Rf-sputtered cadmium sulfide 'thin crystals'
RF-sputtered CdS thin films structural and electrical characteristics from X ray diffractometer tracings, reflection electron diffraction and X ray double crystal spectrometry
Lagnado, I.↗
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Friction characteristics of sputtered solid film lubricants
Solid film lubricants deposited by DC and RF sputtering on metal and glass surfaces, determining friction characteristics by electron microscopy
Spalvins, T.↗
Space Measurements of the Contamination of Surfaces by OGO-6 Outgassing and Their Cleaning by Sputtering and Desorption
OGO-6 surface contamination by outgassing in space environment and decontamination by sputtering and desorption
Corbin, W. E., Jr.↗
Lubrication with sputtered MoS2 films
Friction experiments in ultrahigh vacuum to evaluate sputtered MoS2 film lubricants
Spalvins, T.↗
Sputtered fuel cell electrodes
Fuel cell electrodes preparation by sputtering thin Ta and Pt layers on porous Vycor
Asher, W. J.↗
Sputtering techniques for controlling composition of thin films of high-T sub c superconducting compounds
High transition temperature superconducting materials thin films composition control by sputtering from hot pressed powder mixture ingots targets
Gavaler, J. R.↗
Sputter etching of hemispherical bearings
Technique was developed for fabricating three dimensional pumping grooves on gas bearings by sputter etching. Method eliminates problems such as groove nonuniformity, profile, and finish, which are associated with normal grooving methods.
Schiesser, R. J.↗
X-ray photoelectron spectroscopic studies of valence states produced by ion-sputtering reduction.
Some preliminary results are presented of X-ray photoelectron spectroscopic measurements of various valence states of Fe and Cu in several compounds using a novel method, ion-sputtering reduction. The potential usefulness of this method for other chemical-physical studies such as multiplet splitting, shakeup satellites, and isoelectronic shifts is emphasized.
Yin, L. I.↗
Sputter erosion and deposition in the discharge chamber of a small mercury ion thruster
A 5 cm diameter mercury ion thruster similar to one tested for 9715 hours was operated approximately 400 hrs each at discharge voltages of 36.6, 39.6, and 42.6 V, with corresponding discharge propellant utilizations of 58, 68, and 70 percent. The observed sputter erosion rates of the internal thruster parts and the anode weight gain rate all rose rapidly with discharge voltage and were roughly in the ratio of 1:3:5 for the three voltages. The combined weight loss of the internal thruster parts nearly balanced the anode weight gain. Hg(+2) ion apparently caused most of the observed erosion.
Power, J. L.↗
Effect of surface topography on structural growth of thick sputtered films
Primarily thick sputtered S-Monel, silver, and 304 stainless steel coatings were deposited on mica, glass, and metal substrates with various surface finishes to investigate the structural growth of the coating by scanning electron microscopy. Compositional changes within the coating were analyzed by X-ray dispersion microscopy. Defects in the surface finish act as preferential nucleation sites and form isolated and complex nodules and various surface overgrowths in the coating. These nodules do not disappear after full annealing. Further, they have undesirable effects on mechanial properties; cracks are initiated at the nodules when the coating is stressed by mechanical forces. These effects are illustrated by micrographs. Nodular growth within a coating can be minimized or eliminated by reducing the surface roughness.
Spalvins, T.↗
Laboratory simulation of processes of evaporation, condensation, and sputtering taking place on the surface of the moon
Study of evaporation, condensation and sputtering on the Moon can provide information on the same processes on other planets, and reveal details of the formation of the lunar regolith. Simulation methods include vacuum evaporation, laser evaporation, and bubbling gas through melts.
M D Nusinov↗
Surface topographical effects on the structural growth of thick sputtered metal and alloy coatings
Thick sputtered S-Monel, silver, and 304 stainless steel coatings were deposited on mica and metal substrates with various surface finishes to investigate the structural growth of the coating by scanning electron microscopy. The geometry and the surface structure of the nodules are characterized. Compositional changes within the coating were analyzed by X-ray dispersion microscopy. Defects in the surface finish (i.e., scratches, inclusions, etc.) act as preferential nucleation sites and form isolated and complex nodules and various surface overgrowths in the coating. The nodule boundaries are very vulnerable to chemical etching and these nodules do not disappear after full annealing. Further, they have undesirable effects on mechanical properties; cracks are initiated at the nodules when the coating is stressed by mechanical forces. These effects are illustrated by micrographs. Nodular growth within a coating can be minimized or eliminated by reducing the surface roughness.
Spalvins, T.↗
Potential of thin, sputtered films as erosion resistant protective coatings, part 1
The characteristics of thin, pyrolytically deposited films for protection of surfaces from oxidation and abrasion are discussed. The limitations of depositing erosion resistant films are described. Environmental tests of first stage compressor blades in a T-58 engine after coating with a thin film were conducted. Photographic examples of the effectiveness of the thin films in protecting the turbine blades are provided. Methods for operating a sputtering system and the equipment used for film deposition are defined.
Gentner, K.↗
Sputtering Holes with Ion Beamlets
Ion beamlets of predetermined configurations are formed by shaped apertures in the screen grid of an ion thruster having a double grid accelerator system. A plate is placed downstream from the screen grid holes and attached to the accelerator grid. When the ion thruster is operated holes having the configuration of the beamlets formed by the screen grid are sputtered through the plate at the accelerator grid.
Byers, D. C.↗
Sputter erosion and deposition in the discharge chamber of a small mercury ion thruster
A 5-cm diameter mercury ion thruster similar to one tested for 9715 hours was operated approximately 400 hrs each at discharge voltages of 36.6, 39.6, and 42.6 V, with corresponding discharge propellant utilizations of 58, 68, and 70 percent. The observed sputter erosion rates of the internal thruster parts and the anode weight gain rate all rose rapidly with discharge voltage and were roughly in the ratio of 1:3:5 for the three voltages. The combined weight loss of the internal thruster parts nearly balanced the anode weight gain. Hg+2 ions apparently caused most of the observed erosion.
Power, J. L.↗
Surface topographical effects on the structural growth of thick sputtered metal and alloy coatings
Thick sputtered S-Monel, silver, and 304 stainless steel coatings were deposited on mica and metal substrates with various surface finishes to investigate the structural growth of the coating by scanning electron microscopy. The geometry and the surface structure of the nodules are characterized. Compositional changes within the coating were analyzed by X-ray dispersion miscroscopy. Defects in the surface finish act as preferential nucleation sites and form isolated and complex nodules and various surface overgrowths in the coating. The nodule boundaries are very vulnerable to chemical etching, and these nodules do not disappear after full annealing. Further, they have undesirable effects on mechanical properties; cracks are initiated at the nodules when the coating is stressed by mechanical forces.
Spalvins, T.↗
Sodium D-line emission from Io - Sputtering and resonant scattering hypothesis
A model is presented in explanation of the observation of sodium D-line emission from Io. The model involves: (1) charged-particle sputtering of sodium from Io's surface, (2) ejection of sodium into a cloud surrounding Io, and (3) resonant scattering of incident sunlight. Observational consequences and tests of the proposed model are also discussed.
Matson, D. L.↗
Sputtered gold mask for deep chemical etching of silicon
Sputtered mask resists chemical attack from acid and has adherence to withstand prolonged submergence in etch solution without lifting from silicon surface. Even under prolonged etch conditions with significant undercutting, gold mask maintained excellent adhesion to silicon surface and imperviousness to acid.
Pisciotta, B. P.↗