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All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗
NASA NTRS1995

Japan's technology and manufacturing infrastructure

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Boulton, William R.↗
NASA NTRS2017

Update on NASA Microelectronics Activities

Mission Statement: The NASA Electronic Parts and Packaging (NEPP) Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test. and usage of EEE parts by NASA as well as in collaboration with other government Agencies and industry. NASA Space Technology Mission Directorate (STMD) "STMD rapidly develops, demonstrates, and infuses revolutionary, high-payoff technologies through transparent, collaborative partnerships, expanding the boundaries of the aerospace enterprise." Mission Statement: The Space Environments Testing Management Office (SETMO) will identify, prioritize, and manage a select suite of Agency key capabilities/assets that are deemed to be essential to the future needs of NASA or the nation, including some capabilities that lack an adequate business base over the budget horizon. NESC mission is to perform value-added independent testing, analysis, and assessments of NASA's high-risk projects to ensure safety and mission success. NASA Space Environments and Avionics Fellows as well as Radiation and EEE Parts Community of Practice (CoP) leads.

NASA Electronic Parts and Packaging (NEPP)↗
NASA NTRS2014

NASA Wearable Technology CLUSTER 2013-2014 Report

Wearable technology has the potential to revolutionize the way humans interact with one another, with information, and with the electronic systems that surround them. This change can already be seen in the dramatic increase in the availability and use of wearable health and activity monitors. These devices continuously monitor the wearer using on-­‐body sensors and wireless communication. They provide feedback that can be used to improve physical health and performance. Smart watches and head mounted displays are also receiving a great deal of commercial attention, providing immediate access to information via graphical displays, as well as additional sensing features. For the purposes of the Wearable Technology CLUSTER, wearable technology is broadly defined as any electronic sensing, human interfaces, computing, or communication that is mounted on the body. Current commercially available wearable devices primarily house electronics in rigid packaging to provide protection from flexing, moisture, and other contaminants. NASA mentors are interested in this approach, but are also interested in direct integration of electronics into clothing to enable more comfortable systems. For human spaceflight, wearable technology holds a great deal of promise for significantly improving safety, efficiency, autonomy, and research capacity for the crew in space and support personnel on the ground. Specific capabilities of interest include: Continuous biomedical monitoring for research and detection of health problems. Environmental monitoring for individual exposure assessments and alarms. Activity monitoring for responsive robotics and environments. Multi-modal caution and warning using tactile, auditory, and visual alarms. Wireless, hands-free, on-demand voice communication. Mobile, on-demand access to space vehicle and robotic displays and controls. Many technical challenges must be overcome to realize these wearable technology applications. For example, to make a wearable device that is both functional and comfortable for long duration wear, developers must strive to reduce electronic mass and volume while also addressing constraints imposed by the body attachment method. Depending on the application, the device must be placed in a location that the user can see and reach, and that provides the appropriate access to air and the wearer's skin. Limited power is available from body-­‐worn batteries and heat must be managed to prevent discomfort. If the clothing is to be washed, there are additional durability and washability hurdles that traditional electronics are not designed to address. Finally, each specific capability has unique technical challenges that will likely require unique solutions. In addition to the technical challenges, development of wearable devices is made more difficult by the diversity of skills required and the historic lack of collaboration across domains. Wearable technology development requires expertise in textiles engineering, apparel design, software and computer engineering, electronic design and manufacturing, human factors engineering, and application-­‐specific fields such as acoustics, medical devices, and sensing. Knowledge from each of these domains must be integrated to create functional and comfortable devices. For this reason, the diversity of knowledge and experience represented in the Wearable Technology is critical to overcoming the fundamental challenges in the field.

Simon, Cory↗
NASA NTRS2006

Simulating Responses of Gravitational-Wave Instrumentation

Synthetic LISA is a computer program for simulating the responses of the instrumentation of the NASA/ESA Laser Interferometer Space Antenna (LISA) mission, the purpose of which is to detect and study gravitational waves. Synthetic LISA generates synthetic time series of the LISA fundamental noises, as filtered through all the time-delay-interferometry (TDI) observables. (TDI is a method of canceling phase noise in temporally varying unequal-arm interferometers.) Synthetic LISA provides a streamlined module to compute the TDI responses to gravitational waves, according to a full model of TDI (including the motion of the LISA array and the temporal and directional dependence of the arm lengths). Synthetic LISA is written in the C++ programming language as a modular package that accommodates the addition of code for specific gravitational wave sources or for new noise models. In addition, time series for waves and noises can be easily loaded from disk storage or electronic memory. The package includes a Python-language interface for easy, interactive steering and scripting. Through Python, Synthetic LISA can read and write data files in Flexible Image Transport System (FITS), which is a commonly used astronomical data format.

Armstrong, John↗
NASA NTRSDate not supplied

Wide Bandgap Reliability and Application Guidelines

Wide Bandgap (WBG) semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN) have emerged as promising technologies due to the advantages they offer over silicon (Si). Under the NASA Electronic Parts and Packaging (NEPP) Program, Glenn Research Center (GRC) supports a task called "Wide Bandgap Reliability and Application Guidelines." This presentation summarizes the work performed under this task, to be presented at the 2020 NEPP Electronics Technology Workshop in June 2020.

Wide Bandgap Semiconductors↗
NASA NTRS1973

RI 1170 advanced strapdown gyro

The major components of the RI 1170 gyroscope are described. A detailed functional description of the electronics including block diagrams and photographs of output waveshapes within the loop electronics are presented. An electronic data flow diagram is included. Those gyro subassemblies that were originally planned and subsequently changed or modified for one reason or another are discussed in detail. Variations to the original design included the capacitive pickoffs, torquer flexleads, magnetic suspension, gas bearings, electronic design, and packaging. The selection of components and changes from the original design and components selected are discussed. Device failures experienced throughout the program are reported and design corrections to eliminate the failure modes are noted. Major design deficiencies such as those of the MSE electronics are described in detail. Modifications made to the gas bearing parts and design improvements to the wheel are noted. Changes to the gas bearing prints are included as well as a mathematical analysis of the 1170 gas bearing wheel by computer analysis. The mean free-path effects on gas bearing performance is summarized.

Source record↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS2000

Active and Passive Supplier Assessment Program (ASAP & PSAP) WWW Sites http://nepp.nasa.gov/imd/asap http://nepp.nasa.gov/imd/psap

The Active and Passive Supplier Assessment Programs (ASAP and PSAP) WWW Sites provide general information to the electronic parts community regarding the availability of electronic parts. They also provide information to NASA regarding modifications to commonly used procurement specifications and test methods. The ASAP and PSAP www sites are ongoing resources produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. These WWW sites do not provide information pertaining to patented or proprietary information. All of the information contained in these www sites is available through various other public domain resources such as US Military Qualified Producers Listings (QPLs) and Qualified Manufacturer Listings (QMLs) and industry working groups such as the Electronics Industry Alliance (EIA) and the Space Parts Working Group (SPWG).

Brusse, Jay↗
NASA NTRS2010

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

LaBel, Kenneth A.↗
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
NASA NTRS2010

FPGA NEPP : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for re-programmable field programmable gate arrays (FPGAs). The FY09 task was divided into three efforts: 1. Device physics-based design modifications 2. Contention study of Xilinx Virtex-4 3. IDDQ study of Actel A54SX The FY09 NEPP FPGA study was organized into these three sections in recognition of the continued and increasing importance of FPGAs to NASA. FPGAs represent the state of the art in electronic components with millions and millions of transistors integrated into a single device. Modern NASA spacecraft design has dozens and dozens of FPGAs implemented onboard. FPGAs are used in critical command and data handling, instrument control and monitoring, and communications protocols, to name just a few. The reliability of FPGAs is fundamental to mission success for NASA.

Sheldon, Douglas↗
NASA NTRS2012

The Radiation Belt Storm Probes Mission: Advancing Our Understanding of the Earth's Radiation Belts

We describe NASA's Radiation Belt Storm Probe (RBSP) mission, whose primary science objective is to understand, ideally to the point of predictability, the dynamics of relativistic electrons and penetrating ions in the Earth's radiation belts resulting from variable solar activity. The overarching scientific questions addressed include: 1. the physical processes that produce radiation belt enhancement events, 2. the dominant mechanisms for relativistic electron loss, and 3. how the ring current and other geomagnetic processes affect radiation belt behavior. The RBSP mission comprises two spacecraft which will be launched during Fall 2012 into low inclination lapping equatorial orbits. The orbit periods are about 9 hours, with perigee altitudes and apogee radial distances of 600 km and 5.8 RE respectively. During the two-year primary mission, the spacecraft orbits precess once around the Earth and lap each other twice in each local time quadrant. The spacecraft are each equipped with identical comprehensive instrumentation packages to measure, electrons, ions and wave electric and magnetic fields. We provide an overview of the RBSP mission, onboard instrumentation and science prospects and invite scientific collaboration.

Sibeck, David↗
NASA NTRS1984

Ion resonances and ELF wave production by an electron beam injected into the ionosphere - ECHO 6

Two effects observed with electron antennas ejected from a sounding rocket launched into the ionosphere in March 1983 carrying electron beam guns are discussed. The sensor packages were ejected and travelled parallel to the vehicle trajectory. Electric potentials were measured between the single probes and a plasma diagnostic package while the gun injected electrons into the ionosphere in perpendicular and parallel 1 kHz directions. Signal pulses over the dc-1250 kHz range were detected. A kHz gun frequency caused a signal that decreased by two orders of magnitude between 45-90 m from the beam field line. However, the signal was detectable at 1 mV/m at 120 m, supporting earlier data that indicated that pulsed electron beams can cause ELF waves in space. Beam injection parallel to the magnetic field produced an 840 Hz resonance that could be quenched by activation of a transverse beam.

Winckler, J. R.↗
NASA NTRS2002

Commercial-Off-The-Shelf Microelectromechanical Systems (MEMS) Flow-Measurement Probes Fabricated And Assembled

As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at the NASA Glenn Research Center have been fabricating packaging components and assembling a set of unique probes using commercial-off-the-shelf microelectromechanical systems (MEMS) integrated circuits (computer chips). Using MEMS as an alternative has some compelling advantages over standard measurement devices. Sensor technologies have matured through high-production usage in industries such as automotive and aircraft manufacturers. Currently, MEMS are the choice in applications such as tire pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Conventional instrumentation uses tubing buried in the model aerodynamic surfaces or wind tunnel walls. The measurements are made when pressure is introduced at the tube opening. The pressure then must travel the tubing for lengths ranging from 20 to hundreds of feet before reaching an electronic signal conditioner. This condition causes a considerable amount of damping and requires measurements to be made only after the test rig has reached steady-state operation. The electronic MEMS pressure sensor is able to take readings continuously under dynamic states in nearly real time. The use of stainless steel tubing for pressure measurements requires many tubes to be cleaned, cut to length, carefully installed, and delicately deburred and spliced for use. A cluster of a few hundred 1/16-in.- (0.0625-in.-) diameter tubes (not uncommon in research testing facilities) can be several inches in diameter and may weigh enough to require two men to handle. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of the 1/16-in. tubing with room to spare. The P592 piezoresistive silicon pressure sensor (Lucas NovaSensor, Fremont, CA) was chosen for this project because of its cost, availability, and tolerance to extreme ambient conditions. The chip is 1 mm square by 0.6 mm thick (0.039 by 0.023 in.) with 0.12-mm (0.005-in.) wire connection tabs. Three MEMS chips were used to build the first type of flow-angularity probe. This MEMS probe will be demonstrated as an alternative to a standard tube type "Cobra Probe" now used routinely in wind tunnel and aeronautical hardware applications. The response time and accuracy would allow the probe to be translated on an actuator across a flow field, yielding precision dynamic measurements not possible with conventional instrumentation. The low profile, the minimal power requirement, the rugged construction, and the moderate cost all contribute to making MEMS sensors the enticing choice instrument in future research measurement needs. The MEMS probe efforts are a continuation of work initiated by Brian Willis, without whose foresight and efforts this project would never have been realized. This task was funded through cooperation with the NASA Electronic Parts and Packaging (NEPP) program at the Jet Propulsion Laboratory.

Redding, Chip↗
NASA NTRS2015

Single-Event Effects in Silicon Carbide Power Devices

This report summarizes the NASA Electronic Parts and Packaging Program Silicon Carbide Power Device Subtask efforts in FY15. Benefits of SiC are described and example NASA Programs and Projects desiring this technology are given. The current status of the radiation tolerance of silicon carbide power devices is given and paths forward in the effort to develop heavy-ion single-event effect hardened devices indicated.

heavy-ion single-event effects↗
NASA NTRS2023

Assessment of Electrical, Electronic, and Electromechanical (EEE) Parts Copper Wire Bonds for Space Programs

The NASA Electronic Parts and Packaging Program co-manager, requested the NASA Engineering and Safety Center (NESC) to compile a body of publicly available knowledge on copper (Cu) wire bonds and perform reliability testing and analysis on these bonds, including environment tests, sample destructive physical analysis, and bond pull/shear tests during environment test intervals. The goal was to understand the risks of using Cu wire bonds for space applications and develop guidelines on Cu bond pull/shear limits for NASA applications. This document contains the results of the NESC assessment.

Electrical, Electronic, and Electromechanical↗