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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2001

Development of a Gas-Fed Pulse Detonation Research Engine

In response to the growing need for empirical data on pulse detonation engine performance and operation, NASA Marshall Space Flight Center has developed and placed into operation a low-cost gas-fed pulse detonation research engine. The guiding design strategy was to achieve a simple and flexible research apparatus, which was inexpensive to build and operate. As such, the engine was designed to operate as a heat sink device, and testing was limited to burst-mode operation with run durations of a few seconds. Wherever possible, maximum use was made of standard off-the-shelf industrial or automotive components. The 5-cm diameter primary tube is about 90-cm long and has been outfitted with a multitude of sensor and optical ports. The primary tube is fed by a coaxial injector through an initiator tube, which is inserted directly into the injector head face. Four auxiliary coaxial injectors are also integrated into the injector head assembly. All propellant flow is controlled with industrial solenoid valves. An automotive electronic ignition system was adapted for use, and spark plugs are mounted in both tubes so that a variety of ignition schemes can be examined. A microprocessor-based fiber-optic engine control system was developed to provide precise control over valve and ignition timing. Initial shakedown testing with hydrogen/oxygen mixtures verified the need for Schelkin spirals in both the initiator and primary tubes to ensure rapid development of the detonation wave. Measured pressure wave time-of-flight indicated detonation velocities of 2.4 km/sec and 2.2 km/sec in the initiator and primary tubes, respectively. These values implied a fuel-lean mixture corresponding to an H2 volume fraction near 0.5. The axial distribution for the detonation velocity was found to be essentially constant along the primary tube. Time-resolved thrust profiles were also acquired for both underfilled and overfilled tube conditions. These profiles are consistent with previous time-resolved measurements on single-cycle tubes where the thrust is found to peak as the detonation wave exits the tube, and decay as the tube blows down.

Litchford, Ron J.↗
NASA NTRS2003

Prompt and Precise Prototyping

For Sanders Design International, Inc., of Wilton, New Hampshire, every passing second between the concept and realization of a product is essential to succeed in the rapid prototyping industry where amongst heavy competition, faster time-to-market means more business. To separate itself from its rivals, Sanders Design aligned with NASA's Marshall Space Flight Center to develop what it considers to be the most accurate rapid prototyping machine for fabrication of extremely precise tooling prototypes. The company's Rapid ToolMaker System has revolutionized production of high quality, small-to-medium sized prototype patterns and tooling molds with an exactness that surpasses that of computer numerically-controlled (CNC) machining devices. Created with funding and support from Marshall under a Small Business Innovation Research (SBIR) contract, the Rapid ToolMaker is a dual-use technology with applications in both commercial and military aerospace fields. The advanced technology provides cost savings in the design and manufacturing of automotive, electronic, and medical parts, as well as in other areas of consumer interest, such as jewelry and toys. For aerospace applications, the Rapid ToolMaker enables fabrication of high-quality turbine and compressor blades for jet engines on unmanned air vehicles, aircraft, and missiles.

Source record↗
DOE OSTI2025

Nuclear Materials Packaging, Transportation, and Systems Analysis Group Software Quality Assurance Plan: ANSYS Mechanical Finite Element Analysis Software Version 2023R1

ANSYS Inc. develops and markets engineering simulation software and services used in the aerospace, automotive, manufacturing, electronics, biomedical, energy, defense, and many other industries. ANSYS is dedicated to engineering simulation and is the world’s leading software provider. ANSYS was founded in 1970 and is headquartered in Canonsburg, Pennsylvania. ANSYS provides an engineering analysis tool combining structural, thermal, computational fluid dynamics, acoustic, and electromagnetic simulation capabilities. ANSYS has two main programs, which use the same solvers: (1) Mechanical APDL (ANSYS Design Parametric Language), a Fortran-based coding platform, and (2) ANSYS Workbench, which uses a graphical user interface to aid in finite element analysis implementation. This plan covers both APDL and Workbench. The ANSYS computer program is a large-scale, multipurpose finite element program that can be used to solve several classes of engineering analyses. The analysis capabilities of ANSYS include the ability to solve static and dynamic structural analyses, steady-state and transient heat transfer problems, mode-frequency and buckling eigenvalue problems, static or time-varying magnetic analyses, and various types of field and coupled-field applications. The program contains many special features that allow nonlinearities or secondary effects such as plasticity, large strain, hyperelasticity, creep, swelling, large deflections, contact, stress stiffening, temperature dependency, material anisotropy, and radiation to be included in the solution. As ANSYS has been developed, other special capabilities such as substructuring, submodeling, random vibration, kinetostatics, kinetodynamics, free convection fluid analysis, acoustics, magnetics, piezoelectrics, coupled-field analysis, and design optimization have been added to the program. These capabilities contribute further to making ANSYS a multipurpose analysis tool for varied engineering disciplines. The ANSYS program has been in commercial use for over 50 years and has been used extensively in the aerospace, automotive, construction, electronic, energy services, manufacturing, nuclear, plastics, oil, and steel industries. Additionally, many consulting firms and hundreds of universities have used ANSYS for analysis, research, and educational purposes. ANSYS is recognized worldwide as one of the most widely used and capable programs of its type. Ansys design analysis software is the first created within a quality system with ISO 9001 certification, the internationally accepted quality standard. Product development, testing, maintenance and support processes also meet the United States Nuclear Regulatory Commission's quality requirements, as they have for nearly four decades. The Quality Assurance Service Agreement is suitable for the customers working in the nuclear industry who need to meet specific federal regulations including 10CRF50 Appendix B and provisions of 10CFR21. ANSYS has retained its original International Organization for Standardization (ISO) 9001 accreditation certificate since1995-05-04, It’s current certificate is valid until 2027-05-29.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2022

Bonded Interfaces for High-Temperature Power Electronics

Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 degrees C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Furthermore, thermomechanical modeling plays a key role in understanding the degradation behavior of bonded interface materials and for design optimization of power electronics packages.

ADVANCED PROPULSION SYSTEMS,DIRECT ENERGY CONVERSI↗
DOE OSTI2022

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described.

ADVANCED PROPULSION SYSTEMS↗
NASA NTRS2016

Heavy-Ion Testing of the Freescale Qorivva 32-bit Automotive-Grade MCU

We present single-event effects testing results from a commercially-available automotive microcontroller. We discuss the difficulties encountered testing with commercially-provided evaluation boards while attempting to classify the complex and varied failure modes of a modern 32-bit microcontroller. This work also describes some of the possible advantages to using off-the-shelf automotive-grade electronics for low-risk aerospace applications.

Heavy-Ion Testing↗
NASA NTRSDate not supplied

Evaluation of Automotive Grade Resistors for Space Flight

Over the past decade, electronic, electrical, and electromechanical (EEE) parts for space applications have undergone significant changes, largely driven by CubeSat and commercial space developers pushing the boundaries on the utilization of commercial parts in space. Global product shortages and shipping delays are still impacting space flight project deadlines. Many projects have turned to automotive grade resistors as an alternate to their MILSPEC counterparts to fulfill requirements. In addition, automotive grade resistors may offer designers a wider range of parts to consider. A recent NASA study recommended the use of high-volume manufactured commercial components for space applications provided these components show evidence of stringent fabrication controls and thorough reliability monitoring practices. Automotive grade components have stringent qualification requirements per the Automotive Electronic Council (AEC). However, the end user usually does not have insight into the practices the manufacturer may use to reduce/eliminate infant mortality nor for compliance to all datasheet specifications. Screening, Life and Accelerated Life testing on a set of standard automotive-grade chip resistors is proposed to evaluate the reliability of these components. Requirements from both the AEC-Q (Automotive Electronic Council Qualification) and EEE-INST-002 (Instructions for EEE Parts Selection, Screening, Qualification, and Derating) for resistors is compared and discussed. The resistors have been tested by using a modified methodology from EEEINST-002 to evaluate their reliability for space flight projects. The findings of this study indicate that the underlying degradation mechanisms at rated temperature and power are best represented by power law models with a fitted exponent between 0 and 1. A linear model is more conservative which compensates for potential model uncertainty given the wide range of design and materials used in automotive resistors, while still providing useful long-term resistance drift estimates. No electrical anomalies or failures were observed throughout the 1000-hour Life Tests other than small in tolerance resistance drift aging. Degradation models were utilized to quantify and extrapolate the long-term resistance drift under operating conditions for the components. The models demonstrated that some automotive-grade resistors are likely to operate 10 years at nominal usage conditions while others might fail earlier.

Zainab Abdullahi↗
NASA NTRSDate not supplied

Evaluation of Automotive Grade Resistors for Space Flight

Over the past decade, electronic, electrical, and electromechanical (EEE) parts for space applications have undergone significant changes, largely driven by CubeSat and commercial space developers pushing the boundaries on the utilization of commercial parts in space. Global product shortages and shipping delays are still impacting space flight project deadlines. Many projects have turned to automotive grade resistors as an alternate to their MIL-SPEC counterparts to fulfill requirements. In addition, automotive grade resistors may offer designers a wider range of parts to consider. A recent NASA study recommended the use of high-volume manufactured commercial components for space applications provided these components show evidence of stringent fabrication controls and thorough reliability monitoring practices [1]. Automotive grade components have stringent qualification requirements per the Automotive Electronic Council (AEC). However, the end user usually does not have insight into the practices the manufacturer may use to reduce/eliminate infant mortality nor for compliance to all datasheet specifications. Screening, Life and Accelerated Life testing on a set of standard automotive-grade chip resistors is proposed to evaluate the reliability of these components. Requirements from both the AEC-Q (Automotive Electronic Council Qualification) and EEE-INST-002 (Instructions for EEE Parts Selection, Screening, Qualification, and Derating) for resistors is compared and discussed. The resistors have been tested by using a modified methodology from EEE-INST-002 to evaluate their reliability for space flight projects. The findings of this study indicate that the underlying degradation mechanisms at rated temperature and power are best represented by power law models with a fitted exponent between 0 and 1. A linear model is more conservative which compensates for potential model uncertainty given the wide range of design and materials used in automotive resistors, while still providing useful long-term resistance drift estimates. No electrical anomalies or failures were observed throughout the 1,000-hour Life Tests other than small in tolerance resistance drift aging. Degradation models were utilized to quantify and extrapolate the long-term resistance drift under operating conditions for the components. The models demonstrated that some automotive-grade resistors are likely to operate 10 years at nominal usage conditions while others might fail earlier.

Zainab Abdullahi↗
DOE OSTI2021

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles and is necessary for increasing power density and improving reliability. Replacing traditional silicon devices with more efficient, higher temperature, higher voltage, and higher frequency wide-bandgap (WBG) devices will enable increased power density but will result in higher device heat fluxes. Compact packaging of high-temperature WBG devices near low-temperature-rated components creates thermal management challenges that need to be addressed for future power-dense systems. This paper summarizes the thermal performance of on-road automotive power electronics thermal management systems and provides thermal performance and pumping-power metrics for select vehicles. Thermal analyses reveal that the package/conduction resistance dominates the total thermal resistance (for existing automotive systems). We model advanced packaging concepts and compare the results with existing packaging designs to quantify their thermal performance enhancements. Double-side-cooled configurations that do not use thermal interface materials are package concepts predicted to provide a low junction-to-fluid thermal resistance (compared to current packages). Dielectric-fluid-cooled concepts enable a redesign of the package to reduce the package resistance, can be implemented in single- and two-phase cooling approaches, and allow for cooling of passive components (e.g., capacitors) and bus bars.

33 ADVANCED PROPULSION SYSTEMS↗
NASA NTRS2017

The NASA Electronic Parts and Packaging (NEPP) Program - NASA Items of Interest

This presentation provides a background summary of the NEPP Program, its origins and operating principles followed by examples of issues and opportunities that NEPP is currently pursuing. These examples include Electrostatic Discharge protection procedures that are not being properly applied, one reason for which is the confusion caused by the numerous, different standards covering this topic. Updates are provided for key activities in radiation hardness assurance, and the evaluation of automotive grade electronic parts for use in space applications. Some recent examples of part problems experienced by NASA are briefly described and the latest trending of incidences of counterfeit electronic parts is shown graphically. Finally some forward actions are identified and the time, place and typical topics is provided for the next NEPP Electronic Technology Workshop (ETW).

Electrical Electronic and Electromechanical (EEE)↗
DOE OSTI2021

Thermal Barrier Coatings Overview: Design, Manufacturing, and Applications in High-Temperature Industries

Today’s competitive world economy is creating an indispensable demand for increased efficiency of engineering components that operate in harsh environments (i.e., very high-temperature, corrosive, or neutron irradiation environments), for applications in the energy, automotive, aerospace, electronics, and power industries. Increased research is being done on thermal barrier coatings (TBCs) for protecting such components, since the versatility of manufacturing techniques and the scale of deployment result in increased life, economics, performance, and durability. This review focuses on the advances that led to using TBCs for component life extension and, more recently, as an integral part of advanced component design for high-temperature and other types of harsh environments, such as those found in nuclear-related applications. Furthermore, factors that led to state-of-the-art advanced coating-fabrication techniques [e.g., electron-beam physical vapor deposition (EB-PVD), plasma spray deposition, and electrophoretically deposited TBCs, as well as functionally graded material (FGM) manufacturing] have also been emphasized in current coating R&D. This review explores the current state of TBCs, i.e., the latest advances regarding their fabrication and performance, associated challenges, and recommendations for their future use in aerospace, nuclear, high-temperature, or otherwise harsh environments.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2022

Melt Processing Pretreatment Effects on Enzymatic Depolymerization of Poly(ethylene terephthalate)

Poly(ethylene terephthalate) (PET) is a common thermoplastic material, used in a wide variety of applications (i.e., bottles, fabrics, packaging, electronics, and automotive components). Increasing demand for PET has precipitated a need for improved recycling technology, especially for single-use PET waste. Recently, enzymatic depolymerization has shown promise as an environmentally responsible alternative for PET chemical recycling that yields economically useful products (e.g., terephthalic acid, adipic acid, and ethylene glycol). However, the depolymerization system still suffers from low rates on crystalline PET substrates, and effects of realistic waste streams are not known. In our work, PET waste is pretreated using an ultra-high-speed twin-screw extruder system. PET substrates were modified by various processing pretreatments to allow enzymes better access to depolymerize substrate materials. The effect of varying throughput and mechanical shear on structural properties of the PET waste was analyzed using molecular weight and thermal characterizations. These pretreated samples exhibit modifications in molecular weight, glass transition temperature, crystallinity, and specific surface area. The unpurified leaf-branch compost cutinase enzyme produced from the fed-batch fermentation of Escherichia coli BL21(DE3) was used in enzymatic depolymerization, where a faster reaction was observed as crystallinity was decreased and the specific surface area was increased. The rate of terephthalic acid production was also significantly higher for samples processed at lower mechanical shear with higher throughputs. As a result, this work demonstrates the potential for tailoring pretreatments in pursuit of faster and more energy efficient PET recycling using enzymes, with facile adaptation to the industrial scale for the circular economy.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2024

Reversible two-way tuning of thermal conductivity in an end-linked star-shaped thermoset

Polymeric thermal switches that can reversibly tune and significantly enhance their thermal conductivities are desirable for diverse applications in electronics, aerospace, automotives, and medicine; however, they are rarely achieved. Here, we report a polymer-based thermal switch consisting of an end-linked star-shaped thermoset with two independent thermal conductivity tuning mechanisms—strain and temperature modulation—that rapidly, reversibly, and cyclically modulate thermal conductivity. The end-linked star-shaped thermoset exhibits a strain-modulated thermal conductivity enhancement up to 11.5 at a fixed temperature of 60 °C (increasing from 0.15 to 2.1 W m –1 K –1 ). Additionally, it demonstrates a temperature-modulated thermal conductivity tuning ratio up to 2.3 at a fixed stretch of 2.5 (increasing from 0.17 to 0.39 W m –1 K –1 ). When combined, these two effects collectively enable the end-linked star-shaped thermoset to achieve a thermal conductivity tuning ratio up to 14.2. Moreover, the end-linked star-shaped thermoset demonstrates reversible tuning for over 1000 cycles. The reversible two-way tuning of thermal conductivity is attributed to the synergy of aligned amorphous chains, oriented crystalline domains, and increased crystallinity by elastically deforming the end-linked star-shaped thermoset.

42 ENGINEERING↗
DOE OSTI2024

Multiphysics Co-Optimization Design and Analysis of Double-Side Cooled Silicon Carbide-Based Power Module: Preprint

With the rapid growth of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs), much more rigorous design targets have been set for automotive power electronics, including high power density, high reliability, and low cost. Novel power module and inverter technologies based on wide bandgap (WEG) semiconductors have been developed to meet these design targets, while providing optimal power semiconductor operating temperature and promising thermomechanical performance. Compared with conventional cooling techniques which are normally applied only on one side of power module, double-side cooling approach is now believed to be the solution to enable high power density and low thermal resistance of WEG semiconductor-based power electronics. In this work, we develop a three-phase power module that is double-sided cooled using dielectric fluid jet impingement. In each phase, four silicon carbide (SiC) power semiconductors are bonded to copper busbars without electrical insulation layers. A finite element analysis (FEA) model is created for thermal and thermomechanical analysis. Based on FEA modeling results, we select particular dimensions for a parametric study to optimize thermal and mechanical performance. Using a multi-objective genetic algorithm (MOGA)-based optimization method, we have minimized the maximum junction temperature and thermal stresses within the power module. The multiphysics co-optimization approach has enabled an efficient design process of power modules with greatly reduced computational cost, as compared to conventional processes that rely on exhaustive numerical simulations and iterations.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2024

Software Quality Assurance Plan ANSYS LSDYNA Version 2023R1

ANSYS Inc. develops and markets engineering simulation software and services used in the aerospace, automotive, manufacturing, electronics, biomedical, energy, defense, and many other industries. ANSYS is dedicated to engineering simulation and is the world’s leading software provider. ANSYS was founded in 1970 and is headquartered in Canonsburg, Pennsylvania. ANSYS provides an engineering analysis tool combining structural, thermal, computational fluid dynamics, acoustic and electromagnetic simulation capabilities. ANSYS LS-DYNA is the most used explicit simulation program capable of simulating the response of materials to short periods of severe loading. Its many elements, contact formulations, material models, and other controls can be used to simulate complex models with control over all the details of the problem. ANSYS LS-DYNA has a vast array of capabilities to simulate extreme deformation problems using its explicit solver. Engineers can tackle simulations involving material failure and look at how the failure progresses through a part or through a system. Models with large amounts of parts or surfaces interacting with each other are also easily handled, and the interactions and load passing between complex behaviors are modeled accurately. Using computers with higher numbers of CPU cores can drastically reduce solution times. In addition, many consulting firms and hundreds of universities use ANSYS for analysis, research, and educational purposes. ANSYS is recognized worldwide as one of the most widely used and capable programs of its type. ANSYS has successfully passed over 100 customer quality system audits against American Society of Mechanical Engineers (ASME) NQA-1 and 10 CFR Part 50, Appendix B, since the company was founded, over 60 of which have been since 1997. ANSYS has successfully passed over 100 International Organization for Standardization (ISO) 9001 assessments. ANSYS design analysis software is the first created within a quality system with ISO 9001 certification, which is the internationally accepted quality standard. Product development, testing, maintenance, and support processes also meet the US Nuclear Regulatory Commission’s (NRC’s) quality requirements, as they have for nearly four decades. ANSYS staff perform more than 60,000 software verification tests before releasing each new product. ASME NQA-1-2012 (Subpart 2.7 is specific to software) is the industry- and NRC-accepted approach (consensus standard) for meeting 10 CFR Part 50, Appendix B, requirements.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2026

2025 InterPACK: Thermal Management and Reliability Aspects

The presentation will provide an overview of automotive power electronics and electric machines thermal management systems that are typical for light-duty vehicles. Unique thermal and environmental aspects related to medium and heavy-duty vehicle applications will then be discussed. Finally, advanced thermal management and packaging technologies that could be evaluated and used in this project will be described.

33 ADVANCED PROPULSION SYSTEMS↗