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Investigation of in-situ mechanical and chemical etching: A milder hydrometallurgical approach for Au, Ni, and Cu recovery from printed circuit boards
Not Available
Printed Circuit Board (PCB) Electrical Characterization
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Design and Characterization of a Printed Circuit Board-Based Gas Chromatography Column for Greenhouse Gas Analysis
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Exploring Power and Frequency Limits of Printed Circuit Board Dispersive Nonlinear Transmission Lines
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Exploration of Fast High Voltage Pulse Generators for Printed Circuit Board Nonlinear Transmission Lines
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Printed circuit board for integrated LED driver
A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.
Modeling a Water-Cooled Printed Circuit Heat Exchanger Condensing CO2 for Use in sCO2 Cycle System Optimization Studies
Presentation at the 2023 ASME Turbo Expo, June 26-30, 2023.
The Differential Image Transform: Using Image Processing to Verify Printed Circuit Boards.
Abstract not provided.
Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs)
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Exploring Power and Frequency Limits of Printed Circuit Board Dispersive Nonlinear Transmission Lines
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Exploring Power and Frequency Limits of Printed Circuit Board Dispersive Nonlinear Transmission Lines
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Aerosol-Jet Printed Transferable Millimeter-Wave Circuits
Printed millimeter wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-Dimension Heterogeneous Integration (3DHI) to improve performance beyond traditional systems. Here, in this paper, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A PDMS stamp assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.
Electrical contacts on the sidewall of a circuit board
Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.
Conductive Ink with Circular Life Cycle for Printed Electronics
Electronic waste carries energetic costs and an environmental burden rivaling that of plastic waste due to the rarity and toxicity of the heavy-metal components. Recyclable conductive composites are introduced for printed circuits formulated with polycaprolactone (PCL), conductive fillers, and enzyme/protectant nanoclusters. Circuits can be printed with flexibility (breaking strain ≈80%) and conductivity (≈2.1 × 10 4 S m -1 ). These composites are degraded at the end of life by immersion in warm water with programmable latency. Approximately 94% of the functional fillers can be recycled and reused with similar device performance. The printed circuits remain functional and degradable after shelf storage for at least 7 months at room temperature and one month of continuous operation under electrical voltage. Here, the present studies provide composite design toward recyclable and easily disposable printed electronics for applications such as wearable electronics, biosensors, and soft robotics.
System and method for large-scale PCB production including continuous selective adhesion
A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.