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At least 37 records · Page 2

Performance of a coarsely pixelated LAPPD photosensor for the SoLID gas Cherenkov detectors

The SoLID spectrometer's gas Cherenkov counters require photosensors that operate in a high luminosity and high background environment. The reference design features arrays of 9 or 16 tiled multi-anode photomultipliers (MaPMTs), distributed across 32 sectors, to serve the light-gas and heavy-gas Cherenkov counters, respectively. To assess the viability of a pixelated INCOM Large Area Picosecond Photodetector (LAPPD TM ) as an alternative photosensor to replace MaPMT arrays in either detector, we evaluated its performance under realistic SoLID running conditions in Hall C at the Thomas Jefferson National Accelerator Facility (Jefferson Lab). The results of this test confirmed that the coarse-pixelated (2.5 × 2.5 cm 2 pixel size) LAPPD is capable of handling the total projected signal and background rates of the three pillar SoLID experiments. The tested photosensor detected Cherenkov signals with the capability of separating single-electron events from pair production events while rejecting background. Although the design was not aimed at ring-imaging Cherenkov detectors, Cherenkov disk images were captured in two different gas radiators. Through a direct comparison with a GEANT4 simulation, we confirmed the experimental performance of the LAPPD.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND

Rad-hard readout system for Timepix3 Hybrid Pixel Detectors

The Beam Gas Ionisation (BGI) profile monitor, located in the Proton Synchrotron (PS) and Super Proton Synchrotron (SPS) at CERN, requires a radiation-tolerant readout system to transfer data from the challenging accelerator surroundings to the back-end for processing. The system needs to control and acquire data from four Timepix3 Hybrid Pixel Detectors (HPDs) located directly inside the beam pipe, a highly radioactive environment. It must ensure reliability given limited hardware access and preserve signal integrity for the high-speed data (32 channels at 320 MHz). However, due to the unavailability of a suitable rad-hard Timepix3 readout, the Beam Instrumentation PiXeL (BIPXL) readout system was designed to meet these requirements. This system employs radiation-hardened components such as the GBTx and the FEASTMP, both developed at CERN. It will be compatible with forthcoming hybrid pixel detector initiatives in similarly harsh radiation conditions.

47 OTHER INSTRUMENTATION

Test and characterization of finely segmented pixel CZT detectors for future hard x-ray missions

The NuSTAR (Nuclear Spectroscopic Telescope Array) mission was launched in 2012, and it has successfully deployed the first orbiting telescopes to focus high energy X-ray (3 - 79 keV) light, providing a wealth of new information on high-energy X-rays sources. Follow-up missions, such as the proposed HEX-P, BEST, and FORCE, could perform a deeper black hole census providing a more refined measurement of black hole spins, allowing for greater knowledge about supermassive black holes. Here, these missions are motivated by the recent breakthroughs in the hard X-ray mirror technologies, where mirrors, either made of monolithic silicon segments, or made directly or via replication of shells, demonstrate the feasibility of making hard X-ray mirrors with angular resolutions of 5-10 arc-seconds Half Power Diameter (HPD) compared to the NuSTAR’s 1 arc-minute HPD. Such a high angular resolution requires matched detectors with higher degree of segmentation to fully benefit from the achievable improved spatial resolution. In the above framework, the HEXID ASIC, a novel pixelated front-end suitable for reading out a finely segmented CZT sensor with 150 μm pixel pitch in a hexagonal arrangement has been developed. This readout pixelated chip is capable of processing photon-generated charge packets over a large dynamic range (from 2 keV up to 180 keV), while keeping a low input noise (ENC <20 e - ). In this work, the initial characterization of the ASIC prototype will be presented.

47 OTHER INSTRUMENTATION

Test Beam Results of Planar Pixel Sensor for the CMS Phase 2 Inner Tracker Upgrade

Results of the test beam measurements that characterise the performance of CMS Readout Chip (CROC) sensors to be used in the High Luminosity era of the Large Hadron Collider (HL-LHC) are presented. The HL-LHC peak instantaneous luminosity of $7.5 \times 10^{34} \ \text{cm}^{-2} s^{-1}$ corresponds to an average of around 200 inelastic proton-proton collisions per beam-crossing every 25 ns. In order to efficiently reconstruct and track particles in this extreme and challenging conditions, the present CMS tracking detector will be completely replaced. The new tracking detector consists of an Inner Tracker closest to the beamline and an Outer Tracker surrounding it. These are populated with modules that comprise of readout chips and silicon sensors. The test beam measurements of these modules are vital to understand the performance of the related technologies. Using a primary 120 GeV proton beam from the Main Injector at Fermilab, data was collected at the Fermilab Test Beam Facility (FTBF) using the silicon tracker telescope that provides a precision position measurement of the track impact point with less than 5 $\mu$m uncertainty. The proton beam was incident on a 1x2 planar CROC module developed by Hamamatsu. The sensor has 100x25 $\mu m^2$ standard pixels and also a smaller number of 225x25 $\mu m^2$ longer pixels at the boundary between the two ROCs. We present characterization of these modules that includes pixel efficiency, resolution, cluster size and charge distributions.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS

Performance of Pixel and Strip AC-LGAD Sensors with Different Design Parameter on a 120 GeV Proton Beam

We present the results of an extensive evaluation of strip and pixel AC-LGAD sensors tested with a 120 GeV proton beam, focusing on the influence of design parameters on the sensor temporal and spatial resolutions. Results show that reducing the thickness of pixel sensors significantly enhances their time resolution, with 20- μm-thick sensors achieving around 20 ps. Uniform performance is attainable with optimized sheet resistance, making these sensors ideal for future timing detectors. Conversely, 20-μm-thick strip sensors exhibit higher jitter than similar pixel sensors, negatively impacting time resolution, despite reduced Landau fluctuations with respect to the 50-μm-thick versions. Additionally, it is observed that a low resistivity in strip sensors limits signal size and time resolution, whereas higher resistivity improves performance. This study highlights the importance of tuning the n+ sheet resistance and suggests that further improvements should target specific applications like the Electron-Ion Collider or other future collider experiments. In addition, the detailed performance of four AC-LGADs sensor designs is reported as examples of possible candidates for specific detector applications. These advancements position AC-LGADs as promising candidates for future 4D tracking systems, pending the development of specialized readout electronics.

Lara, Carlos Pérez

MIP dQ/dx Calibration in DUNE ND-LAr Prototypes with Pixelated Charge Readout

The Deep Underground Neutrino Experiment (DUNE) will be a next-generation long baseline neutrino oscillation experiment that will employ LArTPC technology in a near detector placed at Fermilab and a far detector at the Sanford Underground Research Facility, at a baseline of 1300 km. The DUNE Liquid Argon Near Detector (ND-LAr) design takes into account the high neutrino intensity expected from the beam at the Long-Baseline Neutrino Facility (LBNF): 35 modules, each containing two optically separated time projection chambers, are instrumented with a pixel-based, true 3D charge readout alongside scintillation light traps to disentangle the O(100) interactions expected per 10us beam spill. A robust prototyping program supports ND-LAr’s design: the 2x2 Demonstrator consists of four scaled-down ND-LAr modules exposed to the NuMI beam at Fermilab, and the Full Scale Demonstrator (FSD) is a single ND-LAr module tested with cosmic rays at the University of Bern. We present here an analysis of minimum ionizing particle (MIP) tracks selected from 2x2 beam data and FSD cosmic ray data used to benchmark the pixel-based charge readout simulation and calibration in both detectors, with the ultimate goal of validating the design of DUNE ND-LAr as well as informing future calibration methods. This poster will showcase the dependence of the charge response on track inclination as well as a per-pixel dQ/dX extraction.

Mandujano, Roberto [UC, Irvine]

Intelligent Pixel Detectors: Towards a Radiation Hard ASIC with On-Chip Machine Learning in 28 nm CMOS

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout channels. With event rates as high as 40 MHz, these detectors will generate petabytes of data per second. To enable discovery within strict bandwidth and latency constraints, future trackers must be capable of fast, power efficient, and radiation hard data-reduction at the source. We are developing a radiation hard readout integrated circuit (ROIC) in 28nm CMOS with on-chip machine learning (ML) for future intelligent pixel detectors. We will show track parameter predictions using a neural network within a single layer of silicon and hardware tests on the first tape-outs produced with TSMC. Preliminary results indicate that reading out featurized clusters from particles above a modest momentum threshold could enable using pixel information at 40 MHz.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND

Evaluation of 3D pixel silicon sensors for the CMS Phase-2 Inner Tracker

The high-luminosity upgrade of the CERN LHC requires the replacement of the CMS tracking detector to cope with the increased radiation fluence while maintaining its excellent performance. An extensive R&D program, aiming at using 3D pixel silicon sensors in the innermost barrel layer of the detector, has been carried out by CMS in collaboration with the FBK (Trento, Italy) and CNM (Barcelona, Spain) foundries. The sensors will feature a pixel cell size of 25 × 100 µm 2 , with a centrally located electrode connected to the readout chip. The sensors are read out by the RD53A and CROCv1 chips, developed in 65 nm CMOS technology by the RD53 Collaboration, a joint effort between the ATLAS and CMS groups. This paper reports the results achieved in beam test experiments before and after irradiation, up to a fluence of approximately 2 . 6 × 1 0 16 n eq /cm 2 . Measurements of assemblies irradiated to a fluence of 1 × 10 16 n˙eq/cm 2 show a hit detection efficiency higher than 96% at normal incidence, with fewer than 2% of channels masked, across a bias voltage range greater than 50 V . Even after irradiation to a higher fluence of 1.6 × 10 16 n˙eq/cm 2 , similar performance is maintained over a bias voltage range of 30 V , remaining well within CMS requirements.

3D pixel

A 28 nm multiply-accumulate ASIC architecture for on-chip data compression in MHz frame rate X-ray and electron pixel detectors

Modern X-ray detector systems urgently require compact, efficient, and fast data compression schemes to handle the transmission of big data from pixel arrays, enabling frame rates in the MHz regime. Here, in this work, a data compression ASIC that implements a streaming fixed-length lossy compression scheme is introduced and analyzed, proving the feasibility and benefits of on-chip compression. The compression scheme utilizes a vector matrix product logic, which performs a number of floating-point multiplications, additions, and accumulations. The logic is verified, synthesized, and shown to fit in the area resource available for the X-ray detector under study, which comprises 192 × 168 pixels each of 12-bit width, and having a total area of 20 mm× 20 mm, about 2 mm× 20 mm of which are available for the digital logic. Several system architectures, precisions, and compression ratios ranging from 100 to 250 were analyzed to pave the way for on-chip fixed-length compression (e.g., principal component analysis, singular value decomposition) and data reduction (e.g., azimuthal integration) for X-ray and electron detectors.

Data compression

Anti-distortion bioinspired camera with an inhomogeneous photo-pixel array

The bioinspired camera, comprising a single lens and a curved image sensor—a photodiode array on a curved surface—, was born of flexible electronics. Its economical build lends itself well to space-constrained machine vision applications. The curved sensor, much akin to the retina, helps image focusing, but the curvature also creates a problem of image distortion, which can undermine machine vision tasks such as object recognition. Here we report an anti-distortion single-lens camera, where 4096 silicon photodiodes arrayed on a curved surface in a nonuniform pattern assimilated to the distorting optics are the key to anti-distortion engineering. That is, the photo-pixel distribution pattern itself is warped in the same manner as images are warped, which correctively reverses distortion. Acquired images feature no appreciable distortion across a 120° horizontal view, as confirmed by their neural-network recognition accuracies. This distortion correction via photo-pixel array reconfiguration is a form of in-sensor computing.

77 NANOSCIENCE AND NANOTECHNOLOGY

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L

High-energy X-ray imaging with a Germanium MM-PAD hybrid pixel detector

Germanium is a high-Z sensor material with excellent energy resolution and attractive properties for high-energy photon detection. Despite its advantages, the need for cryogenic operation and challenges in the fabrication of pixelated high-purity germanium have hindered the development of segmented detectors. We report on the fabrication and performance of a germanium imaging detector with 150 μm pixel pitch hybridized to the MM-PAD ASIC. The detector was capable of high-resolution radiographic imaging and has a fast temporal response. Additionally, we describe the detector's upper operating temperature limits using both the MM-PAD and MARS ASICs, achieving stable operation up to 130 K and 190 K, respectively.

36 MATERIALS SCIENCE

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND

Smart Pixel Sensors for the HL-LHC

Large-scale particle physics experiments produce tens of terabytes of data every second. Innovative methods to manage the data rate at the HL-LHC, which expects to operate at 10x the luminosity of what the LHC was initially designed for, are needed. AI-on the chip provides a way to intelligently filter out low momentum clusters in the pixel detector. This will open up an opportunity to use the pixel detector for the first time in the CMS Level-1 trigger, and lead to increased sensitivity to new physics measurements and searches. We have taped out our first chip, which incorporates a $p_T$ filtering algorithm on an ASIC chip. Our initial $p_T$ filtering algorithm considers clusters that are tracked by CMS. We will report on ongoing studies seeking to enhance the performance of our filter by utilizing unsupervised learning on untracked clusters, thus increasing background rejection.

43 PARTICLE ACCELERATORS

Low power on-chip data transmission for wafer-scale monolithic active pixel sensors

Here, this paper details the implementation of the digital pulse shaping subsystem within the Backbone Transmission Line Encoding (BTLE) driver, a low-power, long-distance on-chip data transmission solution designed in a 65 nm CMOS process. Digital pulse shaping is critical for minimizing inter-symbol interference (ISI) caused by bandwidth limitations of on-chip interconnects, especially in wafer-scale monolithic active pixel sensors (MAPS). A duobinary encoder coupled with a parallelized polyphase finite impulse response (FIR) filter is used for efficient shaping of the transmitted signal spectrum. This reconfigurable architecture achieves reliable 160 Mb/s data transfer over a 10 cm on-chip link, as validated by simulations demonstrating low power consumption (FoM 37.3 fJ/bit/mm of transmission line length) and effective ISI mitigation.

47 OTHER INSTRUMENTATION

Pixel-Registered Multimodal Synchrotron XRF and FTIR Microscopies Reveal Salinity Stress Response Mechanisms in Pistachio

Background: Salinity is a major abiotic stress that negatively affects nearly all plant species at all stages of growth. Drought and poor-quality irrigation cause high soil salinity and salt accumulation via evaporation, reducing crop productivity. Despite its critical importance, the spatial localization of salt ions and associated biochemical changes within plants experiencing high salinity remains largely unknown. In this study, we developed a multimodal imaging pipeline to understand the impact of salinity on the pistachio rootstock UCB-1 (Pistacia atlantica x Pistacia integerrima). We directly link biochemical fingerprints in stem tissue architecture with salt ion localization to provide insights into the strategies pistachio uses to tolerate salinity. Results: We observed that Pistacia spp. exposed to high salt conditions accumulated Ca, Si, Cl, Al and Mg as hotspots within the pith, compared to the control (of which only Ca and Al co-locate). In contrast, there was a decrease in K between the control and salinity treatment. Hotspots of amide I and II were present in the cortex and pith of the salinity treated sample. Additionally, the salinity treatment resulted in an increased abundance of pectin and carbohydrates within the pith compared to the control, and the abundance of esters/carboxylic acid was greater in the salinity treatment. Conclusions: We determined that Cl and K, S and P, and biochemical components polysaccharide and pectin, esters and carboxylic acid, amide I and cellulose are the strongest drivers of salinity- treatment induced variability. In the cortex and phloem/xylem, a negative K-Ca correlation decreases in the salinity treatment. Several hotspots of elements and amide I (proteins) appear under salinity treatment, particularly in the cortex, suggesting an increase in the production of stress-related proteins (in response to high Cl) and/or structural proteins (i.e. Ca). Together, these results indicate that pistachio responds to salinity through ion compartmentalization coupled with a targeted biochemical adjustment, rather than a broadscale tissue-wide response. Overall, these novel, spatially resolved pixel-registered multimodal imaging data provide an enabling platform to understand the mechanisms of salinity tolerance in Pistacia spp and can be broadly applied to studying stress-related phenotype response in various plant tissues.

FTIR spectromicroscopy

Electron/hadron separation with the TRD based on GaAs pixel detectors

Transition Radiation Detectors (TRDs) are widely used for particle identification in both high-energy physics and astroparticle physics. They are typically equipped with gaseous detectors. The main limitation of these types of detectors is that TR photons and ionization losses cannot be decoupled, which significantly reduces the particle separation power. Recent advancements in the development of pixel detectors based on GaAs sensors offer a unique opportunity to effectively detect TR photons and separate them from ionization losses. Such detectors represent novel devices that combine precise tracking capabilities with particle identification (PID) properties. The present work is dedicated to an experimental study of particle identification properties of the TRD prototype based on 500 μ m-thick GaAs sensor bonded to a Timepix3 chip. Studies were performed at the CERN SPS and it was shown that at a particle momentum of 20 GeV/c, the probability of misidentifying a hadron as an electron is below 10 −2 for an electron detection efficiency of 98%–99%, and it is 1 . 6⋅10 −4 for electron detection efficiency of 90%. This performance surpasses the electron/hadron rejection power of all known TRDs by an order of magnitude for the same detector length.

GaAs detectors

Measurement of the fractional radiation length of a pixel module for the CMS Phase-2 upgrade via the multiple scattering of positrons

High-luminosity particle collider experiments such as theones planned at the High-Luminosity Large Hadron Collider requireever-greater vertexing precision of the tracking detectors,necessitating reductions in the material budget of the detectors.Traditionally, the fractional radiation length (x/X$_{0}$) ofdetectors is either estimated using known properties of theconstituent materials, or measured in dedicated runs of the finaldetector. In this paper, we present a method of direct measurementof the material budget of a CMS prototype module designed for thePhase-2 upgrade of the CMS detector using a 40–65 MeV positronbeam. A total of 630 million events were collected at the PaulScherrer Institut PiE1 experimental area using a three-planetelescope consisting of the prototype module as the central plane,surrounded by two MALTA monolithic pixel detectors. Fractionalradiation lengths were extracted from scattering angle distributionsusing the Highland approximation for multiple scattering. Astatistical technique recovered runs suffering from triggerdesynchronisation, and several corrections were introduced tocompensate for local inefficiencies related to geometric and beamshape constraints. Two regions of the module were surveyed andyielded average x/X$_{0}$ values of (0.72 ± 0.05)% and(0.95 ± 0.09)%, which are compatible with empirical estimatesfor these regions computed from known material properties of 0.753%and 0.892%, respectively. Two types of higher-granularity maps ofthe fractional radiation length were produced, subdivided eitherinto rectangular regions of uniform size, or polygonal-shapedregions of uniform material composition. The results bode well forthe CMS Phase-2 upgrade modules, which will play a key role in theminimisation of the material of the upgraded detector.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND