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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.
Process makes microscopic, low-resistance electrical contacts on hexagonal n-type silicon carbide crystals used for microelectronic devices. A vacuum deposition of aluminum is etched to expose the bare silicon carbide where the electrical contacts are made. Sputtering alternating layers of tantalum and gold forms the alloy film.
Acid spray machining technique chemically mills aluminum alloy panels without immersing them in an etchant. The spray does not require artificial heating to initiate the etching process.
Growing of silicon nitride films, and radiation induced etch rate enhancement in silicon nitride films
Two analytical techniques, a gold nucleation and an etch-decoration technique have been developed for determining the presence and mobility of boron in graphite.
Techniques for, and applications of preferential etching of crystal surfaces to produce optical reflections for crystal orientation and optical alignment in silicon crystals
Etched, single crystal tungsten tips spot welded on zone refined tungsten wire for improved cathode sources in high resolution electron microscopes
Yielding zones and mechanism of fracture, discussing measurement by strain etching and photoelastic coating
Felt templates saturated with etch solution remove anodized finish from aluminum without damage to the surface. The solution is a combination of nitric acid, chromic acid, and hydrofluoric acid.
Etchant containing chloroplatinous or chloroplatinic acid greatly reduces contact resistance between metallic surfaces. Etching results in a monolayer plating of platinum on the wafer surface, preventing oxide growth.
Electrical charge distribution in ultrahigh vacuum fracture and etching of silicates for lunar simulation studies
Charge storage behavior of multiple layer etched silicon semiconductor device
Vacuum dehydration of negatively working photoresist eliminates trace contamination of conventional stripping methods. The semiconductor substrate is coated with photoresist, exposed, developed, cured, and etched, and then placed in a vacuum. Following dehydration, the resist film is removable with ordinary solvents.
Etching techniques for undoped and lithium doped silicon solar cells and observation by surface replication and thin film transmission electron microscopy
Iodine concentrations, temperature gradients and transport ampules etching effects on mass transport rate and crystal growth of MnS-MnSe- iodine system
Automatic measurement of drainage networks for lengths and areas by copper plate etching or flying spot scanner on transparencies or radar images
Apollo 11 lunar fines examined for organic compounds via solvent extraction, vacuum crushing, programmed heating and hydrofluoric acid etching
Photochemical etching is most successful method for obtaining simulated microwave backscatter pattern from ocean surface. Process is adaptable to integrated circuit and thin film semiconductor fabrications. The attained horizontal resolution of 10 should improve with equipment refinement.