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NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies.
Jet Propulsion Laboratory (JPL) is currently assessing the use of Ball Grid Arrays (BGAs) for National Aeronautics and Space Administration (NASA) spaceflight applications. This work is being funded through NASA Headquarters, Code Q. The objectives are to demonstrate the robustness, quality and reliability of BGAs technology, and to assist in the development of the repidly growing infastructure for this technology.
The JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Polymer matrix composites are used in high performance structures because of their excellent specific strength, toughness, and stiffness. To realize their full potential, complex composite structures must be assembled with adhesive, but uncertainty in bond performance often requires manufacturers to install bolts or other crack-arrest features to ensure safety in critical applications.1 The inherent uncertainty in adhesive bonds stems from the material discontinuity at the composite-to-adhesive interfaces, which are susceptible to contamination and other causes of inter-facial weakness.2 In contrast, co-cured composites, although limited in size and complexity, result in predictable structures that may be certifiable for commercial aviation with reduced dependence on redundant load paths.1 The technology proposed here uses a stoichiometric offset of the hardener-to-epoxy ratio on the faying surfaces of epoxy compo-site laminates. Assembly of the components in a subsequent “secondary co-cure” process results in a joint with no material discontinuities (Figure 1)
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Reliability of Ball Grid Arrays was assessed as part of a consortium effort led by the Jet Propulsion Laboratory.
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
Assembly jig holds the components for a solar cell module in place as the assembly is soldered and bonded by the even heat of an oven. The jig is designed to the configuration of the planned module. It eliminates uneven thermal conditions caused by hand soldering methods.
Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50(deg)/75(deg)C, -55(deg)/100(deg)C, and -55(deg)/125(deg)C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature da to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
Many initiatives under study by both the space science and earth science communities require large space systems, i.e. with apertures greater than 15 m or dimensions greater than 20 m. This paper reviews the effort in NASA Langley Research Center's Automated Structural Assembly Laboratory which laid the foundations for robotic construction of these systems. In the Automated Structural Assembly Laboratory reliable autonomous assembly and disassembly of an 8 meter planar structure composed of 102 truss elements covered by 12 panels was demonstrated. The paper reviews the hardware and software design philosophy which led to reliable operation during weeks of near continuous testing. Special attention is given to highlight the features enhancing assembly reliability.
A two-level design optimization metholology is described. A progress report of its application to Printed Wiring Board (PWB) assembly examples is given. The design of PWB assemblies is a complex task which is generally conducted as a sequential process. Individual PWBs are usually designed first, followed by the composition of the PWBs into an assembly. As a result, optimizing design considerations such as assembly reliability cannot be accomplished. This study showed that a two-level decomposition method can be employed to optimize for reliability at both the PWB- and the assembly-level in a coupled manner. The two-level decomposition method also resolved the mixed-integer nonlinear programming nature of the problem rather easily.
Diffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Rocket motor components are primarily assembled by adhesion. a) For example, the RSRM (Reusable Solid Rocket Motor - part of the Space Shuttle Boosters) system contains 10,000 sq ft of bondline area. b) Rocket motors contain a variety of adhesive/substrate bond systems c) Bond system performance requirements also vary. To assemble reliable components, ATK Space Systems and customers invest substantial resources to the study of bond assembly processes. a) Surface and adhesion science; b) Adhesive chemistry; c) Process parameters; d) Contamination effects.