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The mechanical and thermal design of an integrated focal plane subsystem of a Multispectral Linear Array (MLA) instrument is discussed in terms of focal-plane alignment, thermoelastic performance, and thermal requirements. The modular construction and thermal control of the focal plane array are discussed.
The process of aligning an instrument focal plane toprecursor optics such as a telescope can be a difficult and timeconsuming process. The final alignment must achieve sufficientperformance at multiple locations across the field of view. Inthe case of instruments with infinite conjugates, such as a spacetelescope, there are practical challenges in illuminating the system at multiple off-axis field points simultaneously. Iterationduring the alignment process can cause a lengthy search for localminima within the performance cost function.This paper presents a focal plane alignment methodology thatavoids the above difficulties and obtains the desired level ofoptical performance in an efficient manner. The approach isbased on systematically measuring spot size across a set of fieldpoints and defocus positions, and then using a least squaresfit to determine the optimal location for the focal plane. Thisapproach has the additional benefit of revealing the amount offield curvature present in the instrument. It also provides theanalyst with a direct calculation of the shims needed to place thefocal plane at the computed best-fit location.This approach was successfully applied to the Arcsecond SpaceTelescope Enabling Research In Astrophysics (ASTERIA) payload. ASTERIA is a cubesat mission that was deployed intolow-Earth orbit in November 2017 and operated until December2019. In addition to presenting the theoretical basis for themethodology, this paper will present laboratory measurementsobtained during the payload alignment campaign. This approach is applicable to future space-borne optical instrumentsthat require an efficient methodology for focal plane alignmentwith limited cost or schedule resources.
We have exploited the artificial atomlike properties of epitaxially self-assembled quantum dots for the development of high operating temperature long wavelength infrared (LWIR) focal plane arrays. Quantum dots are nanometer-scale islands that form spontaneously on a semiconductor substrate due to lattice mismatch. QDIPs are expected to outperform quantum well infrared detectors (QWIPs) and are expected to offer significant advantages over II-VI material based focal plane arrays. QDIPs are fabricated using robust wide bandgap III-V materials which are well suited to the production of highly uniform LWIR arrays. We have used molecular beam epitaxy (MBE) technology to grow multi-layer LWIR quantum dot structures based on the InAs/InGaAs/GaAs material system. JPL is building on its significant QWIP experience and is basically building a Dot-in-the-Well (DWELL) device design by embedding InAs quantum dots in a QWIP structure. This hybrid quantum dot/quantum well device offers additional control in wavelength tuning via control of dot-size and/or quantum well sizes. In addition the quantum wells can trap electrons and aide in ground state refilling. Recent measurements have shown a 10 times higher photoconductive gain than the typical QWIP device, which indirectly confirms the lower relaxation rate of excited electrons (photon bottleneck) in QDPs. Subsequent material and device improvements have demonstrated an absorption quantum efficiency (QE) of approx. 3%. Dot-in-the-well (DWELL) QDIPs were also experimentally shown to absorb both 45 deg. and normally incident light. Thus we have employed a reflection grating structure to further enhance the quantum efficiency. JPL has demonstrated wavelength control by progressively growing material and fabricating devices structures that have continuously increased in LWIR response. The most recent devices exhibit peak responsivity out to 8.1 microns. Peak detectivity of the 8.1 micrometer devices has reached approx. 1 x 10(exp 10) Jones at 77 K. Furthermore, we have fabricated the first long-wavelength 640x512 pixels QDP focal plane array. This QDIP focal plane may has produced excellent infrared imagery with noise equivalent temperature difference of 40 mK at 60K operating temperature. In addition, we have managed to increase the quantum efficiency of these devices from 0.1% (according to the data published in literature) to 20% in discrete devices. This is a factor of 200 increase in quantum efficiency. With these excellent results, for the first time QDIP performance has surpassed the QWIP performance. Our goal is to operate these long-wavelength detectors at much higher operating temperature than 77K which can be passively achieved in space. This will be a huge leap in high performance infrared detectors specifically applicable to space science instruments.
Mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 1024 x 1024 pixel quantum well infrared photodetector (QWIP) focal planes have been demonstrated with excellent imaging performance. The MWIR QWIP detector array has demonstrated a noise equivalent differential temperature (NEDT) of 17 mK at a 95 K operating temperature with f/2.5 optics at 300 K background and the LWIR detector array has demonstrated a NEDT of 13 mK at a 70 K operating temperature with the same optical and background conditions as the MWIR detector array after the subtraction of system noise. Both MWIR and LWIR focal planes have shown background limited performance (BLIP) at 90 K and 70 K operating temperatures respectively, with similar optical and background conditions. In addition, we have demonstrated MWIR and LWIR pixel co-registered simultaneously readable dualband QWIP focal plane arrays. In this paper, we will discuss the performance in terms of quantum efficiency, NEDT, uniformity, operability, and modulation transfer functions of the 1024 x 1024 pixel arrays and the progress of dualband QWIP focal plane array development work.
A description is provided of a sensor chip array for a unified multispectral focal plane for the Multispectral Linear Array (MLA) instrument. The involved concept of sensing multispectral earth resources imagery through the use of spectral filters deposited directly on a single row of silicon charge-coupled device (CCD) chips has been considered for a number of years. A simplified focal plane was designed after a number of experiments. Technology considerations regarding the design of the multispectral focal plane are discussed. Experimental data are presented which show that the arising problems have been or can be solved.
A multiwavelength focal plane array infrared detector is included on a common substrate having formed on its top face a plurality of In.sub.x Ga.sub.1-x As (x.ltoreq.0.53) absorption layers, between each pair of which a plurality of InAs.sub.y P.sub.1-y (y<1) buffer layers are formed having substantially increasing lattice parameters, respectively, relative to said substrate, for preventing lattice mismatch dislocations from propagating through successive ones of the absorption layers of decreasing bandgap relative to said substrate, whereby a plurality of detectors for detecting different wavelengths of light for a given pixel are provided by removing material above given areas of successive ones of the absorption layers, which areas are doped to form a pn junction with the surrounding unexposed portions of associated absorption layers, respectively, with metal contacts being formed on a portion of each of the exposed areas, and on the bottom of the substrate for facilitating electrical connections thereto.
This final report summarizes the results and accuracies of the Spitzer Space Telescope focal plane survey. Accuracies achieved are compared to the focal plane survey calibration requirements put forth in the SIRTF IOC-SV Mission Plan [14] and pre-flight predictions made in [2]. The results of this focal plane survey are presently being used to support in-flight precision pointing, precision incremental offsets, IRS peakup array calibration, and ground pointing reconstruction...
A unique and versatile vacuum chamber has been designed for JPL's IR Focal Plane Technology Group. This chamber is equipped with multiple ports for cryogen and electrical vacuum feedthroughs, pumping units, vacuum gages, sources, and detector camera heads. The design incorporates a liquid-nitrogen-cooled optical table and radiation shield for low-background IR detector testing. Focal planes can be tested at temperatures ranging from 300 K to that of liquid helium. This paper describes the design and construction of this low-background IR focal plane test chamber and discusses some of its distinctive features. An analysis of the test chamber's performance is also presented.
This work presents focal plane modules for a Radiation Budget Instrument, a passive remote-sensing instrument that follows the legacy of the Clouds and Earth’s Radiant Energy System (CERES) to measure short and longwave Earth’s radiation budget. The focal plane arrays are micromachined at JPL (Jet Propulsion Laboratory) and integrated into sub-assembly modules to be mounted on the optical telescope of the instrument.
Far infrared transmissive fiber optics as a component in the design of integrated far infrared focal plane array utilization is discussed. A tightly packed bundle of fibers is placed at the focal plane, where an array of infrared detectors would normally reside, and then fanned out in two or three dimensions to individual detectors. Subsequently, the detectors are multiplexed by cryogenic electronics for relay of the data. A second possible application is frequency up-conversion (v sub 1 + v sub 2 = v sub 3), which takes advantage of the nonlinear optical index of refraction of certain infrared transmissive materials in fiber form. Again, a fiber bundle is utilized as above, but now a laser of frequency v sub 1 is mixed with the incoming radiation of frequency v sub 1 within the nonlinear fiber material. The sum, v sub 2 is then detected by near infrared or visible detectors which are more sensitive than those available at v sub 2. Due to the geometrical size limitations of detectors such as photomultipliers, the focal plane dispersal technique is advantageous for imaging up-conversion.
We develop superconducting transition-edge sensor (TES) microcalorimeter focal planes for versatility in meeting the specifications of X-ray imaging spectrometers, including high count rate, high energy resolution, and large field of view. In particular, a focal plane composed of two subarrays: one of fine pitch, high count-rate devices and the other of slower, larger pixels with similar energy resolution, offers promise for the next generation of astrophysics instruments, such as the X-ray Integral Field Unit Instrument on the European Space Agencys ATHENA mission. We have based the subarrays of our current design on successful pixel designs that have been demonstrated separately. Pixels with an all-gold X-ray absorber on 50 and 75 micron pitch, where the Mo/Au TES sits atop a thick metal heatsinking layer, have shown high resolution and can accommodate high count rates. The demonstrated larger pixels use a silicon nitride membrane for thermal isolation, thinner Au, and an added bismuth layer in a 250-sq micron absorber. To tune the parameters of each subarray requires merging the fabrication processes of the two detector types. We present the fabrication process for dual production of different X-ray absorbers on the same substrate, thick Au on the small pixels and thinner Au with a Bi capping layer on the larger pixels to tune their heat capacities. The process requires multiple electroplating and etching steps, but the absorbers are defined in a single-ion milling step. We demonstrate methods for integrating the heatsinking of the two types of pixel into the same focal plane consistent with the requirements for each subarray, including the limiting of thermal crosstalk. We also discuss fabrication process modifications for tuning the intrinsic transition temperature (T(sub c)) of the bilayers for the different device types through variation of the bilayer thicknesses. The latest results on these 'hybrid' arrays will be presented.
The Cryogenic Limb Array Etalon Spectrometer for the NASA Upper Atmospheric Research Satellite uses solid-state focal plane arrays to detect emission from the earth's atmosphere over the IR wavelength range 3.5 to 13 microns. This paper discusses the design of the focal plane detector assembly and compares calculated performance with measurements. Measurements were made of focal plane noise and responsivity as functions of frequency (2 to 500 Hz) and temperature (12 to 19 K), pixel-to-pixel and across-array crosstalk, and linearity over a dynamic range of 100,000. The measurements demonstrate that the arrays satisfy the science requirements, and that, in general, there is reasonable agreement between the measurements and the analytical model.
Electro-optical testing and characterization of the Vera C. Rubin Observatory Legacy Survey of Space and Time (LSST) Camera focal plane, consisting of 205 charge-coupled devices (CCDs) arranged into 21 stand-alone Raft Tower Modules (RTMs) and 4 Corner Raft Tower Modules (CRTMs), is currently being performed at the SLAC National Accelerator Laboratory. Testing of the camera sensors is performed using a set of custom-built optical projectors, designed to illuminate the full focal plane or specific regions of the focal plane with a series of light illumination patterns: the crosstalk projector, the flat illuminator projector, and the spot grid projector. In addition to measurements of crosstalk, linearity and full well, the ability to project realistically-sized sources, using the spot grid projector, makes possible unique measurements of instrumental signatures such as deferred charge distortions, astrometric shifts due to sensor effects, and the brighter-fatter effect, prior to camera first light. Here we present the optical projector designs and usage, the electro-optical measurements and how these results have been used in testing and improving the LSST Camera instrumental signature removal algorithms.
The design of a 128x128 staring short wave infrared (SWIR) HgCdTe focal plane incorporating charge integrating transimpedance input preamplifiers is presented. The preamplifiers improve device linearity and uniformity, and provide signal gain ahead of the miltiplexer and readout circuitry. Detector's with cutoff wavelength of 2.5 microns and operated at 80 K have demonstrated impedances in excess of 10(exp 16) ohms with 60 percent quantum efficiency. Focal plane performance using a smaller format device is presented which demonstrates the potential of this approach. Although the design is capable of achieving less than 30 rms electrons with todays technology, initial small format devices demonstrated a read noise of 100 rms electrons and were limited by the atypical high noise performance of the silicon process run. Luminescence from the active silicon circuitry in the multiplexer limits the minimum detector current to a few hundred electrons per second. Approaches to eliminate this excessive source of current is presented which should allow the focal plane to achieve detector background limited performance.
GaAs based Quantum Well Infrared Photodetector (QWIP) technology has shown remarkable success in advancing low cost, highly uniform, high-operability, large format multi-color focal plane arrays. QWIPs afford greater flexibility than the usual extrinsically doped semiconductor IR detectors. The wavelength of the peak response and cutoff can be continuously tailored over a range wide enough to enable light detection at any wavelength range between 6 and 20 micron. The spectral band-width of these detectors can be tuned from narrow (Deltalambda/lambda is approximately 10%) to wide (Deltalambda/lambda is approximately 40%) allowing various applications. Furthermore, QWIPs offer low cost per pixel and highly uniform large format focal plane arrays due to mature GaAs/AlGaAs growth and processing technologies. The other advantages of GaAs/AlGaAs based QWIPS are higher yield, lower l/f noise and radiation hardness (1.5 Mrad). In this presentation, we will discuss our recent demonstrations of 640x512 pixel narrow-band, broad-band, multi-band focal plane arrays, and the current status of the development of 1024x1024 pixel long-wavelength infrared QWIP focal plane arrays.
A mid-wavelength 1024x1024 pixel quantum well infrared photodetector (QW) focal plane array has been demonstrated with excellent imagery. Noise equivalent differential temperature (NETD) of 19 mK was achieved at 95K operating temperature with f/2.5 optics at 300K background. This focal plane array has shown background limited performance (BLIP) at 90K operating temperature with the same optics and background conditions. In this paper, we will discuss its performance in quantum efficiency, NETD, uniformity, and operability.
Mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) 1024x1024 pixel InGaAs/GaAs/AlGaAs based quantum well infrared photodetector (QWIP) focal planes and a 320x256 pixel dual-band pixel co-registered simultaneous QWIP focal plane array have been demonstrated as pathfinders. In this paper, we discuss the development of 1024x1024 MWIR/LWIR dual-band pixel co-registered simultaneous QWIP focal plane array.
A paper describes the Thermal Infrared Sensor (TIRS), a QWIP-based instrument intended to supplement the Operational Land Imager (OLI) for the Landsat Data Continuity Mission (LDCM). The TIRS instrument is a far-infrared imager operating in the pushbroom mode with two IR channels: 10.8 and 12 microns. The focal plane will contain three 640x512 QWIP arrays mounted on a silicon substrate. The silicon substrate is a custom-fabricated carrier board with a single layer of aluminum interconnects. The general fabrication process starts with a 4-in. (approx.10-cm) diameter silicon wafer. The wafer is oxidized, a single substrate contact is etched, and aluminum is deposited, patterned, and alloyed. This technology development is aimed at incorporating three large-format infrared detecting arrays based on GaAs QWIP technology onto a common focal plane with precision alignment of all three arrays. This focal plane must survive the rigors of flight qualification and operate at a temperature of 43 K (-230 C) for five years while orbiting the Earth. The challenges presented include ensuring thermal compatibility among all the components, designing and building a compact, somewhat modular system and ensuring alignment to very tight levels. The multi-array focal plane integrated onto a single silicon substrate is a new application of both QWIP array development and silicon wafer scale integration. The Invar-based assembly has been tested to ensure thermal reliability.