SEARCH · Search NASA
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Electronic package environmental control systems and vehicle thermal systems integration for space missions to 180 days duration
Electronic packaging, integrated circuits, circuit design, and microcircuit design - survey with bibliography
Design, fabrication, packaging, and test methods used in Echo II satellite
Packaging methods for electronic components encased in flat pack geometries, and spacecraft applications of proposed methods
Hybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
Thermal analysis data plots for heat loads of electronic packages, environmental control systems, and vehicle thermal systems
Packaging and preservation of space vehicle hardware
Electronic packages, environmental control systems, and spacecraft thermal systems integration - thermal analysis data
Operational support equipment preliminary design for entry science package portion of Voyager flight capsule system
Hardware, software, and service interfaces between capsule bus, entry science package, and Voyager spacecraft
Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles
Thermal design of electronic packaging of Nimbus satellite control system
Plasma sprayed alumina and beryllia dielectric coatings for heat sinks in electronic packaging, emphasizing heat dissipation from heat/generating components
Slough characteristics measuring methods for clean packaging materials, considering Taber-Abraser, tumble-box and reciprocating-stylus method
MEMS packaging for biomedical applications can be achieved in several ways.
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications.