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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Standardizing GPU Radiation Test Approaches

While some Graphical Processing Units (GPUs) are discrete components (i.e.GTX1050), others take the form of an IP block or embedded engine within a System on Chip (SoC) device such as the Qualcomm Snapdragon"TM" 820 which contains a Qualcomm Adreno"TM" 530 GPU. Within this device are various functional blocks which can be exercised with software payloads. NVidia's Jetson"TM" TX1 SoC is provided on a System on Module (SOM). Within it are Central Processing Unit (CPU) cores and an nVidia GPU which can be accessed similarly to a discrete GPU coprocessor. While the packaging is different, each one of these GPUs needs to be tested using the same standardized code.

Single Event Effects (SEE)↗
NASA NTRS2015

Towards a Generic and Adaptive System-On-Chip Controller for Space Exploration Instrumentation

This paper introduces one of the first efforts conducted at NASA’s Jet Propulsion Laboratory (JPL) to develop a generic System-on-Chip (SoC) platform to control science instruments that are proposed for future NASA missions. The SoC platform is named APEX-SoC, where APEX stands for Advanced Processor for space Exploration, and is based on a hybrid Xilinx Zynq that combines an FPGA and an ARM Cortex-A9 dual-core processor on a single chip. The Zynq implements a generic and customizable on-chip infrastructure that can be reused with a variety of instruments, and it has been coupled with a set of off-chip components that are necessary to deal with the different instruments. We have taken JPL’s Compositional InfraRed Imaging Spectrometer (CIRIS), which is proposed for NASA icy moons missions, as a use-case scenario to demonstrate that the entire data processing, control and interface of an instrument can be implemented on a single device using the on-chip infrastructure described in this paper. We show that the performance results achieved in this preliminary version of the instrumentation controller are sufficient to fulfill the science requirements demanded to the CIRIS instrument in future NASA missions, such as Europa.

embedded system↗
DOE OSTI2024

Accelerating Lossy and Lossless Compression on Emerging BlueField DPU Architectures

Data compression has become a crucial technique in addressing performance bottlenecks caused by increasing data volumes in High-Performance Computing (HPC), Big Data, and Deep Learning (DL). Despite its potential to boost system performance, recent studies have identified significant challenges with existing compression methods, mainly due to their high computational demands amidst continuously growing data sizes. Concurrently, the advent of Data Processing Units (DPUs), equipped with programmable System-on-Chip (SoC) and specialized compression accelerators, offers a promising opportunity to alter the landscape of data compression. This paper explores the complexities and potential of leveraging NVIDIA BlueField DPUs to accelerate lossy and lossless compression. Towards this, we introduce PEDAL, an innovative library that leverages the hardware capabilities of DPUs to unify and optimize data compression designs. Moreover, we seamlessly co-design PEDAL with the popular MPICH MPI library, demonstrating up to 101x speedup in compression time and 88x decrease in communication latency. Drawing on these achievements, we share our experience with various research communities about accelerating data compression on DPUs in communication-oriented HPC scenarios.

Li, Yuke↗
DOE OSTI2020

OpenSNAPI: Toward a Unified API for SmartNICs

The end of Moore’s Law and Dennard Scaling has produced a renaissance in the field of computer architecture. Unable to continue leveraging silicon-level processor improvements to further enhance performance and scalability, system architects have been forced to explore other options. In this new era of heterogeneous architectures and hardware/software codesign, a new class of devices known as “accelerators” has emerged. Independently designed for optimized execution of distinct workloads, these devices have proven critical to the continued advancement of application performance. SmartNICs, accelerator devices integrated with a network controller, have conventionally been utilized to offload low-level networking functionality. However, newer SmartNIC variants, which incorporate a system-on-chip (SoC) with traditional designs, are challenging this precedent. Leveraging significantly augmented resources, these new devices offer increased versatility and the potential to more effectively complement a given architecture’s CPU. In this talk, we introduce the motivation underlying acceleration, explore the fundamentals of SmartNICs, and discuss traditional use cases. We also detail our initial efforts to investigate the feasibility and benefits of SmartNICs as general-purpose accelerators. We present the OpenSNAPI project created to define a uniform application programming interface (API) for this emerging class of devices. Finally, we provide a brief tutorial regarding development of SmartNIC-accelerated applications on Los Alamos National Laboratory’s SmartNIC-enabled platforms.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2022

A Path Toward Understanding the Performance Capabilities of SmartNIC Devices [Slides]

SmartNICs, accelerator devices integrated with a network, have conventionally been utilized to offload low-level networking functionality. However, newer SmartNIC variants, which incorporate a system-on-chip (SoC) with traditional designs, are challenging this precedent. Leveraging significantly augmented resources, these new devices offer increased versatility and the potential to more effectively complement a given architecture’s CPU. Naturally, there is performance overhead associated with offloading tasks from a host CPU to a SmartNIC. As SmartNICs become more versatile and are used for a wider range of computational tasks, it is critical to understand how well the SmartNICs perform those respective tasks in order to determine whether the cost of offloading is worthwhile. In this work, we lay out a path to understand the important question of when and when not to offload to SmartNIC devices by way of a series of microbenchmarks.

97 MATHEMATICS AND COMPUTING↗
NASA NTRS2003

Low-Power SOI CMOS Transceiver

The work aims at developing a low-power Silicon on Insulator Complementary Metal Oxide Semiconductor (SOI CMOS) Transceiver for deep-space communications. RF Receiver must accomplish the following tasks: (a) Select the desired radio channel and reject other radio signals, (b) Amplify the desired radio signal and translate them back to baseband, and (c) Detect and decode the information with Low BER. In order to minimize cost and achieve high level of integration, receiver architecture should use least number of external filters and passive components. It should also consume least amount of power to minimize battery cost, size, and weight. One of the most stringent requirements for deep-space communication is the low-power operation. Our study identified that two candidate architectures listed in the following meet these requirements: (1) Low-IF receiver, (2) Sub-sampling receiver. The low-IF receiver uses minimum number of external components. Compared to Zero-IF (Direct conversion) architecture, it has less severe offset and flicker noise problems. The Sub-sampling receiver amplifies the RF signal and samples it using track-and-hold Subsampling mixer. These architectures provide low-power solution for the short- range communications missions on Mars. Accomplishments to date include: (1) System-level design and simulation of a Double-Differential PSK receiver, (2) Implementation of Honeywell SOI CMOS process design kit (PDK) in Cadence design tools, (3) Design of test circuits to investigate relationships between layout techniques, geometry, and low-frequency noise in SOI CMOS, (4) Model development and verification of on-chip spiral inductors in SOI CMOS process, (5) Design/implementation of low-power low-noise amplifier (LNA) and mixer for low-IF receiver, and (6) Design/implementation of high-gain LNA for sub-sampling receiver. Our initial results show that substantial improvement in power consumption is achieved using SOI CMOS as compared to standard CMOS process. Potential advantages of SOI CMOS for deep-space communication electronics include: (1) Radiation hardness, (2) Low-power operation, and (3) System-on-Chip (SOC) solutions.

Fujikawa, Gene↗
NASA NTRS2007

Assurance of Complex Electronics. What Path Do We Take?

Many of the methods used to develop software bare a close resemblance to Complex Electronics (CE) development. CE are now programmed to perform tasks that were previously handled in software, such as communication protocols. For instance, Field Programmable Gate Arrays (FPGAs) can have over a million logic gates while system-on-chip (SOC) devices can combine a microprocessor, input and output channels, and sometimes an FPGA for programmability. With this increased intricacy, the possibility of "software-like" bugs such as incorrect design, logic, and unexpected interactions within the logic is great. Since CE devices are obscuring the hardware/software boundary, we propose that mature software methodologies may be utilized with slight modifications to develop these devices. By using standardized S/W Engineering methods such as checklists, missing requirements and "bugs" can be detected earlier in the development cycle, thus creating a development process for CE that will be easily maintained and configurable based on the device used.

FROM↗
NASA NTRS2007

Software Process Assurance for Complex Electronics

Complex Electronics (CE) now perform tasks that were previously handled in software, such as communication protocols. Many methods used to develop software bare a close resemblance to CE development. Field Programmable Gate Arrays (FPGAs) can have over a million logic gates while system-on-chip (SOC) devices can combine a microprocessor, input and output channels, and sometimes an FPGA for programmability. With this increased intricacy, the possibility of software-like bugs such as incorrect design, logic, and unexpected interactions within the logic is great. With CE devices obscuring the hardware/software boundary, we propose that mature software methodologies may be utilized with slight modifications in the development of these devices. Software Process Assurance for Complex Electronics (SPACE) is a research project that used standardized S/W Assurance/Engineering practices to provide an assurance framework for development activities. Tools such as checklists, best practices and techniques were used to detect missing requirements and bugs earlier in the development cycle creating a development process for CE that was more easily maintained, consistent and configurable based on the device used.

Plastow, Richard A.↗
NASA NTRS2007

Filling the Assurance Gap on Complex Electronics

Many of the methods used to develop software bare a close resemblance to Complex Electronics (CE) development. CE are now programmed to perform tasks that were previously handled by software, such as communication protocols. For example, the James Webb Space Telescope will use Field Programmable Gate Arrays (FPGAs), which can have over a million logic gates, to send telemetry. System-on-chip (SoC) devices, another type of complex electronics, can combine a microprocessor, input and output channels, and sometimes an FPGA for programmability. With this increased intricacy, the possibility of software-like bugs such as incorrect design, logic, and unexpected interactions within the logic is great. Since CE devices are obscuring the hardware/software boundary, mature software methodologies have been proposed, with slight modifications, to develop these devices. By using standardized S/W Engineering methods such as checklists, missing requirements and bugs can be detected earlier in the development cycle, thus creating a development process for CE that can be easily maintained and configurable based on the device used.

Plastow, Richard A.↗
NASA NTRS2007

Software Process Assurance for Complex Electronics (SPACE)

Complex Electronics (CE) are now programmed to perform tasks that were previously handled in software, such as communication protocols. Many of the methods used to develop software bare a close resemblance to CE development. For instance, Field Programmable Gate Arrays (FPGAs) can have over a million logic gates while system-on-chip (SOC) devices can combine a microprocessor, input and output channels, and sometimes an FPGA for programmability. With this increased intricacy, the possibility of software-like bugs such as incorrect design, logic, and unexpected interactions within the logic is great. Since CE devices are obscuring the hardware/software boundary, we propose that mature software methodologies may be utilized with slight modifications in the development of these devices. Software Process Assurance for Complex Electronics (SPACE) is a research project that looks at using standardized S/W Assurance/Engineering practices to provide an assurance framework for development activities. Tools such as checklists, best practices and techniques can be used to detect missing requirements and bugs earlier in the development cycle creating a development process for CE that will be more easily maintained, consistent and configurable based on the device used.

Plastow, Richard A.↗
NASA NTRS2012

Stereo and IMU-Assisted Visual Odometry for Small Robots

This software performs two functions: (1) taking stereo image pairs as input, it computes stereo disparity maps from them by cross-correlation to achieve 3D (three-dimensional) perception; (2) taking a sequence of stereo image pairs as input, it tracks features in the image sequence to estimate the motion of the cameras between successive image pairs. A real-time stereo vision system with IMU (inertial measurement unit)-assisted visual odometry was implemented on a single 750 MHz/520 MHz OMAP3530 SoC (system on chip) from TI (Texas Instruments). Frame rates of 46 fps (frames per second) were achieved at QVGA (Quarter Video Graphics Array i.e. 320 240), or 8 fps at VGA (Video Graphics Array 640 480) resolutions, while simultaneously tracking up to 200 features, taking full advantage of the OMAP3530's integer DSP (digital signal processor) and floating point ARM processors. This is a substantial advancement over previous work as the stereo implementation produces 146 Mde/s (millions of disparities evaluated per second) in 2.5W, yielding a stereo energy efficiency of 58.8 Mde/J, which is 3.75 better than prior DSP stereo while providing more functionality.

Source record↗
NASA NTRS2023

Proton Testing of AMD v1202b System on Chip

Single-Event Effects (SEE) testing was previously conducted on the AMD v1200 System on Chip (SoC) at Massachusetts General Hospital’s (MGH) Francis H. Burr Proton Therapy Center on May 28, 2022, using 200-MeV protons.

Edward J Wyrwas↗
NASA NTRS2022

Benchmarking and Testing of Qualcomm Snapdragon System-on-Chip for JPL Space Applications and Missions

As some space missions become more challenging due to new environments, greater distances, or more limited size, weight, and power (SWaP) constraints, spacecraft avionics must adapt to allow the spacecraft to be more autonomous and agile---eliminating the Spacecraft-Earth-Spacecraft feedback loop whenever possible. Prime examples of such missions include Aerobots (such as Ingenuity with extremely low SWaP constraints and demanding signal/image processing during flight) and landers in possibly hostile environments (such as a Europa lander mission, with limited communication capacity, high latency, and constrained power budget). To address these challenges, JPL worked with Qualcomm to demonstrate the use of their Snapdragon 801 system-on-chip (SoC) onboard the Ingenuity Helicopter on Mars. The Qualcomm Snapdragon SoC contains various subsystems, including an ARM cluster, a Graphics processing unit, a Digital Signal Processing subsystem, a Neural Processing Engine, Image Signal Processing subsystem, among others. Since the success of Ingenuity, JPL is continuing to work with Qualcomm to address other applications of the Snapdragon SoC technology. This includes the deployment of two 855 Snapdragon development boards onboard the International Space Station (ISS) for successful in-situ benchmarking of applications in space (beyond those tested on Ingenuity). In this paper, we will examine the performance of various applications that have been identified to benefit from greater onboard computational capability. These applications include (among others): machine vision algorithms that are expected to be critical in autonomous entry-descent-and-landing scenarios and real-time Aerobot flight navigation; Hyperspectral compression algorithms; Synthetic Aperture Radar Processing along with various instrument processing algorithms. We discuss how the infusion of Qualcomm's Snapdragon SoC is capable of enabling missions that may not have been able to achieve their goals with traditional flight computing. In addition, we also show that for some algorithms, the software implementation on the Snapdragon SoC outperforms traditional FPGA implementations.

Cretu, Vlad↗
DOE OSTI2020

An Experimental Feasibility Study on Applying Neutron Tomography to Encapsulated Spent Nuclear Fuel - 20050

Visual inspection makes easier to ensure the integrity and safety of spent nuclear fuel (SNF) than any classical techniques. Various classical techniques have been applied but there are no reliable methods to qualitatively and quantitatively verify spent fuel in dry storage. Thus, the present authors have developed the prototype safeguards apparatus for dry storage employing the array of He-4 gas scintillation detectors (S670E, Arktis Radiation Detectors Ltd., Switzerland), newly designed to simultaneously measure thermal and fast neutrons without any moderators. The S670E detector has a cylindrical shape with a diameter of 52 mm and active length of 600 mm (total length: 875 mm). The detector is filled by He-4 gas with an approximate pressure of 180 bar for fast neutron detection, and its inner wall is coated by Li-6 for thermal neutron detection. The scintillation lights generated via Li-6 nuclear reaction and elastic scattering are collected by 24 SiPMs linearly paired at the center of the detector. The detector delivers a TTL (Transistor-Transistor Logic) output for pulse readout and UART (Universal Asynchronous Receiver Transmitter) for device control. In order to assess feasibility of the apparatus, an experimental system has been designed, built, and optimized via computational studies. Cf-252 neutron sources and linearly arrayed detectors, working as a single detector, were occupied for this study due to the difficulties in working with SNF. The laboratory scale cask (diameter: 0.67 m, height: 1.5 m), minimized by a factor of 10 compared to the actual thickness of a commercial TN-32 cask, was also manufactured. The detector array was designed to rotate the lab-scale cask and obtain 36 image profiles at every 10 degrees. All profiles were aligned in single frame image called a sinogram, and the cross-sectional image was then fabricated by the inverse radon transform algorithm. These experiments have been repeated with different configurations and numbers of sources. Some gamma-ray sources were also measured with neutron sources in order to distinguish between neutron and gamma-ray pulses. Basically, a He-4 detector is designed to run on Linux OS so it is difficult to directly apply to Windows-based equipment widely used in S. Korea. Therefore, a new data acquisition board working on Windows OS was designed and built. The board mainly consists of FPGA (Field Programmable Gate Array) and SoC (System on Chip) for TTL pulse readout, sorting measured data, and transferring data to a user interface. In conclusion, the tomographic system at lab-scale has shown considerable potential to detect a partial or gross defect of encapsulated assemblies in dry storage. Next steps of this study will be to 1) repeatedly carry out experiments to demonstrate scientific reliability and validity, and 2) numerically integrate signals with weight factors to enhance the image quality since the suggested system based on passive interrogation method requires longer measurement time. Finally, the system will apply to a commercial dry storage phased out soon in S. Korea. (authors)

07 ISOTOPE AND RADIATION SOURCES↗
NASA NTRS2008

Radiation Testing, Characterization and Qualification Challenges for Modern Microelectronics and Photonics Devices and Technologies

At GOMAC 2007, we discussed a selection of the challenges for radiation testing of modern semiconductor devices focusing on state-of-the-art memory technologies. This included FLASH non-volatile memories (NVMs) and synchronous dynamic random access memories (SDRAMs). In this presentation, we extend this discussion in device packaging and complexity as well as single event upset (SEU) mechanisms using several technology areas as examples including: system-on-a-chip (SOC) devices and photonic or fiber optic systems. The underlying goal is intended to provoke thought for understanding the limitations and interpretation of radiation testing results.

LaBel, Kenneth A.↗
DOE OSTI2022

Runtime Systems for Energy Efficiency in Advanced Computing Systems

As heterogeneous systems become increasingly popular for both mobile and high-performance computing, conventional efficiency techniques such as dynamic voltage and frequency scaling (DVFS) fail to account for the tightly coupled and varied nature of systems on a chip (SoCs). In this work, we explore the impact of system unaware DVFS techniques on a mobile SoC under three benchmark suites: Chai, Rodinia, and Antutu. We then analyze performance trends across the suites to identify a set of consistent operating points that optimally balance power and performance across the system. The consistent operating points are then constructed into a dependency graph which can be leveraged to produce a more effective, SoC-wide governor.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2021

Hamilton: Flexible, Open Source $10 Wireless Sensor System for Energy Efficient Building Operation

Sensors for improving building performance are rapidly populating the market, driven in part by the drive to reduce greenhouse gas emissions resulting from energy production as well as improve the interior environment for healthy and more productive spaces. UC Berkeley has led wireless sensor development over the past 25 years (e.g., Telos mote), with the Hamilton (named after Alexander Hamilton on the US $10 bill) as the most recent. The Hamilton sensor was designed as a low-cost high-performance sensor that is modular and interoperable. The objective of the Hamilton project was to create, evaluate and establish the technological foundations for secure and easy to deploy building energy efficiency applications utilizing pervasive, low-cost wireless sensors integrated with traditional Building Management Systems (BMS), consumer-sector building components, and powerful data analytics. The project included iterative hardware design, incorporating a high-performance database (BTrDb, http://btrdb.io/), creating and iterating the development of secure data middleware (BOSSwave, WAVE/WAVEMQ), working with and pushing the development of an open-source tiny operating system RiotOS, and implementing and improving protocols such as Thread/OpenThread and TCP/IP. The hardware benefited from careful design to drive down the cost; the design included a System-on-a-Chip (SoC), chip antenna, single crystal and five passive components. Careful design of the operating system created a low-power design to enable a long life with small batteries. The hardware included several sensors: temperature, radiant temperature, relative humidity, magnetometer, accelerometer, and light, with an optional occupancy (Passive InfraRed) sensor. The project was the basis of several applications, both internal to the research team and other researchers and professionals at other institutions. Several applications used the sensor hardware as the basis for other complex devices. Other applications used the sensors to improve building performance through interoperating with the building Heating Ventilation and Air-Conditioning (HVAC) system, such as using occupancy and/or distributed temperature sensing to reduce HVAC zone energy while still providing thermal comfort and to reduce peak loads in small commercial buildings. We demonstrated cloud-based energy analytics, implemented a schedule and a Model Predictive Controller in a small commercial building to optimize HVAC energy, occupancy and electricity price. Initial integration of these technological innovations was performed through the creation of execution containers containing the WAVE agent and various driver, proxy, or building system function logic. The research added to the understanding of efficient sensor hardware, secure middleware, time-series data management (high performance database), efficient communication protocols, and interoperating with applications and building systems. The project showed the technical effectiveness and economic feasibility of creating a low-cost, modular, and easy-to-deploy sensor. Through conversations with multiple end users, the research team discovered that many customers wanted data management and services in addition to the sensors. HamiltonIOT developed packages of sensors, border router, and data services to provide a seamless “plug-and-play” sensor deployment. Some customers were willing to pay for higher quality sensors (such as light); some customers wanted a robust enclosure (waterproof).

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
NASA NTRS2010

NASA Electronic Parts and Packaging (NEPP) Program - Update

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

LaBel, Kenneth A.↗