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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1974

Contact problem for an elastic reinforcement bonded to an elastic plate

The contact problem for a thin elastic reinforcement bonded to an elastic plate is considered. The stiffening layer is treated as an elastic membrane and the base plate is assumed to be an elastic continuum. The bonding between the two materials is assumed to be either one of direct adhesion or through a thin adhesive layer which is treated as a shear spring. The solution for the simple case in which both the stiffener and the base plate are treated as membranes is also given. The contact stress is obtained for a series of numerical examples. In the direct adhesion case the contact stress becomes infinite at the stiffener ends with a typical square root singularity for the continuum model and behaving as a delta function for the membrane model. In the case of bonding through an adhesive layer the contact stress becomes finite and continuous along the entire contact area.

Erdogan, F.↗
NASA NTRS1975

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. It has been experimentally observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.↗
NASA NTRS1976

Interconnnect and bonding technologies for large flexible solar arrays

Thermocompression bonding and conductive adhesive bonding are developed and evaluated as alternate methods of joining solar cells to their interconnect assemblies. Bonding materials and process controls applicable to fabrication of large, flexible substrate solar cell arrays are studied. The primary potential use of the techniques developed is on the solar array developed by NASA/MSFC and LMSC for solar electric propulsion (SEP) and shuttle payload applications. This array is made up of flexible panels approximately 0.7 by 3.4 meters. It is required to operate in space between 0.3 and 6 AU for 5 years with limited degradation. Materials selected must be capable of enduring this space environment, including outgassing and radiation.

Source record↗
NASA NTRS1976

Two-electron bond-orbital model, 2

The two-electron bond-orbital model of tetrahedrally-coordinated solids is generalized and its application extended. All intrabond matrix elements entering the formalism are explicitly retained, including the direct overlap S between the anion and cation sp3 hybrid wavefunctions. Complete analytic results are obtained for the six two-electron eigenvalues and eigenstates of the anion-cation bond in terms of S, one-electron parameters V2 and V3, and two-electron correlation parameters V4, V5 and V6. Refined formulas for the dielectric constant and the nuclear exchange and pseudodipolar coefficients, as well as new expressions for the valence electron density, polarity of the bond and the cohesive energy, are then derived. The theory gives a good account of the experimentally observed trends in all properties considered and approximate quantitative agreement is achieved for the pseudodipolar coefficient.

Huang, C.↗
NASA NTRS1975

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses has been conducted. It has been observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate has proven to be a determining factor in the prediction of failure in both the indium and tin/lead solder systems. This study has shown that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.↗
NASA NTRS1978

Bonding aluminum beam leads

Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.

Burkett, F. S.↗
NASA NTRS1976

Discrete component bonding and thick film materials study

The bonding reliability of discrete capacitor chips bonded with solders and conductive epoxies was examined along with the thick film resistor materials consisting of iron oxide phosphate and vanadium oxide phosphates. It was concluded from the bonding reliability studies that none of the wide range of types of solders examined is capable of resisting failure during thermal cycling while the conductive epoxy gives substantially lower failure rates. The thick film resistor studies proved the feasibility of iron oxide phosphate resistor systems although some environmental sensitivity problems remain. One of these resistor compositions has inadvertently proven to be a candidate for thermistor applications because of the excellent control achieved upon the temperature coefficient of resistance. One new and potentially damaging phenomenon observed was the degradation of thick film conductors during the course of thermal cycling.

Kinser, D. L.↗
NASA NTRS1976

Argon hydrochloride, Ar.HCl, bond energy by infrared spectroscopy

The infrared absorption of argon (200 to 760 torr) and hydrogen chloride (2 to 6 torr) mixtures is reexamined in the missing Q branch region (spectral region between 2860 and 3010 wavelength/cm) at temperatures ranging from 195 to 298 K. The temperature dependence of two absorption features of the argon hydrogen chloride complex, at 2887 and 2879 wavelength/cm, leads to a bond energy estimate that depends on the assumptions made about the internal degrees of freedom of the complex. It is shown that agreement with experiment can be reached for well depths near 1.2 kcal/mole. This result is relatively insensitive to the choice of the vibrational frequencies and anharmonicities, but does depend on the extent to which the energy level manifolds are truncated to avoid molecular excitation in excess of the bond energy. The bond energy is found to deviate from the commonly accepted value of 0.4 kcal/mole. Possible causes for the discrepancy are considered.

Miziolek, A. W.↗
NASA NTRS1978

Effect of thermal exposure on lubricating properties of polyimide films and polyimide-bonded graphite fluoride films

The effect of thermal exposure on the weight loss, adherence, friction, and wear properties of polyimide films and polyimide bonded graphite fluoride films was investigated. Films bonded to 304 stainless steel or 440C-HT steel were thermally exposed at temperatures of 315 ,345, 370, or 400 C for 100 hours or more and then evaluated, using a pin-on-disk machine, at temperatures of 25, 315, or 345 C in atmospheres of dry or moist air. Polyimide films were brittle after thermal exposure. Polyimide bonded graphite fluoride films had adherence and gave low friction and wear results; thus, they appear to be good candidates for solid lubrication applications where long thermal soaks are prevalent.

Fusaro, R. L.↗
NASA NTRS1978

Adhesive bonding of ion beam textured metals and fluoropolymers

An electron bombardment argon ion source was used to ion etch various metals and fluoropolymers. The metal and fluoropolymers were exposed to (0.5 to 1.0) keV Ar ions at ion current densities of (0.2 to 1.5) mA/sq cm for various exposure times. The resulting surface texture is in the form of needles or spires whose vertical dimensions may range from tenths to hundreds of micrometers, depending on the selection of beam energy, ion current density, and etch time. The bonding of textured surfaces is accomplished by ion beam texturing mating pieces of either metals or fluoropolymers and applying a bonding agent which wets in and around the microscopic cone-like structures. After bonding, both tensile and shear strength measurements were made on the samples. Also tested, for comparison's sake, were untextured and chemically etched fluoropolymers. The results of these measurements are presented.

Mirtich, M. J.↗
NASA NTRS1979

Effect of thermal aging on the tribological properties of polyimide films and polyimide-bonded graphite fluoride films

Weight loss, adherence, friction and wear of polyimide films and polyimide-bonded graphite fluoride films applied to stainless steel disks and to 304 stainless steel thin foils were studied. The films were exposed at temperatures of 315 D, 345 D, 370 D, or 400 C for 100 hours or more and then evaluated at temperatures of 25 D, 315 D, or 345 C in atmospheres of dry or moist air. Polyimide films were found to be brittle after thermal exposure; but polyimide-bonded graphite fluoride possessed good adherence and gave low friction and wear results. Polyimide-bonded graphite fluoride films appear to be good candidates for solid lubrication applications where long thermal soaks are prevalent.

Fusaro, R. L.↗
NASA NTRS1979

Adhesives for bonding RSI tile to GrPI structure for advanced space transportation systems

A system was developed for bonding RSI tiles to a graphite/polymide composite substrate which would withstand the full range of environmental conditions. The bonding system, designated RA59, consists of a mixture of glass (sesquisiloxane) resin in RTV 560 silicone. A significant number of data points for the RA59 are in the 65-psi failure range both when tested, and after exposure to 700 F. This is over two times the best shear and tensile values obtained with RV60 at this temperature. It is concluded that with a thorough understanding of the critical parameters involved, the higher values should be obtained consistently with the RA59. This is of particular significance if higher strength tiles were to be used in a hard-bonded configuration.

Smith, K. E.↗
NASA NTRS1979

Bonding of sapphire to sapphire by eutectic mixture of aluminum oxide and zirconium oxide

An element comprising sapphire, ruby or blue sapphire can be bonded to another element of such material with a eutectic mixture of aluminum oxide and zirconium oxide. The bonding mixture may be applied in the form of a distilled water slurry or by electron beam vapor deposition. In one embodiment the eutectic is formed in situ by applying a layer of zirconium oxide and then heating the assembly to a temperature above the eutectic temperature and below the melting point of the material from which the elements are formed. The formation of a sapphire rubidium maser cell utilizing eutectic bonding is shown.

Deluca, J. J.↗
NASA NTRS1978

Adhesive bonding of ion beam textured metals and fluoropolymers

An electron-bombardment argon ion source was used to ion-etch various metals and fluoropolymers. The metal and fluoropolymers were exposed to (0.5 to 1.0)-keV Ar ions at ion current densities of 0.2 to 1.5 mA/sq cm for various exposure times. The resulting surface texture is in the form of needles or spires whose vertical dimensions may range from tenths to hundreds of micrometers, depending on the selection of beam energy, ion current density, and etch time. The bonding of textured surfaces is accomplished by ion-beam texturing mating pieces of either metals or fluoropolymers and applying a bonding agent which wets in and around the microscopic conelike structures. After bonding, both tensile and shear strength measurements were made on the samples. Also tested, for comparison's sake, were untextured and chemically etched fluoropolymers. The results of these measurements are presented in this paper.

Mirtich, M. J.↗
NASA NTRS1980

Ion-beam etching enhances adhesive bonding

Metals and fluoropolymers exposed to 0.5 to 1.0 keV argon ions at current densities of 0.2 to 1.5 mA/sq cm develop surface texturing that increases tensile and shear strength of epoxy bonds. Bonds are 46 to 100 percent stronger than those of chemically etched surfaces. Metals require 3 to 4 hours of bombardment to become properly textured. Fluoropolymers require 5 seconds to 30 minutes. Ion beam will not texture nickel. Unlike chemical treatments, bonding of fluoropolymers can be done days or months after ion treatment.

Banks, B. A.↗
NASA NTRS1980

Mechanisms of lubrication and wear of a bonded solid lubricant film

To obtain a better understanding of how bonded solid lubricant films lubricate and wear (in general), the tribological properties of polyimide-bonded graphite fluoride films were studied (in specific). A pin-on-disk type of testing apparatus was used; but in addition to sliding a hemispherically tipped rider, a rider with a 0.95 mm diameter flat area was slid against the film. This was done so that a lower, less variable contact stress could be achieved. Two stages of lubrication occurred. In the first, the film supported the load. The lubricating mechanism consisted of the shear of a thin surface layer (of the film) between the rider and the bulk of the film. The second occurred after the bonded film had worn to the substrate, and consisted of the shear of very thin lubricant films between the rider and flat plateaus generated on the metallic substrate asperities. The film wear mechanism was strongly dependent on contact stress.

Fusaro, R. L.↗
NASA NTRS1980

Improved bond coatings for use with thermal barrier coatings

The potential for improving the durability of thermal barrier coatings (TBC's) being developed for coal derived fuel fired gas turbines was studied. Furnace oxidation behavior of plasma deposited bond coatings was improved by increasing the thickness from 0.010 cm to 0.015 cm and by depositing the coatings at 20 kW with argon 3.5 vol % hydrogen arc gas rather than at 11 kW with argon. The most oxidation resistant plasma deposited bond coatings were Ni-14, 1Cr-13.4Al-0.10Zr, Ni-14.3Cr-14.4Al.0.16Y, and Ni-15.8Cr-12.8Al-0.36Y on B-1900 + Hf and Ni-30.9Cr-11.1Al-0.48Y on MAR-M-509. The oxidation resistant bond coatings improved TBC life when the coatings were deposited on the specimens supported on a nail bed fixture during coating.

Gedwill, M. A.↗
NASA NTRS1979

Effect of thermal aging on the tribological properties of polyimide films and polyimide-bonded graphite fluoride films

The effect of thermal aging on the weight loss, adherence, friction and wear of polyimide films and polyimide-bonded graphite fluoride films applied to 440C-HT stainless steel disks and to 304 stainless steel thin foils was studied. The films were exposed at temperatures of 315, 345, 370 or 400 C for 100 hours or more and then evaluated at temperatures of 25, 315 or 345 C in atmospheres of dry or moist air. Polyimide films were found to be brittle after thermal exposure; but polyimide-bonded graphite fluoride films possessed good adherence and gave low friction and wear results. Thus, polyimide-bonded graphite fluoride films appear to be good candidates for solid lubrication applications where long thermal soaks are prevalent.

Fusaro, R. L.↗