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At least 451 records · Page 25

Development of Kilo-Pixel Arrays of Transition-Edge Sensors for X-Ray Spectroscopy

We are developing kilo-pixel arrays of transition-edge sensor (TES) microcalorimeters for future X-ray astronomy observatories or for use in laboratory astrophysics applications. For example, Athena/XMS (currently under study by the european space agency) would require a close-packed 32x32 pixel array on a 250-micron pitch with < 3.0 eV full-width-half-maximum energy resolution at 6 keV and at count-rates of up to 50 counts/pixel/second. We present characterization of 32x32 arrays. These detectors will be readout using state of the art SQUID based time-domain multiplexing (TDM). We will also present the latest results in integrating these detectors and the TDM readout technology into a 16 row x N column field-able instrument.

Adams, J. S.↗

Wide-Field Imaging Interferometry Spatial-Spectral Image Synthesis Algorithms

Developed is an algorithmic approach for wide field of view interferometric spatial-spectral image synthesis. The data collected from the interferometer consists of a set of double-Fourier image data cubes, one cube per baseline. These cubes are each three-dimensional consisting of arrays of two-dimensional detector counts versus delay line position. For each baseline a moving delay line allows collection of a large set of interferograms over the 2D wide field detector grid; one sampled interferogram per detector pixel per baseline. This aggregate set of interferograms, is algorithmically processed to construct a single spatial-spectral cube with angular resolution approaching the ratio of the wavelength to longest baseline. The wide field imaging is accomplished by insuring that the range of motion of the delay line encompasses the zero optical path difference fringe for each detector pixel in the desired field-of-view. Each baseline cube is incoherent relative to all other baseline cubes and thus has only phase information relative to itself. This lost phase information is recovered by having point, or otherwise known, sources within the field-of-view. The reference source phase is known and utilized as a constraint to recover the coherent phase relation between the baseline cubes and is key to the image synthesis. Described will be the mathematical formalism, with phase referencing and results will be shown using data collected from NASA/GSFC Wide-Field Imaging Interferometry Testbed (WIIT).

Lyon, Richard G.↗

Focal Plane Array Low Background Testing (Focal Plane Array Characterization under a Low Background)

Most infra-red (IR) imagers for tactical applications use a direct injection (DI) input amplifier design. Fewer transistors in the unit cell allow the read-out electronic circuit (ROIC) to be minimized. This allows either more room for charge integration capacitors or finer pixel pitches. These ROICs work well at high background irradiance levels. However, at low background irradiance levels photocurrent inject efficiency for a DI unit cell amplifier is reduced. Some models have shown that this efficiency can drastically affect performance under low background conditions. The main benefit for Sandia National Laboratories (SNL) and L-3 Communications Cincinnati Electronics (L-3) was a better understanding of these types of sensors under low background conditions. It also provided the opportunity for an independent analysis of these sensors. The purpose of this project was to measure DI for low light levels under different operating temperatures of the L-3 CE103 a 1280 x 1024 indium antimonide 15 micron pitch detector. Results showed DI efficiency approaches 75% under extremely low light levels. Additionally, measured data didn't conform well to traditional circuit based models indicated that other effects are contributing to DI efficiency. A "spot scanning" PSF measurement was also conducted to measure pixel-to-pixel crosstalk for this array. Spot scanning data showed near ideal performance.

47 OTHER INSTRUMENTATION↗

Development of the Microcalorimeter Detector for Athena/X-IFU

The X-ray Integral Field Unit (X-IFU) will be a microcalorimeter instrument on ESA’s Athena X-ray observatory, set to launch around 2037. Athena recently underwent a reformulation exercise resulting in a simplified X-IFU architecture, with a new baseline configuration featuring fewer pixels and readout channels. Newly developed transition edge sensor pixels that are slower and have reduced magnetic field sensitivity have helped enable the new instrument design whilst maintaining flagship quality science. In this paper, we report on the status and plan for continued development of the X-IFU microcalorimeter array. We describe details of the current pixel architecture and performance specifications. We will present the design of the first full scale microcalorimeter arrays that have the necessary flight like electrical and mechanical interfaces for X-IFU. These arrays will undergo testing in a focal-plane assembly (FPA) Development Model (DM) in Europe later in 2024 and serve as a precursor to the X-IFU Engineering Model detector.

Stephen J Smith↗

The Focal Plane Assembly for the Athena X-Ray Integral Field Unit Instrument

This paper summarizes a preliminary design concept for the focal plane assembly of the X-ray Integral Field Unit on the Athena spacecraft, an imaging microcalorimeter that will enable high spectral resolution imaging and point-source spectroscopy. The instrument's sensor array will be a 3840-pixel transition edge sensor (TES) microcalorimeter array, with a frequency domain multiplexed SQUID readout system allowing this large-format sensor array to be operated within the thermal constraints of the instrument's cryogenic system. A second TES detector will be operated in close proximity to the sensor array to detect cosmic rays and secondary particles passing through the sensor array for off-line coincidence detection to identify and reject events caused by the in-orbit high-energy particle background. The detectors, operating at 55 mK, or less, will be thermally isolated from the instrument cryostat's 2 K stage, while shielding and filtering within the FPA will allow the instrument's sensitive sensor array to be operated in the expected environment during both on-ground testing and in-flight operation, including stray light from the cryostat environment, low-energy photons entering through the X-ray aperture, low-frequency magnetic fields, and high-frequency electric fields.

SQUID amplifier↗

Spectral Analysis of the Primary Flight Focal Plane Arrays for the Thermal Infrared Sensor

Thermal Infrared Sensor (TIRS) is a (1) New longwave infrared (10 - 12 micron) sensor for the Landsat Data Continuity Mission, (2) 185 km ground swath; 100 meter pixel size on ground, (3) Pushbroom sensor configuration. Issue of Calibration are: (1) Single detector -- only one calibration, (2) Multiple detectors - unique calibration for each detector -- leads to pixel-to-pixel artifacts. Objectives are: (1) Predict extent of residual striping when viewing a uniform blackbody target through various atmospheres, (2) Determine how different spectral shapes affect the derived surface temperature in a realistic synthetic scene.

Montanaro, Matthew↗

A New Large-Well 1024x1024 Si:As Detector for the Mid-Infrared

We present a description of a new 1024x1024 Si:As array designed for ground-based use from 5 - 28 microns. With a maximum well depth of 5e6 electrons, this device brings large-format array technology to bear on ground-based mid-infrared programs, allowing entry to the mega-pixel realm previously only accessible to the near-IR. The multiplexer design features switchable gain, a 256x256 windowing mode for extremely bright sources, and it is two-edge buttable. The device is currently in its final design phase at DRS in Cypress, CA. We anticipate completion of the foundry run in October 2005. This new array will enable wide field, high angular resolution ground-based follow up of targets found by space-based missions such as the Spitzer Space Telescope and the Wide-field Infrared Survey Explorer (WISE).

astronomy↗

SCA Test Report: H4RG-21224 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

320 x 256 Complementary Barrier Infrared Detector Focal Plane Array for Long-Wave Infrared Imaging

A 320 x 256 Complementary Barrier Infrared (CBIRD) focal plane array for long-wavelength infrared (LWIR) imaging is reported. The arrays were grown by molecular beam expitaxy (MBE) with a 300 period 1.9 um thick absorber. The mean dark current density of 2.2 x 10-4 A/cm2 was measured at an operating bias of 128 mV with a long wavelength cutoff of 8.8 ?m observed at 50% of the peak. The maximum quantum efficiency was 54% measured at 5.6 ?m. Operating at T = 80K, the array yielded an 81% fill factor with 97% operability. Good imagery with a mean noise equivalent different temperature (NE?T) of 18.6 mK and a mean detectivity of D* = 1.3 x 1011 cm-Hz1/2/W was achieved. The substrate was thinned using mechanical lapping and neither an AR coating nor a passivation layer was applied. This article provides the details of the fabrication process for achieving low-dark current LWIR CBIRD arrays. Discussion for an effective hard mask for excellent pattern transfer is given and appropriate mounting techniques for good thermal contact during the dry etching process is described. The challenges and differences between etching large 200 ?m test diodes and small 28 ?m FPA pixels are given.

Focal Plane Arrays (FPA)↗

Fabrication of an Absorber-Coupled MKID Detector and Readout for Sub-Millimeter and Far-Infrared Astronomy

We have fabricated absorber-coupled microwave kinetic inductance detector (MKID) arrays for sub-millimeter and farinfrared astronomy. Each detector array is comprised of lambda/2 stepped impedance resonators, a 1.5μm thick silicon membrane, and 380μm thick silicon walls. The resonators consist of parallel plate aluminum transmission lines coupled to low impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The Al transmission lines simultaneously act to absorb optical power and are designed to have a surface impedance and filling fraction so as to match the impedance of free space. Our novel fabrication techniques demonstrate high fabrication yield of MKID arrays on large single crystal membranes and sub-micron front-to-back alignment of the microstrip circuit.

far-infrared↗

SCA Test Report: H4RG-20828 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report: H4RG-20833 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report: H4RG-20849 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report H4RG-21645 Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCAATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report H4RG-21815: Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx.A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCEMA: a high channel density electronics module for fast waveform capture

The development of fast, highly pixelated photodetectors with single-photon sensitivity has the potential to enable a variety of new radiation detection concepts. Systems that desire to employ these detectors without loss of information demand waveform digitization with high sampling rates. Switched capacitor arrays provide a low-cost, low-power, compact solution to fast readout with high channel density. The Sandia Laboratories Compact Electronics for Modular Acquisition (SCEMA) was developed to meet these demands. A single module employs two domino ring sampling switched capacitor arrays (DRS4) [1] to provide 16 channels of up to 5 GS/s waveform digitization. This paper presents an overview of the board design and function. Calibration procedures for the module are discussed. Lastly, temporal resolution tests are presented demonstrating the module's viability as readout for high fidelity temporal measurements of single photons in suitable photodetectors.

47 OTHER INSTRUMENTATION↗

MOSAIC

The Mosaicked Optical Self-scanned Array Imaging Camera (MOSAIC), is a 50 sq cm active area detector system encompassing 5.76 million picture elements. This camera is being developed for use in astronomical instrumentation requiring the use of large area imaging detectors with high resolution photon counting capability in the space ultraviolet. This paper gives a descriptive outline of the MOSAIC camera system including: the 100 mm diameter microchannel plate intensifier, the 3 x 3 array of 800 x 800 pixel charge coupled devices, the signal processing and buffer storage subsystem, the electronic support and control subsystem, and the data processing subsystem. Performance characteristics of the camera and its subsystems are presented, based on system analysis.

Williams, J. T.↗

Stressed and unstressed Ge:Ga detector arrays for airborne astronomy

The construction and operation of 2D arrays of both unstressed and stressed Ge:Ga photoconductive detectors for far-IR astronomy from the Kuiper Airborne Observatory is presented. The 25 element (5 x 5) arrays are designed for a new cryogenically cooled spectrometer. The 2D spatial array described has the advantage of absolute registry between pixels in a map.

Stacey, G. J.↗