density profile. Then by use of a transfer etching process that etches the substrate faster than it etches the resist, either the pattern of holes or a pattern comprising the narrow, lowest portions of the dimples would be imparted to the substrate. Having been thus patterned, the substrate would be cleaned. The resulting holes or dimples in the substrate would serve as nucleation sites for the growth of quantum dots of controlled size in the following steps. The substrate would be cleaned, then placed in a molecular-beam-epitaxy (MBE) chamber, where native oxide would be thermally desorbed and the quantum dots would be grown.

Gunapala, Sarath↗

Parylene C as a Sacrificial Material for Microfabrication

Parylene C has been investigated for use as a sacrificial material in microfabrication. Although Parylene C cannot be patterned lithographically like photoresists, it nevertheless extends the range of processing options by offering a set of properties that are suitable for microfabrication and are complementary to those of photoresists. The compatibility of Parylene C with several microfabrication processes was demonstrated in experiments in which a thin film of Parylene C was deposited on a silicon wafer, then several thin metal films were deposited and successfully patterned, utilizing the Parylene C pads as a sacrificial layer. The term "parylene" -- a contraction of "poly(para-xylene)" -- denotes a family of vapor-deposited polymers. In Parylene C (the most common form of parylene), a chlorine atom is substituted for one of the hydrogen atoms on the benzene ring of each para-xylene moiety. Heretofore, parylenes have been used as conformal coating materials in diverse applications.

Beamesderfer, Michael↗

High Precision Metal Thin Film Liftoff Technique

A metal film liftoff process includes applying a polymer layer onto a silicon substrate, applying a germanium layer over the polymer layer to create a bilayer lift off mask, applying a patterned photoresist layer over the germanium layer, removing an exposed portion of the germanium layer, removing the photoresist layer and a portion of the polymer layer to expose a portion of the substrate and create an overhanging structure of the germanium layer, depositing a metal film over the exposed portion of the substrate and the germanium layer, and removing the polymer and germanium layers along with the overlaying metal film.

Brown, Ari D.↗

Microcalorimeter Absorber Optimization for 0.2 to 12 keV X-Rays

The Advanced Telescope for High ENergy Astrophysics (ATHENA) mission requires high quantum efficiency (QE) x-ray absorption, >90.6% at 7 keV and low specific heat capacity, 0.731 pJ/K. The designed ATHENA x-ray absorbers are cantilevered square tiles (pitch of 317 microns) of 1.05 μm thick Au and 5.51 μm thick Bi electroplated films supported by stems that connect the absorber to the detector below. We discuss some of the methods used to produce x-ray absorbers meeting these specifications for ATHENA. To tune the thermal conductance of the device and the effect on the normal-to superconducting transition shape, the stems need to be small diameter and can have a weak bottle-neck connection to the substrate. A funnel shape of the stem using a proximity exposed photoresist mold has been developed to improve the strength of the connections. Further requirements on the absorbers include low levels of fine particulate remaining on the substrate after production and zero shorts between absorbers due to incomplete ion milling or trapped fine particular between absorbers. To optimize for post patterning substrate cleanliness and absorber yield, we have examined several methods of absorber fabrication. Three such methods are 1) an ion mill/wet etch combination, 2) a photoresist mold for electroplating followed by wet or dry etch to remove the seed layer, and 3) an electroplating process with leveling to smooth the surface followed by ion mill to separate the absorbers. The different combinations of wet and dry etches lead to different yields and surface appearance of the absorber sidewalls. We present results on the achieved pixel yields and the energy resolution of pixels made with the various fabrication methods. We discuss the impact of absorber patterning method on performance, uniformity, and yield.

Edward J Wassell↗

Processing of Superconductor-Normal-Superconductor Josephson Edge Junctions

The electrical behavior of epitaxial superconductor-normal-superconductor (SNS) Josephson edge junctions is strongly affected by processing conditions. Ex-situ processes, utilizing photoresist and polyimide/photoresist mask layers, are employed for ion milling edges for junctions with Yttrium-Barium-Copper-Oxide (YBCO) electrodes and primarily Co-doped YBCO interlayers.

photoresist polyimide process interlayer materials↗