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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 361 records · Page 20
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Earpiece with sensors to measure/monitor multiple physiological variables

An apparatus and method for positioning sensors relative to one another and anatomic features in a non-invasive device for measuring and monitoring multiple physiological variables from a single site uses an earpiece incorporating a shielded pulse oximetry sensor (POS) having a miniaturized set of LEDs and photosensors configured for pulse oximetry measurements in the reflectance mode and located in the earpiece so as to position the POS against a rear wall of an ear canal. The earpiece also includes a thermopile of no larger than 7 mm. in diameter located on the earpiece to so as to position the thermopile past a second turn of an external auditory meatus so as to view the tympanic membrane. The thermopile includes a reference temperature sensor attached to its base for ambient temperature compensation.

Schulze, Arthur E.↗
NASA NTRS2012

Wind-Tunnel and Flight Test Results for the Measurements of Flow Variables at Supersonic Speeds Using Improved Wedge and Conical Probes

The results of supersonic wind-tunnel tests on three probes at nominal Mach numbers of 1.6, 1.8 and 2.0 and flight tests on two of these probes up to a Mach number of 1.9 are described. One probe is an 8 deg. half-angle wedge with two total-pressure measurements and one static. The second, a conical probe, is a cylinder that has a 15 deg., semi-angle cone tip with one total-pressure orifice at the apex and four static-pressure orifices on the surface of the cone, 90 deg. apart, and about two-thirds of the distance from the cone apex to the base of the cone. The third is a 2 deg. semi-angle cone that has two static ports located 180 deg. apart about 1.5 inches behind the apex of the cone. The latter probe was included since it has been the "probe of choice" for wind-tunnel flow-field pressure measurements (or one similar to it) for the past half-century. The wedge and 15 deg. conical probes used in these tests were designed for flight diagnostic measurements for flight Mach numbers down to 1.35 and 1.15 respectively, and have improved capabilities over earlier probes of similar shape. The 15. conical probe also has a temperature sensor that is located inside the cylindrical part of the probe that is exposed to free-stream flow through an annulus at the apex of the cone. It enables the determination of free-stream temperature, density, speed of sound, and velocity, in addition to free-stream pressure, Mach number, angle of attack and angle of sideslip. With the time-varying velocity, acceleration can be calculated. Wind-tunnel tests of the two probes were made in NASA Langley Research Center fs Unitary Plan Wind Tunnel (UPWT) at Mach numbers of 1.6, 1.8, and 2.0. Flight tests were carried out at the NASA Dryden Flight Research Center (DFRC) on its F-15B aircraft up to Mach numbers of 1.9. The probes were attached to a fixture, referred to as the Centerline Instrumented Pylon (CLIP), under the fuselage of the aircraft. Problems controlling the velocity of the flow through the conical probe required for accurate temperature measurements are noted, as well as some calibration problems of the miniature pressure sensors that required a re-calculation of the flow variables. Data are presented for angle of attack, pressure and Mach number obtained in the wind tunnel and in flight. In the wind tunnel some transient data were obtained by translating the probes through the shock flow field created by a bump on the wind-tunnel wall.

Bobbitt, Percy J.↗
NASA NTRS2000

Atmospheric Dynamics on Venus, Jupiter, and Saturn: An Observational and Analytical Study

Determining the static stability of Jupiter's atmosphere below the visible cloud levels is important for understanding the dynamical modes by which energy and momentum are transported through Jupiter's deep troposphere. The Galileo Probe Atmospheric Structure Investigation (ASI) employed pressure and temperature sensors to directly measure these state variables during the parachute-descent phase, which started at a pressure (p) of 0.4 bars and ended at p= 22 bars. The internal temperature of the probe underwent large temperature fluctuations which significantly exceeded design specifications. Corrections for these anomalous interior temperatures have been evaluated based on laboratory data acquired after the mission using the flight spare hardware. The corrections to the pressure sensor readings was particularly large and the uncertainties in the atmospheric pressures derived from the p sensor measurements may still be significant. We have sought to estimate the formal uncertainties in the static stability derived from the p and T sensor measurements directly and to devise means of assessing the static stability of Jupiter's atmosphere which do not rely on the p sensor data.

Bridger, Alison↗
DOE OSTI2026

Measured Indoor Nitrogen Oxides in Homes with a Child with Asthma and Gas or Induction Electric Cooking

The Cooking Energy and Ventilation Impacts on Children's Asthma (CEVICA) study is a randomized control trial investigating the effects of replacing gas with induction electric ranges in the homes of children with asthma in California's San Joaquin Valley. Indoor air quality parameters and respiratory health indicators were measured over 2-week intensive at Baseline and after consecutive 3-month study phases, with half getting electric cooking at the start of Phase 1 and others in Phase 2. Indoor air measurements included time-integrated NO 2 and NO X by passive sampler and time-resolved NO 2 by electrochemical sensors. In the first 40 homes, data were collected during 61 intensives for gas cooking and 55 for induction. Cooking was identified using temperature sensors above the cooktop. Pollutant events were identified from sharp rises in concentrations Time integrated NOX species were lower with electric cooking, with mean differences of 14.2 ppb for NO 2 (95% CI: 9.6, 18.7; p < 0.001), 55.6 ppb for NO X (95% CI: 30.4, 80.9; p < 0.001), and 41.5 ppb for derived NO (95% CI: 19.7, 63.2; p < 0.001). A paired, within home analysis showed larger reductions in Group 2 (gas to induction) than Group 1 that remained electric across Phase 1 and Phase 2 for NO 2 (mean difference in As of 10.5 ppb; 95% CI: 5.6, 15.4; p < 0.001), NO X (32.3 ppb; 95% CI: 10.0, 54.5; p=0.007), and derived NO (21.8 ppb; 95% CI: 3.6, 40.0; p=0.022). Compared to electric cooking, gas had much higher rates of associated NO 2 events, and larger above-baseline NO 2 peaks. These preliminary results are consistent with prior findings that shifting to induction cooking can substantially lower indoor NO 2 compared with gas cooking.

Fang, Yi↗
DOE OSTI2026

Tussock tundra surface temperatures, ambient air and incoming photosynthetically active radiation measured at the NGEE Arctic Council site, 2021 - 2023

This dataset contains temperature measurements carried out along two fiber optics cables/lines (150 m each) laid out along the ground at the Next Generation Ecosystem Experiment (NGEE) Arctic site near Council, Alaska. The lines traverse an heterogeneous part of the tussock tundra site including thermokarst features and lichen dominated sections of the tundra. Measurements were done using a Sensornet Oryx DTS, a Distributed Temperature sensor that was installed in September 2021 and taken down in August 2023. The sensor was powered by solar power with data being collected every 30 minutes at 1 m resolution. In addition to these measurements air temperature and incoming photosynthetically active radiation (PAR) are provided. These measurements are co-located with the NGEE Arctic Council eddy flux and meteorological station (AmeriFlux ID US-NGC). Included are six *.csv files (four data files and two reporting format files) and two *.kml files. The Next-Generation Ecosystem Experiments: Arctic (NGEE Arctic), was a research effort to reduce uncertainty in Earth System Models by developing a predictive understanding of carbon-rich Arctic ecosystems and feedbacks to climate. NGEE Arctic was supported by the Department of Energy's Office of Biological and Environmental Research. The NGEE Arctic project had two field research sites: 1) located within the Arctic polygonal tundra coastal region on the Barrow Environmental Observatory (BEO) and the North Slope near Utqiagvik (Barrow), Alaska and 2) multiple areas on the discontinuous permafrost region of the Seward Peninsula north of Nome, Alaska. Through observations, experiments, and synthesis with existing datasets, NGEE Arctic provided an enhanced knowledge base for multi-scale modeling and contributed to improved process representation at global pan-Arctic scales within the Department of Energy's Earth system Model (the Energy Exascale Earth System Model, or E3SM), and specifically within the E3SM Land Model component (ELM).

Air temperature↗
NASA NTRS2012

Phase Change Material for Temperature Control of Loop Heat Pipe Compensation Chamber

The compensation chamber (CC) of a loop heat pipe (LHP) requires a stable temperature. In the current technology, the CC is commonly cold biased by exposing it to deep space, and active heater control is used to maintain its temperature stable. Heater power required for a typical LHP with a 300 W heat transport capacity is as much as 25 W. If multiple LHPs are used, heater power requirement could be a bigger issue. Also heater controller or temperature sensor failure could lead to a LHP or mission failure. This paper presents an innovative concept of using phase change material (PCM) for temperature control of LHP CC. Some of the electronics and/or detector assembly waste heat is stored in the PCM and transferred to the LHP CC by constant conductance heat pipes (CCHPs). Phase change of the PCM occurs at a constant temperature and maintains the LHP CC temperature stable. It eliminates heater power and active heater control for the CC. It also increases the reliability of LHP.

Choi, Michael K.↗
NASA NTRS1997

Design and Checkout of a High Speed Research Nozzle Evaluation Rig

The High Flow Jet Exit Rig (HFJER) was designed to provide simulated mixed flow turbojet engine exhaust for one- seventh scale models of advanced High Speed Research test nozzles. The new rig was designed to be used at NASA Lewis Research Center in the Nozzle Acoustic Test Rig and the 8x6 Supersonic Wind Tunnel. Capabilities were also designed to collect nozzle thrust measurement, aerodynamic measurements, and acoustic measurements when installed at the Nozzle Acoustic Test Rig. Simulated engine exhaust can be supplied from a high pressure air source at 33 pounds of air per second at 530 degrees Rankine and nozzle pressure ratios of 4.0. In addition, a combustion unit was designed from a J-58 aircraft engine burner to provide 20 pounds of air per second at 2000 degrees Rankine, also at nozzle pressure ratios of 4.0. These airflow capacities were designed to test High Speed Research nozzles with exhaust areas from eighteen square inches to twenty-two square inches. Nozzle inlet flow measurement is available through pressure and temperature sensors installed in the rig. Research instrumentation on High Speed Research nozzles is available with a maximum of 200 individual pressure and 100 individual temperature measurements. Checkout testing was performed in May 1997 with a 22 square inch ASME long radius flow nozzle. Checkout test results will be summarized and compared to the stated design goals.

Castner, Raymond S.↗
NASA NTRS2018

Silicon Carbide Pressure Sensors for Venus Environment

We report on the evaluation of 4H-SiC piezoresistive pressure sensors in the simulated Venus environment of the NASA Glenn Extreme Environments Rig (GEER). The purpose of the evaluation was to determine the survivability of the pressure and temperature sensors and ancillary packaging components when subjected to the high pressure and aggressive chemical media that are characteristic of the Venus environment. Interest in Venus has been stimulated by the ongoing debate about Earth's planetary evolution, particularly in regards to its climate, and NASA has proposed a flagship mission to Venus to be launched in the near future. Quantifying how the Venus evo-lution ran its course will greatly aid researchers trying to model Earth's climate dynamics.

high temperature↗
NASA NTRS1991

A pointable, helicopter-based remote sensing data acquisition system for collecting bidirectional reflectance data

Discussed here is a new configuration of a helicopter-borne remote sensing system to support field measurements programs such as studies of forest decline damage associated with atmospheric deposition and the Forest Ecosystems Dynamics project. In this new configuration, the sensor payload is mounted externally on a hinged pallet located on the starboard side of the Bell Iroquois UH-1B (HUEY) helicopter. The sensor payload includes a set of bore-sighted instruments consisting of a Barnes Modular Multiband Radiometer (MMR), a Spectron Engineering (SE) 590 spectroradiometer, an Everest infrared temperature sensor, and a Sony CCD video camera with a 10x zoom lens. The system was tested and excellent data was acquired in 1990.

Williams, Darrel L.↗
NASA NTRS1995

Diamond thin film temperature and heat-flux sensors

Diamond film temperature and heat-flux sensors are developed using a technology compatible with silicon integrated circuit processing. The technology involves diamond nucleation, patterning, doping, and metallization. Multi-sensor test chips were designed and fabricated to study the thermistor behavior. The minimum feature size (device width) for 1st and 2nd generation chips are 160 and 5 micron, respectively. The p-type diamond thermistors on the 1st generation test chip show temperature and response time ranges of 80-1270 K and 0.29-25 microseconds, respectively. An array of diamond thermistors, acting as heat flux sensors, was successfully fabricated on an oxidized Si rod with a diameter of 1 cm. Some problems were encountered in the patterning of the Pt/Ti ohmic contacts on the rod, due mainly to the surface roughness of the diamond film. The use of thermistors with a minimum width of 5 micron (to improve the spatial resolution of measurement) resulted in lithographic problems related to surface roughness of diamond films. We improved the mean surface roughness from 124 nm to 30 nm by using an ultra high nucleation density of 10(exp 11)/sq cm. To deposit thermistors with such small dimensions on a curved surface, a new 3-D diamond patterning technique is currently under development. This involves writing a diamond seed pattern directly on the curved surface by a computer-controlled nozzle.

Aslam, M.↗
NASA NTRS2000

Free-Flying Magnetometer Data System

The Free-Flying Magnetometer (FFM) is an autonomous "sensorcraft" developed at the Jet Propulsion Laboratory (JPL) for the Enstrophy sounding rocket mission. This mission was a collaborative project between the University of New Hampshire, Cornell University and JPL. The science goal of the mission was the study of current filamentation phenomena in the northern auroral region through multipoint measurements of magnetic field. The technical objective of the mission was the proof of concept of the JPL FFM design and the demonstration of an in-situ multipoint measurement technique employing many free-flying spacecraft. Four FFMs were successfully deployed from a sounding rocket launched from Poker Flats, Alaska on February 11, 1999. These hockey-puck-sized (80 mm diameter, 38 mm. height, 250 gram mass) free flyers each carry a miniature 3-axis flux-gate magnetometer that output +/- 2 V signals corresponding to a +/- 60,000 nT measurement range for each axis. The FFM uses a synchronized four-channel Sigma(Delta) Analog-to-Digital Converter (ADC) having a dynamic range of +/- 2.5V and converting at a rate of 279 samples/second/channel. Three channels are used to digitize the magnetometer signals to 17-bit (1.144 nT/bit) resolution. The fourth ADC channel is multiplexed for system monitoring of four temperature sensors and two battery voltages. The FFM also contains two sun sensors, a laser diode which emits a fan-shaped beam, a miniature S-band transmitter for direct communication to the ground station antennas, an ultra-stable Temperature Compensated Crystal Oscillator (TCXO) clock, an integrated data subsystem implemented in a Field-Programmable Gate Array (FPGA), a 4 Mbit Static Random Access Memory (SRAM) for data storage and Lithium Thionyl Chloride batteries for power. Communicating commands to the FFM prior to deployment is achieved with an infrared (IR) link. The FFM IR receiver responds to 9-bit pulse coded signals that are generated by an IR Light Emitting Diode (LED) in the payload for turning FFM power on or off and placing the FFM in a test mode or flight mode. The IR links are also used to synchronize (zero) the clocks onboard all the FFMs through a reset pulse originating from the payload GPS receiver that is issued when the FFMs are in flight mode. The FPGA based data subsystem manages continuous data collection from the four ADC channels and sun sensors, formatting and storing the data to SRAM, and controlling downlink transmission. The transmitter is powered only after a 2547 frame SRAM buffer has been filled (approx. 5 minutes of data). The data is Viterbi encoded and sent to the S-band transmitter via a First-In-First-Out (FIFO) buffer who's output is clocked at 100 bits/second. After the 26-second transmission, the transmitter is turned off to reduce noise coupling to the sensitive magnetometer. The data subsystem control consists of a master state machine that performs data flow management and is interfaced through a prioritized interrupt scheme to state machines that service the ADC, sun sensors and transmitter FIFO. Continuous data collection prevents the missing of data during transmission and provides implicit time tagging of the data acquired by the ADC because of synchronization with the TCXO clock.

Blaes, B.↗
DOE OSTI2025

Local heat transfer measurement in a volumetrically heated TPMS lattice using distributed optical fiber thermal sensing

As additive manufacturing continues to reduce design constraints on heat exchange geometries, methods for high-fidelity local heat transfer measurements in nonconventional channel geometries are critical to their continued development. This study presents a novel method for measuring local heat transfer performance in volumetrically heated lattices using a distributed optical fiber temperature sensor. A diamond-type triply periodic minimal surface (TPMS) lattice, 3D-printed from a conductive polymer, was Joule heated while it was convectively cooled with air. Temperature measurements were taken at the solid–fluid interface across 14 internal locations using a single optical fiber over the Reynolds number range 800–2750. The TPMS lattice achieved up to 312% higher heat transfer coefficients compared to developing flow in a straight tube. A Nusselt number correlation was developed for the diamond TPMS, which showed good agreement with data collected for comparable geometries available in literature. In conclusion, this study presents a robust and new method for experimental measurement of the heat transfer coefficient in complex geometries and helps to understand and quantify the exceptional performance of TPMS heat transfer geometries.

TPMS↗
NASA NTRS2008

Thermal (Silicon Diode) Data Acquisition Systems

Marshall Space Flight Center s X-ray Cryogenic Facility (XRCF) has been performing cryogenic testing to 20 Kelvin since 1999. Two configurations for acquiring data from silicon diode temperature sensors have been implemented at the facility. The facility's environment is recorded via a data acquisition system capable of reading up to 60 silicon diodes. Test article temperature is recorded by a second data acquisition system capable of reading 150+ silicon diodes. The specifications and architecture of both systems will be presented.

Wright, Ernest↗
NASA NTRS2008

Thermal (Silicon Diode) Data Acquisition System

Marshall Space Flight Center's X-ray Calibration Facility (XRCF) has been performing cryogenic testing to 20 Kelvin since 1999. Two configurations for acquiring data from silicon diode temperature sensors have been implemented at the facility. The facility's environment is recorded via a data acquisition system capable of reading up to 60 silicon diodes. Test article temperature is recorded by a second data acquisition system capable of reading 150+ silicon diodes. The specifications and architecture of both systems will be presented.

Kegley, Jeffrey↗
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature↗
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗
NASA NTRS2011

Distributed Capacitive Sensor for Sample Mass Measurement

Previous robotic sample return missions lacked in situ sample verification/ quantity measurement instruments. Therefore, the outcome of the mission remained unclear until spacecraft return. In situ sample verification systems such as this Distributed Capacitive (DisC) sensor would enable an unmanned spacecraft system to re-attempt the sample acquisition procedures until the capture of desired sample quantity is positively confirmed, thereby maximizing the prospect for scientific reward. The DisC device contains a 10-cm-diameter pressure-sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in close proximity to an opposing rigid substrate with a narrow gap. The deformation of the membrane makes the gap narrower, resulting in increased capacitance between the two parallel plates (elastic membrane and rigid substrate). C-V conversion circuits on a nearby PCB (printed circuit board) provide capacitance readout via LVDS (low-voltage differential signaling) interface. The capacitance method was chosen over other potential approaches such as the piezoelectric method because of its inherent temperature stability advantage. A reference capacitor and temperature sensor are embedded in the system to compensate for temperature effects. The pressure-sensitive membranes are aluminum 6061, stainless steel (SUS) 403, and metal-coated polyimide plates. The thicknesses of these membranes range from 250 to 500 m. The rigid substrate is made with a 1- to 2-mm-thick wafer of one of the following materials depending on the application requirements glass, silicon, polyimide, PCB substrate. The glass substrate is fabricated by a microelectromechanical systems (MEMS) fabrication approach. Several concentric electrode patterns are printed on the substrate. The initial gap between the two plates, 100 m, is defined by a silicon spacer ring that is anodically bonded to the glass substrate. The fabricated proof-of-concept devices have successfully demonstrated tens to hundreds of picofarads of capacitance change when a simulated sample (100 g to 500 g) is placed on the membrane.

Toda, Risaku↗
NASA NTRS1975

Self-regulating proportionally controlled heating apparatus and technique

A self-regulating proportionally controlled heating apparatus and technique is provided wherein a single electrical resistance heating element having a temperature coefficient of resistance serves simultaneously as a heater and temperature sensor. The heating element is current-driven and the voltage drop across the heating element is monitored and a component extracted which is attributable to a change in actual temperature of the heating element from a desired reference temperature, so as to produce a resulting error signal. The error signal is utilized to control the level of the heater drive current and the actual heater temperature in a direction to reduce the noted temperature difference. The continuous nature of the process for deriving the error signal feedback information results in true proportional control of the heating element without the necessity for current-switching which may interfere with nearby sensitive circuits, and with no cyclical variation in the controlled temperature.

Strange, M. G.↗