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At least 37 records · Page 2

Fatigue-test acceleration with flight-by-flight loading and heating to simulate supersonic-transport operation

Possibilities for reducing fatigue-test time for supersonic-transport materials and structures were studied in tests with simulated flight-by-flight loading. In order to determine whether short-time tests were feasible, the results of accelerated tests (2 sec per flight) were compared with the results of real-time tests (96 min per flight). The effects of design mean stress, the stress range for ground-air-ground cycles, simulated thermal stress, the number of stress cycles in each flight, and salt corrosion were studied. The flight-by-flight stress sequences were applied to notched sheet specimens of Ti-8Al-1Mo-1V and Ti-6Al-4V titanium alloys. A linear cumulative-damage analysis accounted for large changes in stress range of the simulated flights but did not account for the differences between real-time and accelerated tests. The fatigue lives from accelerated tests were generally within a factor of two of the lives from real-time tests; thus, within the scope of the investigation, accelerated testing seems feasible.

Imig, L. A.↗

The application of probabilistic design theory to high temperature low cycle fatigue

Metal fatigue under stress and thermal cycling is a principal mode of failure in gas turbine engine hot section components such as turbine blades and disks and combustor liners. Designing for fatigue is subject to considerable uncertainty, e.g., scatter in cycles to failure, available fatigue test data and operating environment data, uncertainties in the models used to predict stresses, etc. Methods of analyzing fatigue test data for probabilistic design purposes are summarized. The general strain life as well as homo- and hetero-scedastic models are considered. Modern probabilistic design theory is reviewed and examples are presented which illustrate application to reliability analysis of gas turbine engine components.

Wirsching, P. H.↗

In-Situ Measurement of Power Loss for Crystalline Silicon Modules Undergoing Thermal Cycling and Mechanical Loading Stress Testing

An in-situ method is proposed for monitoring and estimating the power degradation of mc-Si photovoltaic (PV) modules undergoing thermo-mechanical degradation tests that primarily manifest through cell cracking, such as mechanical load tests, thermal cycling and humidity freeze tests. The method is based on in-situ measurement of the module’s dark current-voltage (I-V) characteristic curve during the stress test, as well as initial and final module flash testing on a Sun simulator. The method uses superposition of the dark I-V curve with final flash test module short-circuit current to account for shunt and junction recombination losses, as well as series resistance estimation from the in-situ measured dark I-Vs and final flash test measurements. The method is developed based on mc-Si standard modules undergoing several stages of thermo-mechanical stress testing and degradation, for which we investigate the impact of the degradation on the modules light I-V curve parameters, and equivalent solar cell model parameters. Experimental validation of the method on the modules tested shows good agreement between the in-situ estimated power degradation and the flash test measured power loss of the modules, of up to 4.31 % error (RMSE), as the modules experience primarily junction defect recombination and increased series resistance losses. However, the application of the method will be limited for modules experiencing extensive photo-current degradation or delamination, which are not well reflected in the dark I-V characteristic of the PV module.

14 SOLAR ENERGY↗

Effects of thermal cycling on magnetic properties of lunar analogs

An experimental study has been performed to determine whether stresses associated with thermal cycling cracks can affect the coercivity of remanence carried by iron in lunar samples. Initially, samples were cycled up to 100 times in a refrigerator over a period of about 30 min per cycle. In a second set of experiments, samples were dipped directly into liquid nitrogen up to 100 times at about 1 min per cycle. Comparison of AF demagnetization curves of weak field anhysteretic remanent magnetization before and after cycling revealed no systematic differences. Calculations based on a model of spherical iron grains within olivine or troilite indicate that it is unlikely that the iron will crack under thermal stress. Thus, thermal cycling does not appear to provide an explanation for increasing the stability of remanence in samples from the lunar surface.

Barron, A. M.↗

Determining Recoverable and Irrecoverable Contributions to Accumulated Strain in a NiTiPd High-Temperature Shape Memory Alloy During Thermomechanical Cycling

When Ni(29.5)Ti(50.5)Pd30 shape memory alloy is thermally cycled under stress, significant strain can accumulate due to elasticity, remnant oriented martensite and plasticity. The strain due to remnant martensite can be recovered by further thermal cycling under 0 MPa until the original transformation-induced volume change and martensite coefficient of thermal expansion are obtained. Using this technique, it was determined that the 8.15% total accumulated strain after cycling under 200 MPa consisted of 0.38%, 3.97% and 3.87% for elasticity, remnant oriented martensite and creep/plasticity, respectively.

Monroe, J. A.↗

Comparative Analysis of Hotspot Stress Endurance in Pristine and Thermal Cycled Prestressed Glass–Glass Photovoltaic Modules

Hotspots pose a significant long-term reliability challenge in photovoltaic (PV) modules that can have a detrimental impact on the efficiency, safety, and financial viability of a PV system. This paper aims to evaluate the endurance of hotspot stress in pristine and prestressed glass–glass (GG) modules. The accelerated prestressing was conducted for 600 thermal cycles (TC600) to represent decades of field exposure. GG modules are quickly becoming an alternative to the traditional glass–backsheet (GB) modules that have been the industry standard. Unlike other conventional studies that subject only pristine modules to hotspot stress, this paper evaluates the performance of an accelerated/simulated field-aged GG module (using TC600) and a pristine GG module. Pre- and post-characterizations were performed before and after each test to determine changes in electrical performance and observe any defects in GG modules. During the hotspot test, an approximately 200 °C maximum cell temperature was observed with a cell shading of 25% (the worst-case shading ratio). After the hotspot test, electroluminescence imaging indicated that most cells in the prestressed GG module exhibited severe damage whereas no significant defects were evident in the pristine GG module where the prestressed GG module degraded 8.2% and the pristine GG module degraded 1.5% in maximum power. These findings are critical for the industry, considering that GG bifacial modules will dominate the market.

14 SOLAR ENERGY↗

Activation Energy for End-of-Life Solder Bond Degradation: Thermal Cycling of Field-Aged PV Modules

The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.

14 SOLAR ENERGY↗

Accelerated Stress Testing of Perovskite Photovoltaic Modules: Differentiating Degradation Modes with Electroluminescence Imaging

Herein, electroluminescence (EL) and thermal imaging are used to examine p–i–n metal halide perovskite (MHP) photovoltaic (PV) mini-modules (MA0.6FA0.4PbI3, 20 cells, 78 cm2) before and after indoor-accelerated stress testing or outdoor deployment. Distinct spatial patterns in the EL images emerge, which depend on the external stress conditions experienced by the mini-module. Imaging results highlight a distribution of dark speckle features that dominate after UV stress, attributed to widespread interfacial contact degradation. Lateral intensity gradients across cells dominate after thermal cycling (TC) stress, attributed to current crowding near scribe defects. While current–voltage analysis alone does not give full insight on the degradation process, this study shows that distinct degradation modes can be further defined by multimodal electro-optical imaging (i.e., EL combined with photoluminescence and dark lock-in thermography). Neither UV exposure nor TC-accelerated stress testing alone replicates the same degradation signatures observed after outdoor deployment, suggesting that multiple degradation modes occur under concurrent stressors outdoors. Finally, spatial characterization of degradation modes in MHP PV mini-modules before and after accelerated stress testing lays the groundwork for developing targeted accelerated stress testing procedures through comparison with outdoor aging.

14 SOLAR ENERGY↗

Fabrication and properties of functionally graded NiAl/Al2O3 composites

A modified sedimentation process was used in the production of a functionally gradient material (FGM), NiAl/Al2O3. A simple finite element model was used to guide our design and fabrication efforts by estimating residual stress states as a function of composite structure. This approach could lead to tailored designs that enhance or avoid specific residual stress states. Thermal cycling tests were factored into the model to predict time dependent or steady-state internal temperature and stress profiles. Four-point bend tests were conducted to establish the mechanical load-displacement behavior of a single interlayer FGM at room temperature, 800 and 1000 K. Room temperature bend strength of the FGM was 3-4 times that of the base NiAl. At elevated temperatures, composite fracture occurred in a gradual, noncatastrophic mode involving NiAl retardation of a succession of cracks originating in the alumina face.

Miller, D. P.↗

Low Cost (CAPEX and variable): Tool design for cell and module fabrication with thin, free-standing silicon wafers

This project aimed to develop technologies that can potentially enable free-standing thin (<80 μm) wafer in today’s manufacturing lines with high production yield, and thereby reduce capex barriers of silicon photovoltaics cells and modules. One of the major benefits is that thin wafer dramatically reduces the amount of polysilicon required. As a result, it can lead to reduction in the capital expenditures associated with polysilicon refining and wafer fabrication, which together are more than half of the total capital expenditure to manufacture Si PV module. We focused our efforts on developing the tools needed to enable high yield fabrication of wafer, cell, and module with thin silicon wafers. However, as the wafer thickness reduces, the major challenge is that wafer breakage increases significantly. Three technological areas were explored in this project to improve the production yield of the silicon wafer, namely detection of edge cracks via dark-field near-infrared (NIR) scattering; (2) wafer handling using controlled temperature profiles; (3) manufacturable low-stress cell interconnection for multiwire. First, the formation of wafer cracks in submillimeter length is one of the reasons that causes wafer breakages. Crack detection tools are needed to enable us to locate and track the wafer crack during manufacturing, so that we can improve the process to reduce initialization. The state-of-the-art crack detection technique cannot fulfill the need for measuring submillimeter edge cracks detrimental for thin wafers. The prototype developed in this project demonstrates the scanning of microcracks near wafer edges. With a semi-automatic laboratory setup, the submillimeter cracks were reliably detected near the edges in multi-Si wafers. The smallest detectable crack is 200 µm in length in slow scans; and submillimeter cracks are detected in high-throughput scans at the scan speed of >0.5 m/s, which is compatible with the inline detection of a manufacturing line at least 1 sec/wafer. This detection limit is a significant advancement in comparison to the benchmarked industrial tool. Second, wafer handling with the well-controlled temperature profile was thought to be the solution to reduce crack initiation and propagation during the manufacturing. However, without crack detection being widely adopted in production line, we did not find a strong industrial pull toward this technology. We did an initial literature survey and then diverted our efforts to the other tasks. Third, the innovation on low-stress multi-wire interconnection tackles a fundamental problem in the standard interconnection scheme. The standard over-under “zig-zag” interconnection induces a significant amount of stress into the soldering point on the cell whenever PV module is under stress, e.g., thermal cycling, transportation, and installation. Therefore, the interconnection process was re-designed in this project to allow for significant movement between adjacent solar cells, e.g., due to thermal expansion, without building up stresses on the solar cells or solder joints. The new interconnection method with the cross-connect wire also simplifies the tabbing and stringing process by replacing the standard over-under method with an off-cell interconnect from top to bottom. A manual tabbing and stringing tool for this new process was prototyped in the lab to demonstrate the fabrication of this new interconnection design. During the test with brass sheets as our “testing cells”, it was found that the mechanical cycling test only broke the interconnection after more than 50,000 cycles, which is equivalent to more than 130 years of the day-and-night thermal cycles. Lastly, throughout the project, we continuously analyzed the PV market with techno-economic analysis to identify the opportunity for thin Si adoption. Even though the drastic cost reduction has already happened in the past five years, our analysis results indicated that we can still save quite significantly in both manufacturing cost and factory capex, Particularly, in order to grow the PV manufacturing capacity to multi-terawatt level, reducing the thickness of silicon wafer is one of the most effective ways to quickly reduce factory capex, and sustain the high growth rate. The technologies developed in this project are readily available to provide some assistances in tackling the production yield problem.

14 SOLAR ENERGY↗

SMAnalytics Automated Shape Memory Test Analysis Software User's Manual: UCFTC, UPER, and DSC Test Methods, Version 1.0.2

Over the course of 60 years of shape memory alloy research and development, the properties of these alloys have been measured using various testing methods, which are often customized by the organization performing the test. However, commercial adoption of shape memory alloys in aeronautic actuator applications requires reducing property uncertainty through standardizing test methods. Historically, differential scanning calorimetry (DSC) has been used to measure transformation temperatures under stress-free conditions. This testing method is well established, and tests are run under the applicable standard, ASTM F2004-17: Standard Test Method for Transformation Temperature of Nickel-Titanium Alloys by Thermal Analysis. Two other test methods for measuring strains and transformation temperatures under constant load or free recovery after prestraining have only recently been standardized—ASTM E3097: Standard Test Method for Mechanical Uniaxial Constant Force Thermal Cycling of SMAs (UCFTC) and ASTM E3098: Standard Test Method for Mechanical Uniaxial Pre-Strain and Thermal Free Recovery of SMAs (UPFR). These standards represent a critical step forward in producing reliable material property data for the use of these alloys in aeronautics and other commercial areas. However, no standard programs or software packages were previously available for postprocessing UCFTC- and UPFR-type test data to extract property data. Each organization that performed the testing analyzed data using its own custom manual methods, such as using a plot and a straight edge, spreadsheet plotting methods, or custom code routines, to extract the required values for strains, stresses, and transformation temperatures. SMAnalytics represents the first publicly available uniform software package for processing data generated using the DSC, UCFTC, and UPFR test methods, as well as many modifications of these methods, including loading in martensite versus austenite and performing multiple thermal cycles at stress. In doing so, it provides a tool for reducing potential error or variability in the measured values due to the precision of the technique used and person-to-person variability. It is also expected that this automated data-parsing tool can accelerate the data analysis phase of the test campaign, especially for large data files. This User’s Manual describes how the SMAnalytics software works and the method for its use.

Shape Memory Alloy↗

Thermal expansion compatibility of ceramic chip capacitors mounted on alumina substrates.

The thermal expansion coefficients of a representative sample of BaTiO3 and TiO2 ceramic chip capacitors and alumina substrates have been examined. These data have revealed large potential mechanical stresses under thermal cycling. A mathematical analysis of a composite model of the capacitor to predict the thermal expansion and modulus of elasticity and an analysis of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. In all cases studied, thermally induced stresses great enough to cause capacitor body rupture or termination failure was predicted.

Allen, R. V.↗

Influence of Test Procedures on the Thermomechanical Properties of a 55NiTi Shape Memory Alloy

Over the past few decades, binary NiTi shape memory alloys have received attention due to their unique mechanical characteristics, leading to their potential use in low-temperature, solid-state actuator applications. However, prior to using these materials for such applications, the physical response of these systems to mechanical and thermal stimuli must be thoroughly understood and modeled to aid designers in developing SMA-enabled systems. Even though shape memory alloys have been around for almost five decades, very little effort has been made to standardize testing procedures. Although some standards for measuring the transformation temperatures of SMA s are available, no real standards exist for determining the various mechanical and thermomechanical properties that govern the usefulness of these unique materials. Consequently, this study involved testing a 55NiTi alloy using a variety of different test methodologies. All samples tested were taken from the same heat and batch to remove the influence of sample pedigree on the observed results. When the material was tested under constant-stress, thermal-cycle conditions, variations in the characteristic material responses were observed, depending on test methodology. The transformation strain and irreversible strain were impacted more than the transformation temperatures, which only showed an affect with regard to applied external stress. In some cases, test methodology altered the transformation strain by 0.005-0.01mm/mm, which translates into a difference in work output capability of approximately 2 J/cu cm (290 in!lbf/cu in). These results indicate the need for the development of testing standards so that meaningful data can be generated and successfully incorporated into viable models and hardware. The use of consistent testing procedures is also important when comparing results from one research organization to another. To this end, differences in the observed responses will be presented, contrasted and rationalized, in hopes of eventually developing standardized testing procedures for shape memory alloys.

Padula, Santo A., II↗

Improving Ni-Based SOFC Anode Resilience and Durability through Secondary Phase Formation

The project used a multi-disciplinary approach to test test if 2° materials, added to traditional cermet components, enhanced SOFC mechanical strength, anode resilience and durability when subjected to electrochemical and environmental redox cycling. Findings from fracture testing, electrochemical studies and operando Raman spectroscopy measurements demonstrated that aluminum titanate (Al 2 TiO 5 or ALT) mechanically mixed with NiO-YSZ cermets confers superior mechanical strength and slower degradation rates under polarization. No deleterious effects from ALT in conversion efficiency were observed. Specific accomplishments included the following: (1) Refined methods used to fabricate ALT enhanced anodes into bi-layer anode supports to achieve high power densities; (2) Compared the effects of adding ALT mechanically to Ni-YSZ powders prior to anode fabrication with adding ALT through infiltration and co-infiltration of YSZ scaffolds; (3) Tested the resilience of these novel materials to electrochemical and environmental redox cycling and thermal stresses commonly encountered in functioning SOFCs; and (4) Characterized the ability of ALT to improve the carbon tolerance of Ni-YSZ anodes operating with dry methane.

01 COAL, LIGNITE, AND PEAT↗

Photogrammetric Metrology for the James Webb Space Telescope Integrated Science Instrument Module

The James Webb Space Telescope (JWST) is a 6.6m diameter, segmented, deployable telescope for cryogenic IR space astronomy (approximately 40K). The JWST Observatory architecture includes the Optical Telescope Element and the Integrated Science Instrument Module (ISIM) element that contains four science instruments (SI) including a Guider. The ISM optical metering structure is a roughly 2.2x1.7x2.2m, asymmetric frame that is composed of carbon fiber and resin tubes bonded to invar end fittings and composite gussets and clips. The structure supports the SIs, isolates the SIs from the OTE, and supports thermal and electrical subsystems. The structure is attached to the OTE structure via strut-like kinematic mounts. The ISIM structure must meet its requirements at the approximately 40K cryogenic operating temperature. The SIs are aligned to the structure's coordinate system under ambient, clean room conditions using laser tracker and theodolite metrology. The ISIM structure is thermally cycled for stress relief and in order to measure temperature-induced mechanical, structural changes. These ambient-to-cryogenic changes in the alignment of SI and OTE-related interfaces are an important component in the JWST Observatory alignment plan and must be verified. We report on the planning for and preliminary testing of a cryogenic metrology system for ISIM based on photogrammetry. Photogrammetry is the measurement of the location of custom targets via triangulation using images obtained at a suite of digital camera locations and orientations. We describe metrology system requirements, plans, and ambient photogrammetric measurements of a mock-up of the ISIM structure to design targeting and obtain resolution estimates. We compare these measurements with those taken from a well known ambient metrology system, namely, the Leica laser tracker system. We also describe the data reduction algorithm planned to interpret cryogenic data from the Flight structure. Photogrammetry was selected from an informal trade study of cryogenic metrology systems because its resolution meets sub-allocations to ISIM alignment requirements and it is a non-contact method that can in principle measure six degrees of freedom changes in target location. In addition, photogrammetry targets can be readily related to targets used for ambient surveys of the structure. By thermally isolating the photogrammetry camera during testing, metrology can be performed in situ during thermal cycling. Photogrammetry also has a small but significant cryogenic heritage in astronomical instrumentation metrology. It was used to validate the displacement/deformation predictions of the reflectors and the feed horns during thermal/vacuum testing (90K) for the Microwave Anisotropy Probe (MAP). It also was used during thermal vacuum testing (100K) to verify shape and component alignment at operational temperature of the High Gain Antenna for New Horizons. With tighter alignment requirements and lower operating temperatures than the aforementioned observatories, ISIM presents new challenges in the development of this metrology system.

Nowak, Maria↗

Neutron irradiation & thermomechanical experiment (NITE) - design

For the reliable long-term operation of fusion power plants, it is crucial to understand and predict the lifetime of materials in use. These materials include all structural and functional materials utilized at the first wall, blanket, magnets, and shielding. The key challenge is, that the harsh environment including high heat fluxes, high thermal stress and stress cycling, neutron irradiation, and sputtering on such materials should not be viewed separately. Currently, the synergistic loads cannot be evaluated experimentally because of the lack of adequate facilities. The purpose of that work is to design a synergetic Neutron Irradiation and Thermomechanical Experiment (NITE) for fusion materials. This design will leverage the existing Advanced-Test-Reactor (ATR), a fission reactor at the Idaho National Laboratory. We also acknowledge that with existing fission reactors the exact fusion condition cannot be created, and the limitations are critically discussed. The combination of neutron irradiation with a high heat flux is the focus. This is realized with an irradiation capsule design that includes a TRISO fueled region inside the capsule to enable a steady-state heat flux on one side of the specimen. In conclusion, the experimental design modeling showed that steady-state heat fluxes of 2.4 MW/m 2 with a thermal gradient of above 250°C can be achieved in a 5 mm thick specimen.

70 - PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Environmental barrier coatings on enhanced roughness SiC: Effect of plasma spraying conditions on properties and performance

Environmental barrier coatings for SiC/SiC composites are limited by the melting temperature of the Si bond coating near 1414°C. Systems without a bond coating may be required for future turbine applications where material temperatures go beyond 1350 °C. Here, enhanced roughness SiC substrates were developed to assess coating adhesion without the bond coating. Two EBCs with different YbMS/YbDS ratios were produced via modified plasma spraying parameters. Coating microstructure, thermal expansion, and modulus were measured for comparison of coating properties. Cyclic steam exposures at 1350°C were performed to assess oxidation resistance. The EBC with increased concentration of Yb 2 SiO 5 secondary phase displayed a higher CTE, which is typically expected to decrease adhesion lifetimes due to an increase in stress upon thermal cycling. Yet, the EBC chemistry with increased Yb 2 SiO 5 concentration was able to experience longer cycling times prior to coating delamination, likely due to interface interactions with the substrate and the thermally grown oxide.

36 MATERIALS SCIENCE↗