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At least 433 records · Page 24

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NASA NTRS1982

Investigation of test methods, material properties, and processes for solar cell encapsulants

Technical investigations concerned the development of advanced cure chemistries for lamination type pottants; the continued evaluation of soil resistant surface treatments, and the results of an accelerated aging test program for the comparison of material stabilities. New compounds were evaluated for efficiency in curing both ethylene/vinyl acetate and ethylene/methyl acrylate pottants intended for vacuum bag lamination of solar cells. One compound in particular, designated Lupersol - TBEC (Lucidol Division of Pennwalt Corp.) was found to be unusually effective in promoting the rapid cure of both these materials. Formulation of these resins with TBEC resulted in compositions of very high gel content, lower temperatures of activation, and much lower cure times, even in the ethylene/methyl acrylate polymer that is more difficult to cure. It is expected that TBEC modified pottant formulations may permit the lamination/encapsulation step to be operated at lower temperatures, higher speed, higher throughput and a much wider tolerance for intentional or accidental variations in the cure schedule. An experimental program continued to determine the effectiveness of soil resistant coatings.

Willis, P. B.↗

NASA NTRS1983

Development of phosphorylated adhesives

The synthesis of epoxy prepolymers containing phosphorus was carried out in such a manner as to provide adhesives containing at least 5 percent of this element. The purpose of this was to impart fire retardant properties to the adhesive. The two epoxy derivatives, bis(4-glycidyl-oxyphenyl)phenylphosphine oxide and bis(4-glycidyl-2-methoxyphenyl)phenylphosphonate, and a curing agent, bis(3-aminophenyl)methylphosphine oxide, were used in conjunction with one another and along with conventional epoxy resins and curing agents to bond Tedlar and Polyphenylethersulfone films to Kerimid-glass syntactic foam-filled honeycomb structures. Elevated temperatures are required to cure the epoxy resins with the phosphorus-contaning diamine; however, when Tedlar is being bonded, lower curing temperatures must be used to avoid shrinkage and the concomitant formation of surface defects. Thus, the phosphorus-containing aromatic amine curing agent cannot be used alone, although it is possible to use it in conjunction with an aliphatic amine which would allow lower cure temperatures to be used. The experimental epoxy resins have not provided adhesive bonds quite as strong as those provided by Epon 828 when compared in peel tests, but the differences are not very significant. It should be noted, if optimum properties are to be realized. In any case the fire retardant characteristics of the neat resin systems obtained are quite pronounced, since in most cases the self-extinguishing properties are evident almost instantly when specimens are removed from a flame.

Bilow, N.↗

NASA NTRS1985

Chemoviscosity modeling for thermosetting resins, 2

A new analytical model for simulating chemoviscosity of thermosetting resin was formulated. The model is developed by modifying the Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By assuming a linear relationship between the glass transition temperature and the degree of cure of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature dependent functions of the modified WLF theory constants were determined from the isothermal cure data of Lee, Loos, and Springer for the Hercules 3501-6 resin system. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data reported by Carpenter. A chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformations of the thermosetting resin systems during cure was established.

Hou, T. H.↗

NASA NTRS1985

New processable modified polyimide resins for adhesive and matrix applications

A broad product line of bismaleimide modified epoxy adhesives which are cured by conventional addition curing methods is described. These products fill a market need for 232 C (450 F) service adhesives which are cured in a manner similar to conventional 177 C (350 F) epoxy adhesives. The products described include film adhesives, pastes, and a primer. Subsequent development work has resulted in a new bismaleimide modified epoxy resin which uses a unique addition curing mechanism. This has resulted in products with improved thermomechanical properties compared to conventional bismaleimide epoxy resins. A film adhesive, paste, and matrix resin for composites using this new technology are described. In all cases, the products developed are heat cured by using typical epoxy cure cycles i.e., 1 hour at 177 C (350 F) followed by 2 hours postcure at 246 C (475 F).

Landman, D.↗

NASA NTRS1987

Studies on chemoviscosity modeling for thermosetting resins

A new analytical model for simulating chemoviscosity of thermosetting resins has been formulated. The model is developed by modifying the well-established Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By introducing a relationship between the glass transition temperature Tg(t) and the degree of cure alpha(t) of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature dependent functions of the modified WLF theory constants C sub 1 (t) and C sub 2 (t) were determined from the isothermal cure data. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data. This work represents progress toward establishing a chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformation of the thermosetting resin systems during cure.

Bai, J. M.↗

NASA NTRS1988

Chemoviscosity modeling for thermosetting resin systems, part 3

A new analytical model for simulating chemoviscosity resin has been formulated. The model is developed by modifying the well established Williams-Landel-Ferry (WLF) theory in polymer rheology for thermoplastic materials. By introducing a relationship between the glass transition temperature (T sub g (t)) and the degree of cure alpha(t) of the resin system under cure, the WLF theory can be modified to account for the factor of reaction time. Temperature-dependent functions of the modified WLF theory parameters C sub 1 (T) and C sub 2 (T) were determined from the isothermal cure data. Theoretical predictions of the model for the resin under dynamic heating cure cycles were shown to compare favorably with the experimental data. This work represents a progress toward establishing a chemoviscosity model which is capable of not only describing viscosity profiles accurately under various cure cycles, but also correlating viscosity data to the changes of physical properties associated with the structural transformations of the thermosetting resin systems during cure.

Hou, T. H.↗

NASA NTRS1991

Material property for designing, analyzing, and fabricating space structures

An analytical study was made of plasma assisted bullet projectile. The finite element analysis and the micro-macromechanic analysis was applied to an optimum design technique for the multilayered graphite-epoxy composite projectile that will achieve hypervelocity of 6 to 10 Km/s. The feasibility was determined of dialectics to monitor cure of graphite-epoxies. Several panels were fabricated, cured, and tested with encouraging results of monitoring the cure of graphite-epoxies. The optimum cure process for large structures was determined. Different orientation were used and three different curing cycles were employed. A uniaxial tensile test was performed on all specimens. The optimum orientation with the optimum cure cycle were concluded.

Kolkailah, Faysal A.↗

NASA NTRS1993

Property enchancement of polyimide films by way of the incorporation of lanthanide metal ions

Lanthanide metal ions were incorporated into the polyimide derived from 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 1,3-bis(aminophenoxy) benzene (APB) in an attempt to produce molecular level metal-polymer composites. The lanthanide series of metal ions (including aluminum, scandium, and yttrium) provide discrete and stable metal ions in the 3+ oxidation state. Throughout the series there is a uniform variation in ionic size ranging from 50 pm for aluminum to a maximum of 103.4 pm for cerium and gradually decreasing again to 84.8 pm for lutetium. The high charge-to-size ratio for these ions as well as the ability to obtain large coordination numbers makes them excellent candidates for interacting with the polymer substructure. The distinct lack of solubility of simple lanthanide salts such as the acetates and halides has made it difficult to obtain metal ions distributed in the polymer framework as discrete ions or metal complexes rather than microcomposites of metal clusters. (Lanthanum nitrates are quite soluble, but the presence of the strongly oxidizing nitrate ion leads to serious degradation of the polymer upon thermal curing. This work was successful at extending the range of soluble metals salts by using chelating agents derived from the beta-diketones dipivaloylmethane, dibenzoylmethane, trifluoroacetylacetone, and hexafluoroacetylacetone. Metal acetates which are insoluble in dimethylacetamide dissolve readily in the presence of the diketones. Addition of the polyimide yields a homogeneous resin which is then cast into a clear film. Upon curing clear films were obtained with the dibenzoylmethane and trifluoroacetylacetone ligands. The dipavaloylmethane precipitates the metal during the film casting process, and hexafluoroacetylacetone gives cured films which are deformed and brittle. These clear films are being evaluated for the effect of the metal ions on the coefficient of thermal expansion, resistance to atomic oxygen, and on selective gas permeability. Much more commonly than above, polyimide films are prepared by casting the film as the poly(amic acid) precursor which is then converted to the imidized form during the thermal cure cycle. Very limited success was achieved in the past in adding lanthanide metal ions to the amide precursors because of gellation and lack of solubility. With the use of the diketone ligands cited above, the solubility and gellation problems were overcome. However, the films after curing were clear but unacceptably brittle. Attempts to overcome this cure embrittlement problem are in progress.

Thompson, David W.↗

NASA NTRS2005

High-Performance Polymers Having Low Melt Viscosities

High-performance polymers that have improved processing characteristics, and a method of making them, have been invented. One of the improved characteristics is low (relative to corresponding prior polymers) melt viscosities at given temperatures. This characteristic makes it possible to utilize such processes as resin-transfer molding and resin-film infusion and to perform autoclave processing at lower temperatures and/or pressures. Another improved characteristic is larger processing windows that is, longer times at low viscosities. Other improved characteristics include increased solubility of uncured polymer precursors that contain reactive groups, greater densities of cross-links in cured polymers, improved mechanical properties of the cured polymers, and greater resistance of the cured polymers to chemical attack. The invention is particularly applicable to poly(arylene ether)s [PAEs] and polyimides [PIs] that are useful as adhesives, matrices of composite materials, moldings, films, and coatings. PAEs and PIs synthesized according to the invention comprise mixtures of branched, linear, and star-shaped molecules. The monomers of these polymers can be capped with either reactive end groups to obtain thermosets or nonreactive end groups to obtain thermoplastics. The synthesis of a polymeric mixture according to the invention involves the use of a small amount of a trifunctional monomer. In the case of a PAE, the trifunctional monomer is a trihydroxy- containing compound for example, 1,3,5-trihydroxybenzene (THB). In the case of a PI, the trifunctional monomer is a triamine for example, triamino pyrimidine or melamine. In addition to the aforementioned trifunctional monomer, one uses the difunctional monomers of the conventional formulation of the polymer in question (see figure). In cases of nonreactive end caps, the polymeric mixtures of the invention have melt viscosities and melting temperatures lower than those of the corresponding linear polymers of equal molecular weights. The lower melting temperatures and melt viscosities provide larger processing windows. In cases of reactive end caps, the polymeric mixtures of the invention have lower melt viscosities before curing and the higher cross-link densities after curing (where branching in the uncured systems would become cross-links in the cured systems), relative to the corresponding linear polymers of equal molecular weights. The greater cross-link densities afford increased resistance to chemical attack and improved mechanical properties.

Jensen, Brian J.↗

NASA NTRS2012

Method of Bonding Optical Elements with Near-Zero Displacement

The International X-ray Project seeks to build an x-ray telescope using thousands of pieces of thin and flexible glass mirror segments. Each mirror segment must be bonded into a housing in nearly perfect optical alignment without distortion. Forces greater than 0.001 Newton, or displacements greater than 0.5 m of the glass, cause unacceptable optical distortion. All known epoxies shrink as they cure. Even the epoxies with the least amount of shrinkage (<0.01%) cause unacceptable optical distortion and misalignment by pulling the mirror segments towards the housing as it cures. A related problem is that the shrinkage is not consistent or predictable so that it cannot be accounted for in the setup (i.e., if all of the bonds shrunk an equal amount, there would be no problem). A method has been developed that allows two components to be joined with epoxy in such a way that reduces the displacement caused by epoxy shrinking as it cures to less than 200 nm. The method involves using ultraviolet-cured epoxy with a displacement sensor and a nanoactuator in a control loop. The epoxy is cured by short-duration exposures to UV light. In between each exposure, the nano-actuator zeroes out the displacement caused by epoxy shrinkage and thermal expansion. After a few exposures, the epoxy has cured sufficiently to prevent further displacement of the two components. Bonding of optical elements has been done for many years, but most optics are thick and rigid elements that resist micro-Newton-level forces without causing distortion. When bonding thin glass optics such as the 0.40-mm thick IXO X-ray mirrors, forces in the micro- and milli-Newton levels cause unacceptable optical figure error. This innovation can now repeatedly and reliably bond a thin glass mirror to a metal housing with less than 0.2 m of displacement (<200 nm). This is an enabling technology that allows the installation of virtually stress-free, undistorted thin optics onto structures. This innovation is applicable to the bonding of thin optical elements, or any thin/flexible structures, that must be attached in an undistorted, consistent, and aligned way.

Robinson, David↗

NASA NTRSDate not supplied

Process Modeling of Woven Textiles

Woven polymer matrix composites offer numerous advantages over traditional unidirectional laminates. Processing conditions affect residual stress that builds up during manufacturing. This work proposes the analysis of three curing parameters on the local residual stress distribution of a plain weave textile architecture, including chemical shrinkage, the temperature cool down, and the evolution of matrix properties as a function of curing. Virtual curing is applied to the inter-tow matrix material of the plain weave Repeating Unit Cell (RUC) modeled in TexGen. Curing is implemented through user-written subroutines within the commercial software suite Abaqus. Results from process modeling are compared with a linear-elastic thermal cool down in Abaqus. A boundary conditions study is also conducted to compare the residual stress build up predicted by Flat(FBCs) and Periodic Boundary Conditions (PBCs). Preliminary results indicate that a thermal cool down over-estimates the end-of-cure stresses in the matrix. Process modeling is conducted with and without chemical shrinkage, then compared with a thermal cool down. Results show that 11.32% of the final stress state is due to chemical shrinkage. Material property evolution during curing also has a non-negligible effect on the end stress.

woven composites↗

DOE OSTI2022

System for providing dynamic feedback for selective adhesion PCB production

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

Hatch, Jonathan Douglas↗

DOE OSTI2021

Visible-Light Photoinitiation of (Meth)acrylate Polymerization with Autonomous Post-Conversion

Conversion plateaus rapidly in radical photopolymerizations (RPPs) following discontinuation of irradiation due to rapid termination of reactive radicals, which restricts the wider use of RPPs in applications that involve nonuniform light access including those with attenuated light transmission or irregular surfaces. Based on our recent report of a radical dark-curing photoinitiator (DCPI) that continues polymerization beyond the cessation of irradiation by enabling latent redox initiation with photo-released amine in the presence of a suitable oxidant, we developed a new DCPI with an absorption spectrum that extends well into the visible range. Our design process involved a series of computational investigations of candidate molecules, including a systematic study of substituents and their position-dependent effects on absorption characteristics, electronic transitions, and the photochemical mechanism and its associated energetics. Our quantum chemical computations identified the target compound 5,7-dimethoxy-6-bromo-3-aroylcoumarin-DMPT/BPh4 and predicted that it would facilitate the dark-curing mechanism by concurrent photo-radical generation and photo-induced release of an efficient redox reductant under visible irradiation. This reductant-tethered chromophore was then synthesized and optically characterized with UV–vis spectroscopy that revealed its strong visible-light absorption with a molar absorptivity of 5710 M–1 cm–1 at 405 nm and 50 M–1 cm–1 at 455 nm. We then demonstrated extensive dark-curing of >35% additional conversion over 25 min following brief activation of the shelf-stable one-part system by irradiation with a 455 nm LED that was ceased at 20% conversion. In contrast, shuttering irradiation of the control formulation at that same point resulted in immediate cessation of conversion, which plateaued at 20%. We determined a remarkable initiator efficiency of 2.82 that results from the additional redox-generated radicals with a 77% photo-reductant generation quantum yield. The combination of superior photo- and dark-curing efficiencies of this new visible DCPI is expected to open new application opportunities in RPP, especially those involving resins that are highly light attenuating, surfaces that possess irregular features that produce uneven irradiance, and production lines where continued dark-curing downstream of the light activation step enhances line efficiencies.

absorption spectrum↗

DOE OSTI2021

Demo 5: RapidClave Technology Demonstrations – Round II (Task 2)

The purpose of this project task was to make automotive composite part manufacturing more cost competitive for low volume production and thereby drive composite application innovation. The strategy was to incorporate low-cost preforming, snap cure resins, and RapidClave® processing to create an alternative to conventional automotive composite manufacturing based on SMC. The program used RapidClave® technology from Globe Machine Manufacturing, fast-curing (“snap cure”) epoxy resins from Hexion, and conformable/stretchable glass fiber reinforcement mats produced by Owens Corning for rapid preforming. O’Gara Armoring retrofits vehicles to meet special security needs, such as larger doors to facilitate easier entry into the vehicle. O’Gara has a variety of custom vehicles in need of custom doors that require affordable tooling to produce approximately 100 ship sets/year. The project focused on a composite door panel application provided by O’Gara that is currently made by manual chopped fiber spray-up processing. UDRI reverse-engineered the current composite door panel and created tooling for use in the RapidClave®. UDRI designed an improved composite door using MultiMat fiberglass reinforcement from Owens Corning. UDRI made snap cure resin films from Hexion resin. Finally, UDRI conducted molding trials to compare autoclave processing with RapidClave® processing. The technical goals of the project were to reduce tooling cost by 50% as compared to SMC compression molding and to reduce cycle time by 50% compared to current manual spray-up process. The approach to reduce tool costs is based on use of single sided tooling for use at 100 psi, as compared to matched metal SMC tooling. An added benefit realized from the program is that the Owens Corning mat provided more uniform thickness and improved performance. Tensile and flexural strengths and moduli were increased by at least 50%. This task also demonstrated a 75% decrease in cycle time. O’Gara is evaluating the technology demonstrated in this project for some of their current production. Additionally, there are new products O’Gara is pursuing which require higher production rates than their current products. O’Gara has identified these new products as good candidates for the RapidClave® technology. The cost advantages demonstrated by this project would then lead to significant economic development. In conclusion, this task successfully combined the RapidClave® technology from Globe with a snap cure epoxy resin film system from Hexion and preform material from Owens Corning. Further research is needed to better map the technical limits such as cycle time of these technologies. Additionally, the technology should be extended in terms of size and shape to include large parts outside of automotive applications, such as a small aircraft fuselage.

36 MATERIALS SCIENCE↗

DOE OSTI2025

Dielectric Barrier Discharge Electrothermal Heating and Additive Manufacturing of Thermoset Parts

Additive manufacturing of thermosets requires a mechanism for solidifying deposited layers in order to prevent part collapse. To accomplish this, non‐equilibrium plasma is proposed for its ability to target, heat, and cure printed thermosetting resin. Non‐equilibrium plasmas have not been used for the curing of liquid thermoset composites, and so their impact on an uncured resin is unknown. Here this work investigates the mechanism through which dielectric barrier discharge (DBD) heats an epoxy/carbon nanotube (CNT) composite under atmospheric conditions. Plasma applied to resin surfaces is found to cause rapid heating, with heating rate controlled by adjusting the applied power. Heating is localized to within the top 0.5 mm of the sample surface and maximum temperature is found to depend on sample conductivity, indicating the heating reaction occurs through a combination of electron conduction and ion bombardment. Characterization of composites cured using plasma shows oxidation and roughening of the surface. Based on the heating and surface studies, several demonstrative prints are performed using in situ plasma curing. This work shows the potential of DBD plasma to rapidly heat liquid substrates and demonstrates how plasma curing expands the capability of existing direct ink write (DIW) printer technologies.

3D printing↗

DOE OSTI2021

Long-term strength retrogression of silica-enriched oil well cement: A comprehensive multi-approach analysis

The strength retrogression of a Class G cement enriched by adding 60–80% silica cured under the condition of 200 °C and 50 MPa were investigated by multiple different analysis methods. Short-term strength analysis suggests sonic strength testing is a poor indicator of real mechanical strength at such curing condition. Long-term testing up to 142 d shows all designed systems experiences dramatic deterioration in physical and mechanical properties, such as compressive strength, Young's modulus, water permeability and gas permeability. Further testing was conducted using X-ray diffraction, thermal gravimetric analysis, mercury intrusion and scanning electron microscope. The study reveals that the set cement experiences significant microstructure coarsening with increasing curing time, especially after 30 d curing. The strength retrogression and microstructure coarsening seem to be accompanied with the continued consumption of silica, and are likely caused by the gradual conversion of semi-crystalline C-S-H into crystalline tobermorite and xonolite over the long-term curing.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Product-specific kinetics reveal effect of epoxy crystallization on thermoset thermal degradation

Crystallization is a common problem for epoxy resins, which are ubiquitous in industrial and commercial use. Integration of crystallized epoxy monomers into cured thermosets has been shown to alter the thermosets’ final mechanical properties. However, no studies have investigated the impact of these crystals on the thermal stability of the thermoset. Here we investigate the degradation kinetics of a bisphenol F–based epoxy thermoset with and without crystallized monomers using Product-Specific Kinetic (PSK) analysis coupled with Evolved Gas Analysis-Mass Spectrometry (EGA-MS). PSK analysis revealed significant differences in evolved product ion kinetics, suggesting changes in the degradation kinetics between thermoset configurations. Further, it was concluded that early stages of degradation are influenced most by crystal presence due to the high concentration of unreacted epoxy monomers and lower cross-linking density of the cured network. After post-cure annealing, significant changes are observed in the degradation kinetics of thermosets without crystal inclusions. Conversely, post-cure annealing procedures of crystal integrated thermosets showed little change in the thermoset degradation kinetics across all conversion extents. These findings suggest that post-cure annealing of thermosets with crystals present at the onset does not alter the cross-linking density of the polymer network enough to significantly change the degradation kinetics. We hypothesize this is because the excess monomers from the melted crystals are unable to find suitable reaction sites for complete binding into the polymer network, which has direct implications for the material properties and final thermal stability of the thermoset.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

NASA NTRS1974

Solubilization and spore recovery from silicone polymers

A non-sporicidal technique for solvent degradation of cured silicone polymers was developed which involves chemical degradation of cured silicone polymers by amine solvents at room temperature. Substantial improvements were obtained in the recovery of seeded spores from room temperature cured polymers as compared to the standard recovery procedures, which indicates that the curing process is not sufficiently exothermic to reduce spore viability. The dissolution reaction of cured silicone polymers whith amine solvents is proposed to occur by bimolecular nucleophilic displacement. The chemical structure of silicone polymers was determined by spectroscopic methods. The phenyl to methyl ratio, R/Si ratio, molecular weight, and hydroxyl content of the silicone resins were determined.

Hsiao, Y. C.↗