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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

Thermal verification testing of commercial printed-circuit boards for spaceflight

A method is discussed developed to verify commercial printed-circuit boards for a shuttle orbital flight. The Space Acceleration Measurement System Project used this method first with great success. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Then temperature definition tests are performed that consist of infrared scanning, thermal vacuum testing, and preliminary thermal operational testing. Only the engineering unit is used for temperature definition testing, but the preliminary thermal operational testing is performed on the flight unit after the temperature range has been defined. In the sequence of testing, vibration testing is performed next, but most vibration failures cannot be detected without subsequent temperature cycling. Finally, final assembly testing is performed to simulate the shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 hours of trouble-free operation. Verification is successful when all components and final assemblies have passed each test satisfactory. This method was very successful in verifying that commercial printed-circuit boards will survive in the shuttle environment.

Foster, William M., II↗
NASA NTRS1996

A Formal Algorithm for Routing Traces on a Printed Circuit Board

This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

Hedgley, David R., Jr.↗
NASA NTRS1968

Optical system facilitates inspection of printed circuit boards

Optical comparator method determines the quality and registration of surface features of double-sided printed circuit boards. Color-coded superimposed images of both sides of a printed circuit board are presented to view, clearly showing details and registration of the circuitry.

Cridlin, M.↗
NASA NTRS1989

Design and implementation of a multi-sensor robot system for printed circuit board insertion

The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.

Sood, Deepak↗
DOE OSTI2025

Printed circuit primary heat exchanger for power conversion in heat pipe microreactor applications

Here, in the present study, a model was developed for a recuperated air Brayton cycle for heat pipe microreactors, and the effect of the primary heat exchanger type assessed. An annular flow heat exchanger and a printed circuit heat exchanger (PCHE) were evaluated. A sub-sized diffusion bonded, PCHE test specimen was manufactured and tested with nitrogen as the working fluid to validate and improve the PCHE model. A comparison of the thermal cycle efficiency for the Brayton cycle coupled to a heat pipe microreactor using each of the two primary heat exchangers showed competitive performance for both options, with achievable cycle efficiencies of 34 % and 35 % for the annular and printed circuit heat exchangers, respectively. The impact of heat pipe length and additional reheating stages on cycle efficiency was studied. Increasing the heat pipe condenser length from 0.8 to 2.0 m resulted in an increase in cycle efficiency of 3.5 % and 3.2 % for the annular and printed circuit heat exchangers, respectively. The use of additional reheating stages showed a reduction in cycle efficiency since the heat pipe surface area limits the primary heat exchanger size and effectiveness. These results highlight the importance of the primary heat exchanger on the performance of a heat pipe microreactor. Overall, the cycle model, testing, and heat exchanger model showed the potential for the PCHE to improve the economics of a heat pipe microreactor relative to the annular flow heat exchanger, which also opens the possibility to use different heat transfer fluids such as supercritical CO 2 .

PCHE↗
NASA NTRS1990

Printed-Circuit Cross-Slot Antenna

Coupling between perpendicular slots suppressed. Balanced feed configuration minimizes coupling between slots of printed-circuit cross-slot antenna unit. Unit and array have conventional cavity-backed-printed-circuit, crossed-slot antenna design. Strip-line feeders behind planar conductive antenna element deliver power to horizontal slot in opposite phase. As result, little or no power propagates into vertical slot. Similar considerations apply to strip lines that feed vertical slot. Units of this type elements of phased-array antennas for radar, mobile/satellite communications, and other applications requiring flush mounting and/or rapid steering of beams with circular polarization.

Foy, Wong↗
NASA NTRS1999

Physically separating printed circuit boards with a resilient, conductive contact

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Baker, John D.↗
NASA NTRS1983

Probe Array for Testing Printed-Circuit Substrates

Array of tiny probes tests complex printed circuit boards prior to mounting of microcircuit chips and other active and passive components. Insertion and alignment of board, performance of entire computer-controlled test, and printing of results requires about a minute; performed manually same tests require as much as 30 hours.

Roison, A.↗
DOE OSTI2023

Critical Evaluation of a Novel Analysis Technique for Assessment of Printed Circuit Heat Exchangers in High-Temperature Nuclear Service

Application of printed circuit heat exchangers (PCHEs) to very high-temperature reactors (VHTRs) requires mechanical performance assessment methodologies. The PCHE morphology consists of thousands of millimeter-scale channels, for enhanced thermal efficiency, enclosed in a meter-scale PCHE core. PCHE geometry under thermomechanical creep-fatigue transients results in multi-axial interactions between its different segments, such as channeled core, walls, and headers. These global-level interactions influence the local channel-level responses. Hence, developing a PCHE performance assessment methodology, following the ASME Code, Section III, Division 5 provisions, is a critical gap to be filled. There is no analysis or design methodology available in ASME Code to assess a PCHE for its global and local level performances under high temperature and pressure loadings. This paper critically evaluates a recently proposed two-step analysis technique to estimate global interactions and local channel-level responses of PCHEs. In this novel analysis technique, the channeled PCHE core is replaced with orthotropic solid blocks of representative stiffness properties for the global thermomechanical analysis. Here, subsequent channel scale submodel analysis with detailed channel geometry, loading, and elastic-perfectly plastic (EPP) material model estimates the local responses for PCHE performance assessment. This paper critically evaluates this novel technique for its effectiveness in PCHE performance assessment. Finite element (FE) models imitating various analysis issues are developed, and FE analysis results are scrutinized. An important outcome of this study is the validation of the novel two-step PCHE analysis technique for application to the performance assessment of PCHEs in VHTRs.

42 ENGINEERING↗
DOE OSTI2022

MECHANICAL PERFORMANCE EVALUATION OF THE PRINTED CIRCUIT HEAT EXCHANGER CORE EXPERIMENTS UNDER TENSION AND PRESSURE LOADING

The printed circuit heat exchanger (PCHE) has small channels with high surface area, making them an efficient solution for next-generation nuclear plants (NGNPs). These PCHEs are fabricated through a diffusion bonding process. This fabrication step changes the microstructure of wrought metal plates. The current ASME design code does not support the PCHE design for NGNPs due to a lack of test data. Hence, there has been initiative towards elevated temperature mechanical property characterization of the diffusion bonded material. One of the most common channel shapes is a semicircular channel with sharp corners. These corners act as a stress riser at the diffusion bonding interface. Evaluating elevated temperature mechanical performance of diffusion bonded material in the presence of stress risers is an essential step towards the ASME code development of PCHE design. This study selected two specimen geometries: the first is a PCHE bar specimen for tensile loading with three rows and three columns of channels, and the second is a lab-scaled PCHE with six rows and eight columns of channels. A set of elevated temperature monotonic and cyclic tests were conducted on the PCHE bar specimen to evaluate the mechanical performance under axial tensile loadings to study the failure mechanism. The lab-scaled PCHE specimens were tested under overpressure loads at room temperature, and pressure creep and pressure creep-fatigue loadings to mimic the realistic loading conditions observed in typical NGNPs. The X-ray scans of channeled specimens show interesting observations. The test results and observations are presented in the paper.

36 MATERIALS SCIENCE↗
NASA NTRS2007

Designing High Speed Printed Circuit Boards Using DxDesigner and Expedition

Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.

printed circuit boards↗
NASA NTRS1970

Economical printed circuit front panel for computer use

Techniques for preparing printed circuit boards are used to provide an alternate method for producing panel symbology for ground computer test trap. After processing, the panel unit is either solder or gold plated.

Newman, J.↗