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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 415 records · Page 23

Exploring Venus

With a temperature higher than the inside of your oven and atmospheric pressure equal to that a kilometer under the ocean, the surface of Venus is one of the most hostile environments in the solar system, and Venus exploration presents a challenge to technology. This lecture presents mission trade-offs and discusses a proposed mission concept for rover and aircraft based exploration of the surface and atmosphere of Venus. Several approaches to the technology, electronics, mechanical parts, and power systems, are discussed.

Landis, Geoffrey A.↗

Exploring Venus

With a temperature higher than the inside of your oven and atmospheric pressure equal to that a kilometer under the ocean, the surface of Venus is one of the most hostile environments in the solar system, and Venus exploration presents a challenge to technology. This lecture presents mission trade-offs and discusses a proposed mission concept for rover and aircraft based exploration of the surface and atmosphere of Venus. Several approaches to the technology, electronics, mechanical parts, and power systems, are discussed.

Landis, Geoffrey A.↗

Single Event Effects (SEE) Testing: Practical Approach to Test Plans

While standards and guidelines for performing SEE testing have existed for several decades, guidance for developing SEE test plans has not been as easy to find. In this presentation, the variety of areas that need to be considered ranging from resource issues (funds, personnel, schedule) to extremely technical challenges (particle interaction and circuit application), shall be discussed. Note: we consider the approach outlined here as a "living" document: Mission-specific constraints and new technology related issues always need to be taken into account.

Single Event Effects (SEE)↗

Additive Manufacturing of SiC Based Ceramics and Ceramic Matrix Composites

Silicon carbide (SiC) ceramics and SiC fiber reinforcedSiC ceramic matrix composites (SiCSiC CMCs) offer high payoff as replacements for metals in turbine engine applications due to their lighter weight, higher temperature capability, and lower cooling requirements. Additive manufacturing approaches can offer game changing technologies for the quick and low cost fabrication of parts with much greater design freedom and geometric complexity. Four approaches for developing these materials are presented. The first two utilize low cost 3D printers. The first uses pre-ceramic pastes developed as feed materials which are converted to SiC after firing. The second uses wood containing filament to print a carbonaceous preform which is infiltrated with a pre-ceramic polymer and converted to SiC. The other two approaches pursue the AM of CMCs. The first is binder jet SiC powder processing in collaboration with rp+m (Rapid Prototyping+Manufacturing). Processing optimization was pursued through SiC powder blending, infiltration with and without SiC nano powder loading, and integration of nanofibers into the powder bed. The second approach was laminated object manufacturing (LOM) in which fiber prepregs and laminates are cut to shape by a laser and stacked to form the desired part. Scanning electron microscopy was conducted on materials from all approaches with select approaches also characterized with XRD, TGA, and bend testing.

3-D printing↗

Decline in Radiation Hardened Microcircuit Infrastructure

Two areas of radiation hardened microcircuit infrastructure will be discussed: 1) The availability and performance of radiation hardened microcircuits, and, and 2) The access to radiation test facilities primarily for proton single event effects (SEE) testing. Other areas not discussed, but are a concern include: The challenge for maintaining radiation effects tool access for assurance purposes, and, the access to radiation test facilities primarily for heavy ion single event effects (SEE) testing. Status and implications will be discussed for each area.

performance of radiation hardened microcircuits↗

NEPP Roadmaps, COTS, and Small Missions

This presentation provides an overview of the NEPP Program as well as the current roadmap for NEPP tasks.

NASA Electronic Parts and Packaging (NEPP) Program↗

Considerations for GPU SEE Testing

This presentation will discuss the considerations an engineer should take to perform Single Event Effects (SEE) testing on GPU devices. Notable topics will include setup complexity, architecture insight which permits cross platform normalization, acquiring a reasonable detail of information from the test suite, and a few lessons learned from preliminary testing.

NASA Electronic Parts and Packaging (NEPP) Program↗

Protons, Aerospace, and Electronics: A National Interest

The aerospace and semiconductor industries lost 2000 hours annually of research access when IUCF closed. An ad hoc team between the U.S. government and industry was formed to evaluate other facility options. In this presentation, we will discuss: 1) Why aerospace, semiconductor manufacturers, and others are interested in proton facility access, as well as, 2) Some of the basics of a typical test for electronics, and 3) We'll conclude with the brief current status on progress.

NASA Electronic Parts and Packaging (NEPP) Program↗

Protons, Aerospace, and Electronics: A National Interest

The aerospace and semiconductor industries lost approx. 2000 hours annually of research access when IUCF closed. An ad hoc team between the U.S. government and industry was formed to evaluate other facility options. In this presentation, we will discuss: 1) Why aerospace, semiconductor manufacturers, and others are interested in proton facility access, as well as, 2) Some of the basics of a typical test for electronics, and 3) We"ll conclude with the brief current status on progress.

NASA Electronic Parts and Packaging (NEPP) Program↗

Standardizing GPU Radiation Test Approaches

While some Graphical Processing Units (GPUs) are discrete components (i.e.GTX1050), others take the form of an IP block or embedded engine within a System on Chip (SoC) device such as the Qualcomm Snapdragon"TM" 820 which contains a Qualcomm Adreno"TM" 530 GPU. Within this device are various functional blocks which can be exercised with software payloads. NVidia's Jetson"TM" TX1 SoC is provided on a System on Module (SOM). Within it are Central Processing Unit (CPU) cores and an nVidia GPU which can be accessed similarly to a discrete GPU coprocessor. While the packaging is different, each one of these GPUs needs to be tested using the same standardized code.

Single Event Effects (SEE)↗