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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 433 records · Page 24

Automation of Laser Plasma Focused Ion Beam Microscopy for Next-Gen Energy Materials

Automation can revolutionize the use of ultrafast laser ablation and plasma-focused ion beam (PFIB) techniques for high-throughput, reproducible cross-sectioning and various sample preparation in materials characterization. As these methods become essential for analyzing complex energy materials and next-generation devices, efficient, standardized workflows are needed to minimize variability and enhance precision. This work highlights our advancements in developing automated processes for sample preparation that integrates machine learning, workflow optimization, and large-scale data acquisition to improve efficiency and scalability in applications such as electrolyzers, photovoltaic cells, and microelectronics. To streamline cross-sectioning and lamella fabrication, we have implemented fully automated workflows that standardize laser ablation and PFIB milling sequences. These workflows incorporate pre-programmed protocols for material removal, alignment, and thinning, reducing user intervention and ensuring consistency across different sample types. Machine learning algorithms further enhance automation by predicting optimal milling strategies and adapting parameters based on material properties and sectioning requirements. This approach significantly improves throughput while maintaining the structural integrity of prepared samples for high-resolution imaging and analysis, including transmission electron microscopy. Beyond sample preparation, our automation platform enables the acquisition of large, high-resolution datasets through serial sectioning, image alignment, and 3D reconstruction. These automated routines facilitate multi-scale characterization, capturing structural and compositional details from the nanoscale to the device level. By reducing variability and increasing efficiency, our automated approach enhances defect analysis, failure diagnostics, and process optimization, accelerating advancements in materials research and device engineering.

36 MATERIALS SCIENCE↗

Jupiter Laser Facility Annual Report, FY 2025

Dear JLF community, I cannot believe I am now entering my third year as JLF director — time definitely flies when you are having fun! FY25 was another pivotal year for the Jupiter Laser Facility, marked by both scientific achievement and growing visibility for our community. Building on the successful reopening and refurbishment of the facility, we continued to demonstrate how JLF drives innovation in high energy density and fusion energy science, laser technology, and workforce development. Across Janus, Titan, and COMET, users executed a diverse portfolio of experiments, from dynamic compression and opacity measurements to laser plasma interactions, laboratory astrophysics, and advanced diagnostics. These efforts are highlighted in this report, including the development of new probes that capture the time evolution of plasmas on a single shot, and diagnostics and platforms that are already impacting experiments at NIF and other large facilities. JLF continues to serve as both a testbed for new ideas and a bridge to larger scale campaigns. FY25 also showcased the broader role of JLF within the Laboratory and the national HED science ecosystem. The NIF JLF User Groups Meeting in February brought nearly 180 participants to Livermore and highlighted the scientific progress made during JLF’s first full year of renewed operations. JLF research and users were recognized with Director’s Institutional Awards and Early and Mid Career awards, underscoring the quality and impact of the work performed here. Our team also contributed prominently to national conversations about laser safety, plasma physics, and inertial fusion energy through invited talks, conferences, and professional society leadership. JLF’s integration with LaserNetUS deepened this year as well. We launched a new technical exchange program across LaserNetUS facilities and kicked it off with a JLF team visit to the BELLA Center at Lawrence Berkeley National Laboratory. These exchanges are strengthening operations, sharing best practices, and improving the user experience across the network. Filming for the LaserNetUS “Behind the Scenes” series and participation in the annual LaserNetUS meeting further increased the visibility of our facility and our users. At the same time, JLF continues to play a central role in ambitious new programs, such as the Big Aperture Thulium laser effort funded through one of the DOE Office of Science Microelectronics Science Research Centers, which will use JLF infrastructure to explore next generation high rep rate lasers for EUV and x-ray source development. A core part of our mission remains training the next generation of scientists. In FY25, we welcomed another cohort of summer students, who joined experimental teams on Titan and presented their research at LLNL’s student poster symposium and national inertial fusion energy meetings. JLF users and early career scientists showcased their work at conferences across the country, highlighting experiments performed at the facility. These hands on experiences, and the mentoring provided by our staff and user teams, are central to JLF’s identity as a true user facility. Finally, FY25 reinforced JLF’s role as a focal point for partnerships and outreach. We hosted visits from international collaborators, science leaders, and we shared the story of the facility through venues such as the Big Ideas Lab podcast. These interactions help connect our work to a broader scientific and policy audience and open new pathways for collaboration. As we look ahead, the combination of refurbished hardware, new capabilities like STILETTO and enhanced short pulse performance on Titan, strong partnerships across LLNL and LaserNetUS, and a growing user community positions JLF for an even more ambitious program in the coming years. I am deeply grateful to our technical and operations staff for their dedication, to our LLNL partners for their continued support, and to our users for bringing bold, creative ideas to the facility. I look forward to more experiments, capabilities, partnerships, and groundbreaking science in the years to come! With brightest regards, Félicie Albert, JLF Director.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Graphical User Interface for a Biasing Board for the PSEC6

The PSEC6 is an application-specific integrated circuit (ASIC) designed for a readout system for a large area picosecond photodetector (LAPPD). The PSEC6 is currently in fabrication and pending testing. The testing system for the PSEC5, the previous iteration of the ASIC, required expensive and non-portable equipment, because the ASIC needs twelve adjustable reference voltages. The new testing system consists of an low-cost, open-source, cross-platform graphical user interface (GUI), a digital system, and a biasing board. The digital system is the interface between the GUI and biasing board, and can be implemented on a microcontroller or field-programmable gate array (FPGA). The biasing board contains twelve digital-to-analog converters (DACs) that are configurable via the GUI, which gives users the ability to write voltage values to all or specific DACs. The GUI was developed in C on Linux using the widget library GTK4 and cross-compiled for Windows compatibility. I2C and SPI protocols were implemented on an Adafruit Feather ESP32-S3 microcontroller to write commands to the DACs and PSEC6. A hardware implementation of the I2C protocol is in development on an FPGA. Since LAPPDs will be used by the Accelerator Neutrino Neutron Interaction Experiment (ANNIE) at Fermilab, the PSEC6 testing system in this internship project can potentially benefit future neutrino research. The project is relevant to the Department of Energy’s microelectronics mission, because the PSEC6 is an ASIC that will handle fast time signals arriving from the detector for readout. It also provided experience with building a cross-platform user interface, practicing digital design and implementation in hardware description language (HDL), and using simulations to inform new design iterations.

Guerrero, Sasha Camila [North Central Coll.]↗

Entropy Analysis of FPGA Interconnect and Switch Matrices for Physical Unclonable Functions

Random variations in microelectronic circuit structures represent the source of entropy for physical unclonable functions (PUFs). In this paper, we investigate delay variations that occur through the routing network and switch matrices of a field-programmable gate array (FPGA). The delay variations are isolated from other components of the programmable logic, e.g., look-up tables (LUTs), flip-flops (FFs), etc., using a feature of Xilinx FPGAs called dynamic partial reconfiguration (DPR). A set of partial designs is created to fix the placement of a time-to-digital converter (TDC) and supporting infrastructure to enable the path delays through the target interconnect and switch matrices to be extracted by subtracting out common-mode delay components. Delay variations are analyzed in the different levels of routing resources available within FPGAs, i.e., local routing and across-chip routing. Data are collected from a set of Xilinx Zynq 7010 devices, and a statistical analysis of within-die variations in delay through a set of the randomly-generated and hand-crafted interconnects is presented.

97 MATHEMATICS AND COMPUTING↗

Abrasive Waterjet Machining

The abrasive waterjet machining process was introduced in the 1980s as a new cutting tool; the process has the ability to cut almost any material. Currently, the AWJ process is used in many world-class factories, producing parts for use in daily life. A description of this process and its influencing parameters are first presented in this paper, along with process models for the AWJ tool itself and also for the jet–material interaction. The AWJ material removal process occurs through the high-velocity impact of abrasive particles, whose tips micromachine the material at the microscopic scale, with no thermal or mechanical adverse effects. The macro-characteristics of the cut surface, such as its taper, trailback, and waviness, are discussed, along with methods of improving the geometrical accuracy of the cut parts using these attributes. For example, dynamic angular compensation is used to correct for the taper and undercut in shape cutting. The surface finish is controlled by the cutting speed, hydraulic, and abrasive parameters using software and process models built into the controllers of CNC machines. In addition to shape cutting, edge trimming is presented, with a focus on the carbon fiber composites used in aircraft and automotive structures, where special AWJ tools and manipulators are used. Examples of the precision cutting of microelectronic and solar cell parts are discussed to describe the special techniques that are used, such as machine vision and vacuum-assist, which have been found to be essential to the integrity and accuracy of cut parts. The use of the AWJ machining process was extended to other applications, such as drilling, boring, milling, turning, and surface modification, which are presented in this paper as actual industrial applications. To demonstrate the versatility of the AWJ machining process, the data in this paper were selected to cover a wide range of materials, such as metal, glass, composites, and ceramics, and also a wide range of thicknesses, from 1 mm to 600 mm. The trends of Industry 4.0 and 5.0, AI, and IoT are also presented.

36 MATERIALS SCIENCE↗

Polarization rotation in a ferroelectric BaTiO$_3$ film through low-energy He-implantation

Domain engineering in ferroelectric thin films is crucial for next-generation microelectronic and photonic technologies. Here, a method is demonstrated to precisely control domain configurations in BaTiO$_3$ thin films through low-energy He ion implantation. The approach transforms a mixed ferroelectric domain state with significant in-plane polarization into a uniform out-of-plane tetragonal phase by selectively modifying the strain state in the film's top region. This structural transition significantly improves domain homogeneity and reduces polarization imprint, leading to symmetric ferroelectric switching characteristics. The demonstrated ability to manipulate ferroelectric domains post-growth enables tailored functional properties without compromising the coherently strained bottom interface. The method's compatibility with semiconductor processing and ability to selectively modify specific regions make it particularly promising for practical implementation in integrated devices. This work establishes a versatile approach for strain-mediated domain engineering that could be extended to a wide range of ferroelectric systems, providing new opportunities for memory, sensing, and photonic applications where precise control of polarization states is essential.

Luo, Liang [Ames Laboratory (AMES), Ames, IA (Unit↗

Logic circuit exhibits optimum performance

Performance of circuits are compared to determine the optimum circuit configuration for implementation into microelectronic functions. Comparison is made in terms of power drain, propagation time, and component variations with temperature and load.

Husson, C.↗

Thin film process forms effective electrical contacts on semiconductor crystals

Process makes microscopic, low-resistance electrical contacts on hexagonal n-type silicon carbide crystals used for microelectronic devices. A vacuum deposition of aluminum is etched to expose the bare silicon carbide where the electrical contacts are made. Sputtering alternating layers of tantalum and gold forms the alloy film.

Formigoni, N. P.↗

Ultraminiature television camera

Ultraminiature television camera with a total volume of 20.25 cubic inches, requires 28 vdc power, operates on UHF and accommodates standard 8-mm optics. It uses microelectronic assembly packaging techniques and contains a magnetically deflected and electrostatically focused vidicon, automatic gain control circuit, power supply, and transmitter.

Deterville, R. J.↗

Logic realization of simple majority voting connectives

Redundant circuitry is added to computer network to eliminate incorrect output obtained due to a component failure, noise, or some other disturbance. This circuitry provides majority operation. Only NAND gates are employed, and the modules used are among the most popular microelectronic or integrated circuits presently in use.

Anderson, T. O.↗

Reliability through packaging design.

Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles

COOLING SYSTEM↗

Improved process for making thin-film sodium niobate capacitors

Sodium niobate, formed by high vacuum, flash, and reactive evaporations, has a high dielectric constant and is used as a thin film dielectric in microelectronic capacitors. High purity films are formed from relatively inexpensive, pure starting materials. Crystalline sodium niobate films can be formed on amorphous or crystalline materials.

Micka, E. Z.↗

A miniature 1/4-inch diameter 24-pin plug and receptacle

Miniature plug and receptacle, which eliminates the need for permanent fixed leads, is used on wind-tunnel force balances, in the interface connections of microelectronic modular assemblies, and in electric and electronic systems where subsystems must be removed or interchanged.

Phelps, W. R.↗