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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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The paper studies calculated and measured metal wall temperatures of uncoated vanes and the same vanes coated with a thermal barrier coating system of NiCrAlY bond and yttria-stabilized zirconia ceramic. It is shown that thermal contact between layers is negligible. The significance of data scatter and of published ceramic thermal conductivity values is discussed.
Any cryogen free system or a system seeking to be cryogen free will encounter thermal contact resistance
A comparative study of the methods developed for the calculation of thermal contact resistance between two surfaces submitted to a perpendicular heat flux is presented. Several factors affecting this resistance are analyzed and a brief historical review of the works in this field is made, spotting the methods of interest for space applications. These are compared to experimental data so as to establish the most proper method for the couplings of the first Brazilian satellite.
Thermal contact resistance measurement at various ambient pressures compared with theoretical predictions with each parameter analyzed over interface by computer program
Cooling of electric machines is a key to increasing power density and improving reliability. This paper focuses on the design of a machine using a cooling jacket wrapped around the stator. The thermal contact resistance (TCR) between the electric machine stator and cooling jacket is a significant factor in overall performance and is not well characterized. This interface is typically an interference fit subject to compressive pressure exceeding 5 MPa. An experimental investigation of this interface was carried out using a thermal transmittance setup using pressures between 5 and 10 MPa. The results were compared to currently available models for contact resistance, and one model was adapted for prediction of TCR in future motor designs.
One difficulty in using cryocoolers is making good thermal contact between the cooler and the instrument being cooled. The connection is often made through a bolted joint. The temperature drop associated with this joint has been the subject of many experimental and theoretical studies. The low temperature behavior of dry joints have shown some anomalous dependence on the surface condition of the mating parts. There is also some doubts on how well one can extrapolate from the test samples to predicting the performance of a real system. Both finite element and analytic models of a simple contact system have been developed. The model assumes (a) the contact is dry (contact limited to a small portion of the total available area and the spaces in-between the actual contact patches are perfect insulators), (b) contacts are clean (conductivity of the actual contact is the same as the bulk), (c) small temperature gradients (the bulk conductance may be assumed to be temperature independent), (d) the absolute temperature is low (thermal radiation effects are ignored), and (e) the dimensions of the nominal contact area are small compared to the thickness of the bulk material (the contact effects are localized near the contact). The models show that in the limit of actual contact area much less than the nominal area (a much less than A), that the excess temperature drop due to a single point of contact scales as a(exp -1/2). This disturbance only extends a distance approx. A(exp 1/2) into the bulk material. A group of identical contacts will result in an excess temperature drop that scales as n(exp -1/2), where n is the number of contacts and n dot a is constant. This implies that flat rough surfaces will have a lower excess temperature drop than flat polished surfaces.
Thermal isolation characteristics of low conductance interstitial materials determined, using test apparatus of axially loaded radiation shielded cylindrical column in vacuum
Thermal isolation characteristics of low conductance interstitial materials determined, using test apparatus of axially loaded radiation shielded cylindrical column in vacuum
This paper describes a pyrotechnic ignition model based on transient heat conduction from a heated bridgewire to a pyrotechnic that is placed in contact with it. The boundary condition used at the interface was a thermal contact conductance estimated at 31,200 W per sq m-K between the wire and the pyrotechnic. Ignition was assumed to occur when a 2.5-micron layer of pyrotechnic next to the bridgewire reached a critical ignition temperature. The times to ignition predicted by this model for constant current firings were in good agreement with experimentally observed times to fire at 3.5- and 5-ampere current levels and ambient temperatures from 144 K to 366 K.
The contact of two rough, wavy surfaces; the contact of two rough but nominally flat plates pressed together over a concentrated area; and the contact of two rough but nominally flat plates bolted together are considered. In each case the pressure distribution is calculated as a function of the surface properties. In the case of wavy surfaces it is found that all necessary information for any combination of parameters can be reduced to one master graph. In the other two cases one such graph is needed for each geometry used. The resulting pressure distributions are used in a specific heat transfer example and the total joint resistance versus roughness is presented. A method for decreasing the resistance by increasing the roughness is shown.
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Prediction of electrical and thermal contact resistance for pressed, nominally flat contacts is complicated by the large number of variables which influence contact formation. This is reflected in experimental results as a wide variation in contact resistances, spanning up to six orders of magnitude. A series of experiments were performed to observe the effects of oxidation and surface roughness on contact resistance. Electrical contact resistance and thermal contact conductance from 4 to 290 K on OFHC Cu contacts are reported. Electrical contact resistance was measured with a 4-wire DC technique. Thermal contact conductance was determined by steady-state longitudinal heat flow. Corrections for the bulk contribution ot the overall measured resistance were made, with the remaining resistance due solely to the presence of the contact.
Thermal resistances in contact areas of heating elements
Specific contact resistivities for as-fabricated Au contacts on n-p InP solar cells are typically in the 10(exp -3) ohm/sq cm range, but contact resistivities in the 10(exp -6) ohm/sq cm range can be obtained if the cells are heat treated at 400 C for a few minutes. This heat treatment, however, results in a dramatic drop in the open circuit voltage of the cell due to excessive dissolution of the emitter into the metallization. It was found that low values of contact resistivity can be secured without the accompanying drop in the open circuit voltage by adding Ga and In in the Au metallization. It is shown that Au contacts containing as little as 1 percent atomic Ga can suppress the reaction that takes place at the metal-InP interface during heat treatment, while exhibiting contact resistivity values in the low 10(exp -5) ohm/sq cm. Detailed explanations for the observed superior thermal stability of these contacts are presented.
Heat transfer in rigid reusable surface insulations was investigated. Steady-state thermal conductivity measurements in a vacuum were used to determine the combined contribution of radiation and solid conduction components of heat transfer. Thermal conductivity measurements at higher pressures were then used to estimate the effective insulation characteristic length for gas conduction modeling. The thermal conductivity of the insulation can then be estimated at any temperature and pressure in any gaseous media. The methodology was validated by comparing estimated thermal conductivities with published data on a rigid high-temperature silica reusable surface insulation tile. The methodology was also applied to the alumina enhanced thermal barrier tiles. Thermal contact resistance for thermal conductivity measurements on rigid tiles was also investigated. A technique was developed to effectively eliminate thermal contact resistance on the rigid tile s cold-side surface for the thermal conductivity measurements.
Thermal contact resistance in vacuum environment predicted, using constriction model
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device.