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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 415 records · Page 23

Copper foil provides uniform heat sink path

Thermal path prevents voids and discontinuities which make heat sinks in electronic equipment inefficient. The thermal path combines the high thermal conductivity of copper with the resiliency of silicone rubber.

Phillips, I. E., Jr.↗