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At least 37 records · Page 2

Space shuttle/food system. Volume 2, Appendix C: Food cooling techniques analysis. Appendix D: Package and stowage: Alternate concepts analysis

The relative penalties associated with various techniques for providing an onboard cold environment for storage of perishable food items, and for the development of packaging and vehicle stowage parameters were investigated in terms of the overall food system design analysis of space shuttle. The degrees of capability for maintaining both a 40 F to 45 F refrigerated temperature and a 0 F and 20 F frozen environment were assessed for the following cooling techniques: (1) phase change (heat sink) concept; (2) thermoelectric concept; (3) vapor cycle concept; and (4) expendable ammonia concept. The parameters considered in the analysis were weight, volume, and spacecraft power restrictions. Data were also produced for packaging and vehicle stowage parameters which are compatible with vehicle weight and volume specifications. Certain assumptions were made for food packaging sizes based on previously generated space shuttle menus. The results of the study are shown, along with the range of meal choices considered.

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Dual shear plate power processor packaging design

The use of solar electric propulsion (SEP) for spacecraft primary propulsion imposes an extreme range of operational and environmental design requirements associated with the diversity of missions for which solar electric primary propulsion is advantageous. One SEP element which is particularly sensitive to these environmental extremes is the power processor unit (PPU) which powers and controls the electric ion thruster. An improved power processor thermal-mechanical packaging approach, referred to as dual shear plate packaging, has been designed to accommodate these different requirements with minimum change to the power processor design. Details of this packaging design are presented together with test results obtained from thermal-vacuum and structural-vibration tests conducted with prototype hardware.

Franzon, A. O.

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.

WOLF contouring and plotting package

Tasks ranging from quick simple plot (which requires only one call to package) to highly sophisticated plots (including motion picture plots) easily generated with basic knowledge of FORTRAN and plot commands. Designers preparing software system that requires plotted output will find this package offers many advantages over standard hardware support packages available.

Masaki, G. T.

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.

Perkins, K. L.

Moisture penetration in microcircuit packages

Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.

Licari, J. J.

Description of the three axis low-g accelerometer package

The three axis low-g accelerometer package designed for use on the Space Processing Application Rocket (SPAR) Program is described. The package consists of the following major sections: (1) three Kearfott model 2412 accelerometers mounted in an orthogonal triad configuration on a temperature controlled, thermally isolated cube, (2) the accelerometer servoelectronics (printed circuit cards PC-6 through PC-12), and (3) the signal conditioner (printed circuit cards PC-15 and PC-16). The measurement range is 0 + or - 0.031 g with a quantization of 1.1 x 10 to the 7th power g. The package was flown successfully on six SPAR launches with the Black Brant booster. These flights provide approximately 300 s of free fall or zero-g environment.

Amalavage, A. J.

Computer program documentation modified version of the JA70 aerodynamic heating computer program H800 (MINIVER with a DISSPLA plot package

The changes, modifications, and inclusions which were adapted to the current version of the MINIVER program are discussed. Extensive modifications were made to various subroutines, and a new plot package added. This plot package is the Johnson Space Center DISSPLA Graphics System currently driven under an 1110 EXEC 8 configuration. User instructions on executing the MINIVER program are provided and the plot package is described.

Olmedo, L.

Design requirements for SRB production control system. Volume 3: Package evaluation, modification and hardware

The software package evaluation was designed to analyze commercially available, field-proven, production control or manufacturing resource planning management technology and software package. The analysis was conducted by comparing SRB production control software requirements and conceptual system design to software package capabilities. The methodology of evaluation and the findings at each stage of evaluation are described. Topics covered include: vendor listing; request for information (RFI) document; RFI response rate and quality; RFI evaluation process; and capabilities versus requirements.

Source record

The graphics and data acquisition software package

A software package was developed for use with micro and minicomputers, particularly the LSI-11/DPD-11 series. The package has a number of Fortran-callable subroutines which perform a variety of frequently needed tasks for biomedical applications. All routines are well documented, flexible, easy to use and modify, and require minimal programmer knowledge of peripheral hardware. The package is also economical of memory and CPU time. A single subroutine call can perform any one of the following functions: (1) plot an array of integer values from sampled A/D data, (2) plot an array of Y values versus an array of X values; (3) draw horizontal and/or vertical grid lines of selectable type; (4) annotate grid lines with user units; (5) get coordinates of user controlled crosshairs from the terminal for interactive graphics; (6) sample any analog channel with program selectable gain; (7) wait a specified time interval, and (8) perform random access I/O of one or more blocks of a sequential disk file. Several miscellaneous functions are also provided.

Crosier, W. G.

Piggy-back mounting would increase microcircuit packaging density

Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.

Gaudiano, S.

Packaging criteria for transportation and handling shock and vibration

Information compiled on the shock and vibration environment encountered by items and equipment during shipment shows the distribution of drop heights for particular packages, distribution systems, and handling operations. Applications of the data to typical package design problems are discussed.

Source record

Battery-package design provides for cell cooling and constraint

Lightweight battery-package provides for even cooling of individual alkaline cells, constraint against cell expansion, and convenient placement of cells. The battery package also provides for venting of the cells and includes instrumentation to measure cell temperature, pressure, and voltage.

Gross, S.

Hermetic-coaxial package design for microwave transistors

Semiconductor package has been developed for high power semiconductor devices that operate in the GHz-frequency range at several watts. Package includes stud, insulating ring, electrically conductive washer, insulating washer, braze ring, and cap. It is mechanically strong and can be used with variety of circuits.

Jacobson, D. S.

Large space telescope, phase A. Volume 4: Scientific instrument package

The design and characteristics of the scientific instrument package for the Large Space Telescope are discussed. The subjects include: (1) general scientific objectives, (2) package system analysis, (3) scientific instrumentation, (4) imaging photoelectric sensors, (5) environmental considerations, and (6) reliability and maintainability.

Source record

Ground and flight test program of a Stokes-flow parachute: Packaging, deployment, and sounding rocket integration

The current design and hardware components of the patented 14 sqm Stokes flow parachute are described. The Stokes-flow parachute is a canopy of open mesh material, which is kept deployed by braces. Because of the light weight of its mesh material, and the high drag on its mesh elements when they operate in the Stokes-flow flight regime, this parachute has an extremely low ballistic coefficient. It provides a stable aerodynamic platform superior to conventional nonporous billowed parachutes, is exceptionally packable, and is easily contained within the canister of the Sidewinder Arcas or the RDT and E rockets. Thus, it offers the potential for gathering more meteorological data, especially at high altitudes, than conventional billowed parachutes. Methods for packaging the parachute are also recommended. These methods include schemes for folding the canopy and for automatically releasing the pressurizing fluid as the packaged parachute unfolds.

Niederer, P. G.

Effects of certain control-system nonlinearities on stability and pointing of an attached double-gimbal experiment package in presence of random crew-motion disturbances

The effects of two types of control-system nonlinearities, sensor deadband and actuator breakout torque, on the pointing capability of a Apollo Telescope Mount (ATM) double-gimbal experiment isolation and control system are investigated. A composite structural model of a flexible experiment package connected through frictionless double gimbals to a flexible carrier vehicle is used for this investigation. Contributions of the primary carrier control system to experiment pointing are neglected. Pointing errors onboard the experiment package due to random crew-motion input into the carrier vehicle are computed. A stability investigation is performed to verify control-system stability with nominal nonlinearities and gains. Indications are that there is no stability problem due to the nonlinearities. A nonlinearity sensitivity study is carried out to determine the effects on pointing accuracy. Its results indicate that nominal ATM control system nonlinearities limit the pointing accuracy to approximately 0.4 arc second in the presence of crew motion. Methods of reducing the error to less than 0.1 arc second are discussed.

Shaughnessy, J. D.