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NASA NTRS1988

Damage initiation and growth in fiber-reinforced MMCs

On the basis of the simplifying assumption of equivalent constituent strain rates in the absence of damage, a strain-based failure criterion can be applied to the phenomena of damage-initiation and growth in fiber-reinforced MMCs to ascertain when and where the initial damage will occur. The failure modes fall into four categories, depending on the relative fatigue behavior of the reinforcing fibers and their matrix. Attention is given to experimental results illustrating current understanding of fiber-dominated damage, self-similar fatigue damage growth, and fiber/matrix interface failures, for such MMCs as B/Al alloy, SiC/Al alloy, and SiC/Ti-15-3 alloy.

Saff, C. R.↗

NASA NTRS1973

Basic failure mechanisms in advanced composites

The fundamental failure mechanisms which result from the interaction of thermal cycling and mechanical loading of carbon-epoxy composites were studied. This work was confined to epoxy resin uniderictionally reinforced with HTS carbon fibers, and consists of first identifying local fiber, matrix and interface failure mechanisms using the model composite specimen containing a small number of fibers so that optical techniques can be used for characterization. After the local fracture process has been established for both mechanical loading and thermal cycling, engineering composite properties and gross fracture modes are then examined to determine how the local events contribute to real composite performance. Flexural strength in high fiber content specimens shows an increase in strength with increased thermal cycling. Similar behavior is noted for 25 v/o material up to 200 cycles; however, there is a drastic reduction after 200 cycles indicating a major loss of integrity probably through the accumulation of local cleavage cracks in the tensile region.

Mazzio, V. F.↗

NASA NTRS1989

Metal matrix composites: Testing, analysis, and failure modes; Proceedings of the Symposium, Sparks, NV, Apr. 25, 26, 1988

The present conference discusses the tension and compression testing of MMCs, the measurement of advanced composites' thermal expansion, plasticity theory for fiber-reinforced composites, a deformation analysis of boron/aluminum specimens by moire interferometry, strength prediction methods for MMCs, and the analysis of notched MMCs under tensile loading. Also discussed are techniques for the mechanical and thermal testing of Ti3Al/SCS-6 MMCs, damage initiation and growth in fiber-reinforced MMCs, the shear testing of MMCs, the crack growth and fracture of continuous fiber-reinforced MMCs in view of analytical and experimental results, and MMC fiber-matrix interface failures.

Johnson, W. S.↗

DOE OSTI2023

Predicting encapsulant delamination in photovoltaic modules bridging photochemical reaction kinetics and fracture mechanics

Abstract Photovoltaic (PV) modules are subjected to environmental stressors (UV exposure, temperature, and humidity) that cause degradation within the encapsulant and its interfaces with adjacent glass and cell substrates. To save experimental time and to enable long‐term assessment with intensive degradation only taking place after many years, the development of predictive models is indispensable. Previous works have modeled the delamination of the ethylene vinyl acetate (EVA) encapsulant/glass and encapsulant/cell interfaces under field aging conditions with fundamental photochemical degradation reactions that lead to molecular scission and loss of interfacial adhesion, characterized by the fracture resistance, G c . However, these models were fundamentally limited in that the following aspects were not incorporated: (i) molecular crosslinking in the field, (ii) synergistic autocatalytic interactions of degradation mechanisms, (iii) connection between degraded encapsulant structure and its mechanical properties, and (iv) rigorous treatment of the plasticity contribution to G c with finite element models. Here, we present a time‐dependent multiscale model that addresses these limitations and is applicable to a wide range of encapsulants and interfaces. For the reference EVA encapsulant and its interfaces with the glass and cell, the presented model predicts an initial rise in G c in the first 3 years of field aging from crosslinking, then a subsequent sharp decline from degradation mechanisms. We used nanoindentation to measure the changes in EVA mechanical properties over exposure time to tune the model parameters. The model predictions of G c and mechanical properties match with experimental data and show an improvement compared to previous models. The model can even predict switches in failure interfaces, such as the observed EVA/cell to EVA/glass transition. We also conducted a sensitivity analysis study by varying the degradation and crosslinking kinetic parameters to demonstrate their effects on G c . Model extensions to polyolefin elastomer‐ and silicone‐encapsulants and their interfaces are also demonstrated.

Liu, Kuan↗

DOE OSTI2016

Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO 2 and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m -1 . Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Finally, thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).

36 MATERIALS SCIENCE↗

NASA NTRS1975

High reliability bond program using small diameter aluminum wire

The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

Macha, M.↗

NASA NTRS1979

Effects of isothermal and cyclic exposures on interface structure and mechanical properties of FPalpha-Al2O3/aluminum composites

The microstructural and interface stability of FPalpha-Al203/Al-Li composites are investigated as a function of isothermal exposure at 500 C or thermal cycling between 140 and 500 C with hold time at Tmax. Interfacial morphology, growth kinetics, crystal structure, and composition of interfacial reaction products are characterized. Strength is monitored in the transverse orientation, and fracture mechanics is analyzed in terms of interface reaction products. The interfacial reaction product in FP/Al is Li2O.5Al2O3. Significant fiber-matrix reaction occurs during fabrication. The number of thermal cycles rather than total time at Tmax is the determining factor in strength degradation, thermal cycling giving rise to voids at the fiber-matrix interface. Extensive interface failures occur at composite fracture stresses below about 128 MPa; above this stress level failure is attributed to ductile matrix fracture.

Kim, W. M.↗

NASA NTRS1989

Effects of aging condition on the fracture toughness of 2XXX and 7XXX series aluminum alloy composites

Results are presented on the effects of matrix aging condition (i.e., matrix temper) on the fracture toughness of 2XXX and 7XXX Al matrix alloys reinforced with SiC particulates, and the results are compared with the mechanical behavior. Fracture toughness testing was conducted on fatigue precracked bend specimens, and fracture surfaces were examined using SEM. Results revealed dramatic differences in the effect of matrix microstructure on the fracture properties of the two composite series. In the 7XXX material, the toughness values decreased from the underaged (UA) condition to the overaged (OA) condition by approximately 40 percent, while in the 2XXX series composite, the effect of matrix microstructure was marginal. In the 7XXX series composites, a transition in fracture mode from particle cracking (in UA) to matrix and linear-interface failure (in OA) was observed, while the 2XXX series composite failed predominantly by particle cracking.

Manoharan, M.↗

NASA NTRS1990

Matrix fatigue crack development in a notched continuous fiber SCS-6/Ti-15-3 composite

In this study the extensive matrix fatigue cracking that has been observed in notched SCS-6/Ti-15-3 composites is investigated. Away from the notch a uniform spacing of the fatigue cracks develops. Closer to the notch, fiber-matrix debonding which occurs increases the crack spacing. Crack spacing and debond length determined from shear-lag cylinder models compare favorably with experimental observations. Scanning electron microscope (SEM) fractography showed that the principal fatigue crack initiation occurred around the zero degree fibers. Interface failure in the 90 degree plies does not lead to the development of the primary fatigue cracking.

Hillberry, B. M.↗

NASA NTRS1990

Mechanical characterization of unnotched SCS6/Ti-15-3 metal matrix composites at room temperature

The Ti-15-3 metal matrix composites containing silicon-carbide (SCS6) fibers, in five different lay-ups, have been tested at room temperature to determine static strengths and mechanical properties. Experimental data and predicted values of the laminate properties and strengths showed good correlation. The off-axis laminate plies (that is, 90 and 45 deg) suffered fiber/matrix interface failures at stress levels as low as 20 ksi, thus significantly affecting the mechanical properties of the laminate. Edge replicas were used to verify the fiber/matrix separations. Microscopic examinations determined that the fiber/matrix failures were occurring in the titanium/silicon reaction layer. Fatigue tests were performed on unnotched specimens to determine the number of cycles to failure versus cyclic stress level. It was found that the stress in the 0 deg fiber could be used to correlate the fatigue life of different laminates containing 0 deg plies.

Johnson, W. S.↗

NASA NTRS1992

Stress-strain analysis of a (0/90)sub 2 symmetric titanium matrix laminate subjected to a generic hypersonic flight profile

Cross ply laminate behavior of Ti-15V-3Cr-3Al-3Sn (Ti-15-3) matrix reinforced with continuous silicon carbide fibers (SCS-6) subjected to a generic hypersonic flight profile was evaluated experimentally and analytically. Thermomechanical fatigue test techniques were developed to conduct a simulation of a generic hypersonic flight profile. A micromechanical analysis was used. The analysis predicts the stress-strain response of the laminate and of the constituents in each ply during thermal and mechanical cycling by using only constituent properties as input. The fiber was modeled using a thermo-viscoplastic constitutive relation. The fiber transverse modulus was reduced in the analysis to simulate the fiber matrix interface failure. Excellent correlation was found between measured and predicted laminate stress-strain response due to generic hypersonic flight profile when fiber debonding was modeled.

Mirdamadi, Massoud↗

NASA NTRS1990

Interfacial shear behavior of sapphire-reinforced NiAl composites

The interfacial shear behavior in near-equiatomic NiAl reinforced by sapphire filaments has been examined at room temperature using a fiber pushout test technique. The load-displacement data indicate a large variability in the initial interface failure stress, although reverse push behavior indicates a comparatively constant interfacial sliding friction stress. The observed behavior suggests that the presence of asperities on the fiber surfaces and nonuniformities in fiber diameter require constrained plastic flow within the NiAl matrix in order for interfacial shear to occur. The location, shape, severity, and distribution of fiber asperities as well as the uniformity of fiber diameter are critical to the interfacial shear process.

Moose, C. A.↗

NASA NTRS1990

Matrix fatigue crack development in a notched continuous fiber SCS-6/Ti-15-3 composite

In this study the extensive matrix fatigue cracking that has been observed in notched SCS-6/Ti-15-3 composites is investigated. Away from the notch uniform spacing of the fatigue cracks develops. Closer to the notch, fiber-matrix debonding which occurs increases the crack spacing. Crack spacing and debond length determined from shear-lag cylinder models compare favorably with experimental observations. Scanning electron microscope (SEM) fractography showed that the principal fatigue crack initiation occurred around the zero degree fibers. Interface failure in the 90 degree plies does not lead to the development of the primary fatigue cracking.

Hillberry, B. M.↗

NASA NTRS1993

Fiber pushout and interfacial shear in metal-matrix composites

Recent thin-slice pushout tests have suggested that MMC matrix-fiber interface failure processes depend not only on such intrinsic factors as bond strength and toughness, and matrix plasticity, but such extrinsic factors as specimen configuration, thermally-induced residual stresses, and the mechanics associated with a given test. After detailing the contrasts in fiber-pullout and fiber-pushout mechanics, attention is given to selected aspects of thin-slice fiber pushout behavior illustrative of the physical nature of interfacial shear response and its dependence on both intrinsic and extrinsic factors.

Koss, Donald A.↗

NASA NTRS1994

Prediction of stress-strain response of SCS-6/Timetal-21S subjected to a hypersonic flight profile

Thermomechanical response of a cross-ply SCS-6/Timetal-21S composite subjected to a generic hypersonic flight profile with the temperature ranging from -130 C to 816 C was evaluated experimentally and analytically. A two dimensional micromechanical anlaysis, VISCOPLY, was used to predict the stress-strain response of the laminate and of the constituents in each ply during thermomechanical loading conditions. In the analysis, the fiber was modeled as elastic with transverse orthotropic and temperature dependent properties and the matrix was modeled using a thermoviscoplastic constitutive relation. The fiber transverse modulus was reduced in the analysis to simulate fiber-matrix interface failure. Reasonable agreement was found between measured and predicted laminate stress-strain response when fiber-matrix debonding was modeled.

Mirdamadi, Massoud↗

NASA NTRS1994

Prediction of thermal and mechanical stress-strain responses of TMC's subjected to complex TMF histories

This paper presents an experimental and analytical evaluation of cross-plied laminates of Ti-15V-3Cr-3Al-3Sn (Ti-15-3) matrix reinforced with continuous silicon-carbide fibers (SCS-6) subjected to a complex TMF loading profile. Thermomechanical fatigue test techniques were developed to conduct a simulation of a generic hypersonic flight profile. A micromechanical analysis was used. The analysis predicts the stress-strain response of the laminate and of the constituents in each ply during thermal and mechanical cycling by using only constituent properties as input. The fiber was modeled as elastic with transverse orthotropic and temperature-dependent properties. The matrix was modeled using a thermoviscoplastic constitutive relation. The fiber transverse modulus was reduced in the analysis to simulate the fiber-matrix interface failures. Excellent correlation was found between measured and predicted laminate stress-strain response due to generic hypersonic flight profile when fiber debonding was modeled.

Johnson, W. S.↗

NASA NTRS1994

ASTM and VAMAS activities in titanium matrix composites test methods development

Titanium matrix composites (TMC's) are being considered for a number of aerospace applications ranging from high performance engine components to airframe structures in areas that require high stiffness to weight ratios at temperatures up to 400 C. TMC's exhibit unique mechanical behavior due to fiber-matrix interface failures, matrix cracks bridged by fibers, thermo-viscoplastic behavior of the matrix at elevated temperatures, and the development of significant thermal residual stresses in the composite due to fabrication. Standard testing methodology must be developed to reflect the uniqueness of this type of material systems. The purpose of this paper is to review the current activities in ASTM and Versailles Project on Advanced Materials and Standards (VAMAS) that are directed toward the development of standard test methodology for titanium matrix composites.

Johnson, W. S.↗

NASA NTRS1995

Time-dependent deformation of titanium metal matrix composites

A three-dimensional finite element program called VISCOPAC was developed and used to conduct a micromechanics analysis of titanium metal matrix composites. The VISCOPAC program uses a modified Eisenberg-Yen thermo-viscoplastic constitutive model to predict matrix behavior under thermomechanical fatigue loading. The analysis incorporated temperature-dependent elastic properties in the fiber and temperature-dependent viscoplastic properties in the matrix. The material model was described and the necessary material constants were determined experimentally. Fiber-matrix interfacial behavior was analyzed using a discrete fiber-matrix model. The thermal residual stresses due to the fabrication cycle were predicted with a failed interface, The failed interface resulted in lower thermal residual stresses in the matrix and fiber. Stresses due to a uniform transverse load were calculated at two temperatures, room temperature and an elevated temperature of 650 C. At both temperatures, a large stress concentration was calculated when the interface had failed. The results indicate the importance of accuracy accounting for fiber-matrix interface failure and the need for a micromechanics-based analytical technique to understand and predict the behavior of titanium metal matrix composites.

Bigelow, C. A.↗