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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS1984

MOSAIC

The Mosaicked Optical Self-scanned Array Imaging Camera (MOSAIC), is a 50 sq cm active area detector system encompassing 5.76 million picture elements. This camera is being developed for use in astronomical instrumentation requiring the use of large area imaging detectors with high resolution photon counting capability in the space ultraviolet. This paper gives a descriptive outline of the MOSAIC camera system including: the 100 mm diameter microchannel plate intensifier, the 3 x 3 array of 800 x 800 pixel charge coupled devices, the signal processing and buffer storage subsystem, the electronic support and control subsystem, and the data processing subsystem. Performance characteristics of the camera and its subsystems are presented, based on system analysis.

Williams, J. T.↗
NASA NTRS1992

Stressed and unstressed Ge:Ga detector arrays for airborne astronomy

The construction and operation of 2D arrays of both unstressed and stressed Ge:Ga photoconductive detectors for far-IR astronomy from the Kuiper Airborne Observatory is presented. The 25 element (5 x 5) arrays are designed for a new cryogenically cooled spectrometer. The 2D spatial array described has the advantage of absolute registry between pixels in a map.

Stacey, G. J.↗
NASA NTRS1995

The Yerkes Observatory 60-channel far infrared camera for the Kuiper Airborne Observatory

The Yerkes Observatory Far Infrared Camera employs a two-dimensional, 60-detector array of (3)He-cooled silicon bolometers for broadband imaging in the spectral range of 40 to 240 microns. Four interchangeable filters have effective wavelengths of 60, 100, 160, and 200 microns. Three interchangeable lens sets give pixel sizes of 17, 27, and 45 in. Signals are processed through nitrogen-temperature JFET source-follower amplifiers, warm preamplifiers, and digital signal processors, and the system is controlled through a graphical user interface on a Macintosh computer. The camera has been used to image a wide variety of galactic and extragalactic far infrared sources.

Harper, D. AL, Jr.↗
NASA NTRS2009

A 2-D Array of Superconducting Magnesium Diboride (MgB2) Far-IR Thermal Detectors for Planetary Exploration

A 2-D array of superconducting Magnesium Diboride(MgB2) far IR thermal detectors has been fabricated. Such an array is intended to be at the focal plane of future generation thermal imaging far-IR instruments that will investigate the outer planets and their icy moons. Fabrication and processing of the pixels of the array as well as noise characterization of architectured MgB2 thin films will be presented. Challenges and solutions for improving the performance of the array will be discussed.

Lakew, Brook↗
NASA NTRS2020

SCA Test Report: H4RG-21225 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test,the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗
NASA NTRS2020

SCA Test Report: H4RG-21317 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗
NASA NTRS2020

SCA Test Report: H4RG-21319 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 µm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗
NASA NTRS2021

SCA Test Report H4RG-21813: Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-P ROC-09220_WFIRST-SCA-ATP_-.docx.A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary ( Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗
NASA NTRS2021

SCA Test Report H4RG-21814: Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-P ROC-09220_WFIRST-SCA-ATP_-.docx.A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary ( Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗
NASA NTRS2020

Sensor Chip Assembly (SCA) Test Report

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

WFIRST SCA TEST REPORT↗
NASA NTRS2020

SCA Test Report, H4RG-20829 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan R Miko↗
NASA NTRS1986

Development of 30 micrometers extrinsic silicon multiplexed infrared deterctor array

Two hybrid infrared (IR) detector arrays of antimony-doped silicon (Si:Sb) were produced and tested to evaluate their potential for use in low-background IR astronomy applications. The format of the arrays is 58 x 62 elements, with 76 micron-square pixels. A random-access, switched metal-oxide semiconductor field effect transistor (MOSFET) silicon multiplexer is used to read out the array elements. Reduced-background tests of signal, noise, and noise equivalent power were conducted over the temperature range 3.2 to 12 K. The arrays were found to have good sensitivity and good uniformity.

Orias, G.↗
NASA NTRS2007

[Overview of the GSFC Effort to Build Microwave Detectors for CMB Polarization]

Filled arrays of bolometers are currently being employed for use in astronomy from the far-infrared through millimeter portion of the electromagnetic spectrum. Because of the large range of wavelengths for which such detectors are applicable, the size of a pixel (p) relative to the wavelength (lambda) will vary according to the specific application of a given available technology. As the pixel size becomes comparable to a wavelength of the absorbed radiation, correlations in the radiation field at the pixel can affect the imaging properties of the system independent of the correlations introduced by the front-end optics. We study the dependence of image fidelity and induced polarization on the size of the pixel by employing a formalism in which diffraction due to the pixel boundary is treated by propagating the second-order statistical correlations of the radiation field through a model optical system. We construct simulated polarized images of square pixels for various ratios of p lambda. For the limit in which few modes are supported by the pixel (p lambda lesssiml), we find that the diffraction due to the pixel edges is non-negligible and hence must be considered along with the telescope diffraction pattern in modeling the ultimate spatial resolution of an imaging system. For the case in which the pixel is over-moded (p lambda ggl), the geometric limit is approached as expected. This technique provides a quantitative approach to understand and optimize the imaging properties of planar detectors in the few-mode limit.

Chuss, David↗
NASA NTRS2002

Specification and Design of the SBRC-190: A Cryogenic Multiplexer for Far Infrared Photoconductor Detectors

Arrays of far-infrared photoconductor detectors operate at a few degrees Kelvin and require electronic amplifiers in close proximity. For the electronics, a cryogenic multiplexer is ideal to avoid the large number of wires associated with individual amplifiers for each pixel, and to avoid adverse effects of thermal and radiative heat loads from the circuitry. For low background applications, the 32 channel CRC 696 CMOS device was previously developed for SIRTF, the cryogenic Space Infrared Telescope Facility. For higher background applications, we have developed a similar circuit, featuring several modifications: (a) an AC coupled, capacitive feedback transimpedence unit cell, to minimize input offset effects, thereby enabling low detector biases, (b) selectable feedback capacitors to enable operation over a wide range of backgrounds, and (c) clamp and sample & hold output circuits to improve sampling efficiency, which is a concern at the high readout rates required. We describe the requirements for and design of the new device.

Erickson, E. F.↗
NASA NTRS2012

The High Resolution Microcalorimeter Soft X-Ray Spectrometer for the Astro-H Mission

We are developing the Soft X-Ray Spectrometer for the JAXA Astro-H mission. The instrument features a 5 eV, 36-pixel array of micro calorimeters designed for high spectral resolution from 0.3-12 keV at the focus of an x-ray mirror, providing a field of view of3 x 3 arcmin. The principal components of the spectrometer are the microcalorimeter detector system, a 3-stage ADR and dewar. The dewar is a long-life, hybrid design with a superfluid He cryostat, Joule-Thomson cooler, and Stirling coolers. We describe the present design of the SXS instrument and initial engineering model test results.

Kelley, Richard L.↗
NASA NTRS2016

Design and Deployment of a Multichroic Polarimeter Array on the Atacama Cosmology Telescope

We present the design and the preliminary on-sky performance with respect to beams and pass bands of a multichroic polarimeter array covering the 90 and 146 GHz cosmic microwave background bands and its enabling broad-band optical system recently deployed on the Atacama Cosmology Telescope (ACT). The constituent pixels are feedhorn-coupled multichroic polarimeters fabricated at NIST. This array is coupled to the ACT telescope via a set of three silicon lenses incorporating novel broad-band metamaterial anti-reflection coatings. This receiver represents the first multichroic detector array deployed for a CMB experiment and paves the way for the extensive use of multichroic detectors and broad-band optical systems in the next generation of CMB experiments.

passbands↗
DOE OSTI2026

Evaluation of an event-driven 3FI ASIC for spectroscopic X-ray detection with synchrotron radiation

The novel design and evaluation on the NSLS-II beamline of the 3FI application-specific integrated circuit (ASIC) bump-bonded to a simple, planar, 2D segmented silicon sensor are presented. The ASIC was developed for full-field fluorescence spectral X-ray imaging (3FI). It is a small-scale prototype that features a square array of 32 × 32 pixels, and the size of the pixels is 100 µm × 100 µm. The ASIC was implemented in a 65 nm CMOS integrated circuit fabrication process. Each pixel incorporates a charge-sensitive amplifier, a shaping filter, a discriminator, a peak detector and a sample-and-hold circuit, allowing detection of events and storage of signal amplitudes. The system operates in a frameless event-driven readout mode, outputting analog values for threshold-triggered events, allowing high-speed multi-element X-ray fluorescence data acquisition. The 3FI ASIC achieves per-channel spectrometric performance at a power consumption of only 200 µW per pixel, with nearly all dissipation confined to the analog front-end. An energy resolution is measured at the level of 308 eV full width at half-maximum (FWHM) at 8.04 keV (Cu Kα), and 138 eV FWHM at 3.69 keV (Ca Kα). This per-pixel capability makes the prototype suitable for in situ trace element microanalysis in biological and environmental studies. Moreover, the frameless architecture of the detector is designed to address limitations of conventional X-ray fluorescence microscopy, which typically requires mechanical scanning, by enabling continuous high-throughput data acquisition in future full-field implementations.

47 OTHER INSTRUMENTATION↗