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An analysis was made of cost tradeoffs for shaping modified square wafers from cylindrical crystals. Tests were conducted of the effectiveness of texture etching for removal of surface damage on sawed wafers. A single step texturing etch appeared adequate for removal of surface damage on wafers cut with multiple blade reciprocating slurry saws.
Several modifications instituted in the wafer surface preparation process served to significantly reduce the process cost to 1.55 cents per peak watt in 1975 cents. Performance verification tests of a laser scanning system showed a limited capability to detect hidden cracks or defects, but with potential equipment modifications this cost effective system could be rendered suitable for applications. Installation of electroless nickel plating system was completed along with an optimization of the wafer plating process. The solder coating and flux removal process verification test was completed. An optimum temperature range of 500-550 C was found to produce uniform solder coating with the restriction that a modified dipping procedure is utilized. Finally, the construction of the spray-on dopant equipment was completed.
Various top contact metal systems were studied. Only Ti Pd Cu approaches baseline (Ti Pd Ag) quality, but this system shows a lack of long term stability. Aluminum back surface field structures were fabricated and thicknesses of p superscript + material of up to 7.0 microns were achieved with open circuit voltages of 0.59V. A general purpose ultrasonic welder was purchased and tests using various metal foils are under way. During fabrication of the demonstration module, several cells became cracked. Due to redundancy of interconnections, the module was not open circuited but the efficiency was reduced to 8.8%. The broken cell was interconnected with a strap across the back and the efficiency was increased to 11.5%. A cost analysis was made and the results indicate a selling price of $0.56/watt peak (in 1986 with 1975 dollars).
During the program a process sequence was proposed and tested for the fabrication of dendritic welb silicon into solar modules. This sequence was analyzed as to yield and cost and these data suggest that the price goals of 1986 are attainable. Specifically, it was shown that a low cost POCL3 is a suitable replacement for the semiconductor grade, and that a suitable CVD oxide can be deposited from a silane/air mixture using a Silox reactor. A dip coating method was developed for depositing an antireflection coating from a metalorganic precursor. Application of photoresist to define contact grids was made cost effective through use of a dip coating technique. Electroplating of both Ag and Cu was shown feasible and cost effective for producing the conductive metal grids on the solar cells. Laser scribing was used to separate the cells from the dendrites without degradation. Ultrasonic welding methods were shown to be feasible for interconnecting the cells. A study of suitable low cost materials for encapsulation suggest that soda lime glass and phenolic filled board are preferred.
Using silk screened evaporated and sputtered Al as the metal source, the formation of Al back surface fields was studied. The most satisfactory results were those obtained with the sputtered A1 and in which open circuit voltages (V sub oc) of 0.585 v (12 ohm cm FZ silicon) were achieved. The ultrasonic interconnect process is discussed. The process is shown to be satisfactory, but increased pull-strength may be obtained if some form of sintering is carried out on the metallized contacts. Plasma etching is shown to be feasible as a replacement for wet chemical cleaning prior to diffusion. Initial results on cells prepared by using electroless Pd/Ni plus either electroplated Ag or Cu show slightly poor performance than cells with the baseline evaporated Ti/Pd/Ag system. A mask designed for the 1.6 x 7.0 cm and 2.0 x 7.0 cm cells is described. This mask has a lower area coverage and total lower resistive loss than the previous mask design. It is also shown that the cell width should not exceed 2.0 - 3.0 cm for optimum efficiency.
The baseline process sequence using nontextured square wafers was integrated. Difficulties encountered include: (1) replacement of the N-250 spray on diffusion source with PX-10 source; and (2) modification of the firing for printed silver and aluminum contracts is required to accommodate the change of wafer size and shape. Results indicate that the cells processed through the entire process sequence except laser scribe and spray on AR coating indicate the process sequence is feasible. Greater cell conversion efficiency is presented.
The technological readiness of the proposed process sequence was reviewed. Process steps evaluated include: (1) plasma etching to establish a standard surface; (2) forming junctions by diffusion from an N-type polymeric spray-on source; (3) forming a p+ back contact by firing a screen printed aluminum paste; (4) forming screen printed front contacts after cleaning the back aluminum and removing the diffusion oxide; (5) cleaning the junction by a laser scribe operation; (6) forming an antireflection coating by baking a polymeric spray-on film; (7) ultrasonically tin padding the cells; and (8) assembling cell strings into solar circuits using ethylene vinyl acetate as an encapsulant and laminating medium.
Two process specifications supplied by contractors were tested. The aluminum silk screening process resulted in cells comparable to those from sputtered Al. The electroless plating of contacts specification could be used only with extensive modification. Several experiments suggest that there is some degradation of the front junction during the Al back surface field (BSF) fabrication. A revised process sequence was defined which incorporates Al BSF formation. A cost analysis of this process yielded a selling price of $0.75/watt peak in 1980.
Several microwave systems for use in solar cell fabrication were developed and experimentally tested. The first system used a standing wave rectangular waveguide horn applicator. Satisfactory results were achieved with this system for impedance matching and wafer surface heating uniformity. The second system utilized a resonant TM sub 011 mode cylindrical cavity but could not be employed due to its poor energy coupling efficiency. The third and fourth microwave systems utilized a circular waveguide operating in the TM sub 01 and TM sub 11 but had problems with impedance matching, efficiency, and field uniformity.
The process sequence for the fabrication of dendritic web silicon into solar panels was modified to include aluminum back surface field formation. Plasma etching was found to be a feasible technique for pre-diffusion cleaning of the web. Several contacting systems were studied. The total plated Pd-Ni system was not compatible with the process sequence; however, the evaporated TiPd-electroplated Cu system was shown stable under life testing. Ultrasonic bonding parameters were determined for various interconnect and contact metals but the yield of the process was not sufficiently high to use for module fabrication at this time. Over 400 solar cells were fabricated according to the modified sequence. No sub-process incompatibility was seen. These cells were used to fabricate four demonstration modules. A cost analysis of the modified process sequence resulted in a selling price of $0.75/peak watt.
Studies were conducted on several fundamental aspects of electroless nickel/solder metallization for silicon solar cells. A process, which precedes the electroless nickel plating with several steps of palladium plating and heat treatment, was compared directly with single step electroless nickel plating. Work was directed toward answering specific questions concerning the effect of silicon surface oxide on nickel plating, effects of thermal stresses on the metallization, sintering of nickel plated on silicon, and effects of exposure to the plating solution on solar cell characteristics. The process was found to be extremely lengthy and cumbersome, and was also found to produce a product virtually identical to that produced by single step electroless nickel plating, as shown by adhesion tests and electrical characteristics of cells under illumination.
Progress was made on the process sequence for module fabrication. A shift from bonding with a conformal coating to laminating with ethylene vinyl acetate and a glass superstrate is recommended for further module fabrication. The processes that were retained for the selected process sequence, spin-on diffusion, print and fire aluminum p+ back, clean, print and fire silver front contact and apply tin pad to aluminum back, were evaluated for their cost contribution.
Analyses of solar cell and module process steps for throughput rate, cost effectiveness, and reproductibility are reported. In addition to the concentration on cell and module processing sequences, an investigation was made into the capability of using microwave energy in the diffusion, sintering, and thick film firing steps of cell processing. Although the entire process sequence was integrated, the steps are treated individually with test and experimental data, conclusions, and recommendations.
In a robotic assembly project, a method was needed to accurately position a robot and a structure which the robot was to assemble. The requirements for high precision and relatively long travel distances dictated the use of cable drive systems. The design of the mechanisms used in translating the robot and in rotating the assembly under construction is discussed. The design criteria are discussed, and the effect of particular requirements on the design is noted. Finally, the measured performance of the completed mechanism is compared with design requirements.
The development of an expert system for a 'Mechanical Design System' is discussed. Two different implementation approaches are described. One is coded in C, and the other is realized by a software package - 'Exsys.' The first method has the advantage of greater flexibility and quicker responses, while the latter one is easier to develop. This report discusses the feasible ways to establish a real mechanical intelligent design system applying artificial intelligence techniques so that the products designed by this system could best meet the requirements for space assembly.
A new technique is presented for the three dimensional recognition of symmetric objects from range images. Beginning from the implicit representation of quadrics, a set of ten coefficients is determined for symmetric objects like spheres, cones, cylinders, ellipsoids, and parallelepipeds. Instead of using these ten coefficients trying to fit them to smooth surfaces (patches) based on the traditional way of determining curvatures, a new approach based on two dimensional geometry is used. For each symmetric object, a unique set of two dimensional curves is obtained from the various angles at which the object is intersected with a plane. Using the same ten coefficients obtained earlier and based on the discriminant method, each of these curves is classified as a parabola, circle, ellipse, or hyperbola. Each symmetric object is found to possess a unique set of these two dimensional curves whereby it can be differentiated from the others. It is shown that instead of using the three dimensional discriminant which involves evaluation of the rank of its matrix, it is sufficient to use the two dimensional discriminant which only requires three arithmetic operations.
The topics are presented in viewgraph form and include: project development; current system upgrade requirements; and ASAL 1992 objectives.
A proposition to study the effect of filtering processes on range images and to evaluate the performance of two different laser range mappers is made. Median filtering was utilized to remove noise from the range images. First and second order derivatives are then utilized to locate the similarities and dissimilarities between the processed and the original images. Range depth information is converted into spatial coordinates, and a set of coefficients which describe 3-D objects is generated using the algorithm developed in the second phase of this research. Range images of spheres and cylinders are used for experimental purposes. An algorithm was developed to compare the performance of two different laser range mappers based upon the range depth information of surfaces generated by each of the mappers. Furthermore, an approach based on 2-D analytic geometry is also proposed which serves as a basis for the recognition of regular 3-D geometric objects.