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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Optical comparator method determines the quality and registration of surface features of double-sided printed circuit boards. Color-coded superimposed images of both sides of a printed circuit board are presented to view, clearly showing details and registration of the circuitry.
Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.
Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.
Materials compatibility study for improved multilayer printed circuit board
Topographic simulation scheme used to program path layout of conductors in printed circuit board design
The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.
Here, the use of Printed Circuit Boards (PCBs) for the inductive pick-up windings of rotating coil probes has made the construction of these precision magnetic measurement devices much more accessible. This paper discusses the design details for PCBs which on each layer of the board provide for simultaneous analog bucking (suppression) of dipole, quadrupole, and sextupole field components so as to more accurately measure the higher order harmonic fields in sextupole magnets. Techniques to generate designs are discussed, as well as trade-offs to optimize sensitivity. Examples of recent sextupole PCBs and their performance are given.
Nondestructive measurement of elastic and plastic deformation in soldered joints and printed circuit boards by holographic interferometry
Highly reliable soldered joints for printed circuit boards
Ferric chloride in an aqueous medium etches copper from the surface of printed-circuit boards. Ferric ions are reduced to ferrous ions resulting in a reduced etching rate.
An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.
This NESC Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.
Electrical connection for printed circuits on common board, using bellows principle in rivet
A method and apparatus for determining a presence, color and/or brightness of a plurality of components in a printed circuit board, where the components are biased either with constant current or with a current pulse.
This HDPUG Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.
The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.
This paper showcases an all-in-one testing environment that combines Trojan detection and fuzzing capabilities for printed circuit boards using the OpenPLC “NYU Trojan Edition” and a dedicated Trojan detection framework. The demo system is self-contained and equipped with two OpenPLC-based boards (one with a Trojan and one without), and automated tools for inserting the Trojan and collecting side-channel data. We developed a graphical user interface for interactive Trojan selection, data visualization, and anomaly detection analysis.
A computing module is described herein, wherein the computing module is configured to perform acts including generating a digital signature for a printed circuit board (PCB), wherein the digital signature is based upon a sensor signal generated by a sensor that is electrically coupled to at least one of a trace of the PCB or an electrical component of the PCB. The acts further include determining that the PCB is authentic and is free of tampering based upon the digital signature. The acts additionally include outputting an indication that the PCB is authentic and is free of tampering responsive to determining that the PCB is authentic and is free of tampering.