DOE OSTI · 2447046
Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs)
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Bora, M. 2024-08-28. Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs). https://www.osti.gov/biblio/2447046
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