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At least 379 records · Page 21

Iron Bonding with Light Elements: Implications for Planetary Cores Beyond the Binary System

Light element alloying in iron is required to explain density deficit and seismic wave velocities in Earth’s core. However, the light element composition of the Earth’s core seems hard to constrain as nearly all light element alloying would reduce the density and sound velocity (elastic moduli). The alloying light elements include oxidizing elements like oxygen and sulfur and reducing elements like hydrogen and carbon, yet their chemical effects in the alloy system are less discussed. Moreover, Fe-X-ray Absorption Near Edge Structure (Fe-XANES) fingerprints have been studied for silicate materials with ferrous and ferric ions, while not many X-ray absorption spectroscopy (XAS) studies have focused on iron alloys, especially at high pressures. To investigate the bonding nature of iron alloys in planetary interiors, we presented X-ray absorption spectroscopy of iron–nitrogen and iron–carbon alloys at high pressures up to 50 GPa. Together with existing literature on iron–carbon, –hydrogen alloys, we analyzed their edge positions and found no significant difference in the degree of oxidation among these alloys. Pressure effects on edge positions were also found negligible. Our theoretical simulation of the valence state of iron, alloyed with S, C, O, N, and P also showed nearly unchanged behavior under pressures up to 300 GPa. This finding indicates that the high pressure bonding of iron alloyed with light elements closely resembles bonding at the ambient conditions. We suggest that the chemical properties of light elements constrain which ones can coexist within iron alloys.

Advanced Photon Source↗

New method forms bond line free of voids

A new bonding method using vacuum, pressure and heat, which produces a bond line free of voids, is described. This method is very successful in bonding ablation shields to a magnesium structural component in simulated reentry tests involving great heat and air turbulence.

King, C. B.↗

Ultrasonic emission method enables testing of adhesive bonds

Detection of acoustic energy emitted by adhesive bonds subjected to tensile stresses at frequencies above sixteen kilocycles per second is used as a method for determining bond strength. This method is used in measuring adhesive bond strengths on metal honeycomb core panels.

Frank, L.↗

Welding, bonding, and sealing of refractory metals by vapor deposition

Plating process welds, bonds, and seals refractory metals without weakening or changing the structure of the base metals. A metal halide compound in the vapor phase is decomposed to deposit filler metal on the base metal. The resulting bond is a true metal-to-metal bond.

Source record↗

Quick-set temporary bonding clamps

Method of bonding materials to a flat surface eliminates the use of bolts to hold the pieces together. Two adhesives are used, the primary or permanent bonding material and a quick setting adhesive. No permanent after effects are left on the surfaces to which the materials are bonded.

Baker, C. D.↗

Explosive bonding of metal-matrix composites

Explosive bonding process produces sheet composites of aluminum alloy reinforced by high-strength stainless steel wires. The bonds are excellent metallurgically, no external heat is required, various metals can be bonded, and the process is inexpensive.

Reece, O. Y.↗

Inorganic bonding of semiconductor strain gages

Inorganic bonding materials minimize outgassing and improve electrical and mechanical properties of semiconductor strain-gage transducers in high-vacuum and high-temperature operations. The two basic methods described are ceramic-glass-bonding and metallic bond formation between the strain gage and the substrate.

Woodruff, N. L.↗

Bonding and Joining Technology: a Compilation

A collection of articles concerning the methods and uses of aerospace bonding and joining techniques in industrial processes is presented. Data include methods to bond and join metal components, joining techniques for adhesive materials, and shop hints for bonding and joining a variety of other items and materials.

Source record↗

Low-cost fabrication and direct bond installation of flat, single-curvature and compound-curvature ablative heat shield panels

Procedures for low cost fabrication and direct bond installation of flat, single curved, and compound curvature ablative heat shields on a DC-3 aircraft are discussed. The panel sizes and attachment locations are identified. In addition to the bonding of the four contoured panels, two flat panels were bonded to the nearly flat, lower surface of the center wing section. The detailed requirements and objectives of the investigation are described.

Norwood, L. B.↗

Diffusion bonded columbium panels for the shuttle heat shield.

Work at North American Rockwell in the development of a satisfactory panel diffusion bonding method for Nb shuttle orbiter heat shield panel designs is reviewed. The topics include the diffusion bonding process, panel fabrication and quality control. A practicable Nb alloy diffusion bonding method, using a Ti foil interleaf, is described and is characterized as one providing a production basis at competitive cost.

Korb, L. J.↗

Energy pulse bonding

To eliminate many of the present termination problems a technique called energy pulse bonding (EPB) was developed. The process demonstrated the capability of: (1) joining conductors without prior removal of insulations, (2) joining conductors without danger of brittle intermetallics, (3) increased joint temperature capability, (4) simultaneous formation of several bonds, (5) capability of higher joint density, and (6) a production oriented process. The following metals were successfully bonded in the solid state: copper, beryllium copper, phosphor bronze, aluminum, brass, and Kovar.

Smith, G. C.↗

Adhesive-bonded double-lap joints

Explicit analytical solutions are derived for the static load carrying capacity of double-lap adhesive-bonded joints. The analyses extend the elastic solution Volkersen and cover adhesive plasticity, adherend stiffness imbalance and thermal mismatch between the adherends. Both elastic-plastic and bi-elastic adhesive representations lead to the explicit result that the influence of the adhesive on the maximum potential bond strength is defined uniquely by the strain energy in shear per unit area of bond. Failures induced by peel stresses at the ends of the joint are examined. This failure mode is particularly important for composite adherends. The explicit solutions are sufficiently simple to be used for design purposes

Hart-Smith, L. J.↗

Bonded joint and method

An improved joint is described for reducing the peak shear stress in adhesive bonds when adhesives are used to bond two materials which are in a lapped relationship and which differ in value of modulus of elasticity. An insert placed between the adhesive and one of the two materials acts to cushion the discontinuity of material stiffness thereby reducing the peak shear stress in the adhesive bond.

Sainsbury-Carter, J. B.↗

Holographic and ultrasonic detection of bond flaws in aluminum panels reinforced with boron-epoxy

An experimental investigation was made of the application of holographic interferometry to the nondestructive detection of unbonded areas (flaws) in bonded panels. Flaw detection results were compared with results obtained with an ultrasonic flaw detector. Holography, with panel deformation accomplished by a reduction in ambient pressure, is less sensitive for flaws beneath 5 and 10 plies of boron-epoxy than the ultrasonic method, though it does have its operational advantages. A process for the manufacture of bonded panels which incorporate known unbonded areas was also developed. The unbonded areas were formed without the use of foreign materials, which makes the method suitable for the construction of reference standards for bonded panels whenever needed for the proper setup of ultrasonic flaw-detection instruments.

Platt, R. J., Jr.↗

Adhesive bonding and the use of corrosion resistant primers

The use of an anti-corrosive primer has been shown to be essential to assure survival of a bonded structure in a hostile environment, particularly if a stress is to be applied to the adhesively bonded joint during the environmental exposure. For example, the Lockheed L-1011 TriStar assembly, after exhaustive evaluation tests specifies use of chromate filled inhibitive polysulfide sealants, and use of corrosion inhibiting adhesive primers prior to structural bonding with film adhesive.

Hockridge, R. R.↗

Bonded composite to metal scarf joint performance in an aircraft landing gear drag strut

The structural performance of a boron-epoxy reinforced titanium drag strut, which contains a bonded scarf joint and was designed to the criteria of the Boeing 747 transport, was evaluated. An experimental and analytical investigation was conducted. The strut was exposed to two lifetimes of spectrum loading and was statically loaded to the tensile and compressive design ultimate loads. Throughout the test program no evidence of any damage in the drag strut was detected by strain gage measurements, ultrasonic inspection, or visual observation. An analytical study of the bonded joint was made using the NASA structural analysis computer program NASTRAN. A comparison of the strains predicted by the NASTRAN computer program with the experimentally determined values shows excellent agreement. The NASTRAN computer program is a viable tool for studying, in detail, the stresses and strains induced in a bonded joint.

Howell, W. E.↗

Bonding of sapphire to sapphire by eutectic mixture of aluminum oxide and zirconium oxide

Bonding of an element comprising sapphire, ruby or blue sapphire to another element of such material with a eutectic mixture of aluminum oxide and zirconium oxide is discussed. The bonding mixture may be applied in the form of a distilled water slurry or by electron beam vapor deposition. In one embodiment the eutectic is formed in situ by applying a layer of zirconium oxide and then heating the assembly to a temperature above the eutectic temperature and below the melting point of the material from which the elements are formed. The formation of a sapphire rubidium maser cell utilizing eutectic bonding is shown.

Deluca, J. J.↗

Organopolysiloxane-bonded graphite fluoride as a solid lubricant

A study was conducted on the lubricating properties of organopolysiloxane-bonded graphite fluoride (CF sub 1.1) sub n films. The effects of temperature, atmosphere, composition of organopolysiloxane, and burnishing additional (CF sub 1.1) sub n powder onto the film surface were studied. For comparison, similar experiments were conducted on organopolysiloxane-bonded MoS2 films. The results are equivalent for both films, except that in a moist air environment the wear lives of the films formulated with (CF sub 1.1) sub n are up to 10 times longer than the wear lives of the MoS2-formulated films. Comparison to other (CF sub 1.1) sub n films showed organopolysiloxane films to give better lubrication results than hand-burnished (CF sub 1.1) sub n films but not as good as polyimide-bonded (CF sub 1.1) sub n films.

Fusaro, R. L.↗