High-Resolution 3D Acoustic Borehole Integrity Monitoring System [Slides]
Develop a high-resolution 3D imaging system for improved wellbore diagnostics and integrity assessment
47 OTHER INSTRUMENTATION↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Understanding asymmetries using integrated simulations of capsule implosions in low gas-fill hohlraums at the National Ignition Facility
Current capsule implosions at the National Ignition Facility (NIF) using high-density-carbon ablators and laser energies close to 2 MJ have shown neutron yields in excess of 50 kJ. Improving on this performance requires understanding of the different degradation mechanisms. For many NIF implosions, nuclear diagnostic signatures have inferred residual hot-spot velocities that correlate with fuel areal density variations consistent with a low-order mode-1 asymmetry. A current working hypothesis attributes these asymmetries to a combination of beam to beam variations in the laser delivery and possibly coupling to target features, such as the diagnostic holes needed for x-ray imaging. Recently, a new source has been identified, thickness variation in the ablator shell. To gain better understanding and eventually mitigate the causes of <ρR> asymmetries, 3D integrated simulations using the actual delivered laser powers are needed. To capture the effect of the diagnostic holes (DHs) using direct numerical simulation would require significantly large computational resources. Instead, our 3D simulations make use of a subgrid model developed using highly-resolved 2D simulations that include several details of the DH engineering complexity. Simulations of NIF shots using hohlraums without DHs, to isolate the effect of beam-to-beam variations, reproduce fairly well the observed nuclear diagnostic signatures. Similarly, reasonable agreement between data and simulations is also obtained in the presence of diagnostic holes. To account for the remaining discrepancies a sensitivity study of ablator thickness variation showed that 1% thickness asymmetries are comparable in effect to 1% peak drive mode-1 asymmetries. Furthermore, this study identified sensitivity to variations in the imbedded doped layer (needed to shield the DT ice from the high energy x-rays generated in the hohlraum) thickness even when the inner and outer surface of the ablator are perfectly spherical.
radiation hydrodynamics↗
3D CAD Modeling and Mechanical Integration at the Mu2e Experiment at Fermilab
This abstract encapsulates a transformative summer internship at Fermilab, focusing on the Mu2e Experiment within the Mechanical Integration and 3D CAD Modeling group. The internship was characterized by a two-phase approach, with the initial month dedicated to the design of an aluminum platform tailored for DS Trench Maintenance. This phase encompassed a comprehensive exploration of structural integrity, material selection, and precision engineering principles, demonstrating an adeptness in CAD modeling and a keen eye for detail. The subsequent month saw a seamless transition into a dynamic phase of the project, wherein the intern played a pivotal role in effecting numerous adjustments across diverse sections of the 3D experiment structure. This phase demanded a nuanced understanding of the intricacies of the Mu2e Experiment and a high level of proficiency in CAD modeling.
3D CAD Modeling↗
Synergistic Integration of Chemo-Resistive and SERS Sensing for Label-Free Multiplex Gas Detection
Practical sensing applications such as real-time safety alerts and clinical diagnoses require sensor devices to differentiate between various target molecules with high sensitivity and selectivity, yet conventional devices such as oxide-based chemo-resistive sensors and metal-based surface-enhanced Raman spectroscopy (SERS) sensors usually do not satisfy such requirements. In this report a label-free, chemo-resistive/SERS multimodal sensor based on a systematically assembled 3D cross-point multifunctional nanoarchitecture (3D-CMA), which has unusually strong enhancements in both “chemo-resistive” and “SERS” sensing characteristics is introduced. 3D-CMA combines several sensing mechanisms and sensing elements via 3D integration of semiconducting SnO 2 nanowire frameworks and dual-functioning Au metallic nanoparticles. It is shown that the multimodal sensor can successfully estimate mixed-gas compositions selectively and quantitatively at the sub-100 ppm level, even for mixtures of gaseous aromatic compounds (nitrobenzene and toluene) with very similar molecular structures. This is enabled by combined chemo-resistive and SERS multimodal sensing providing complementary information.
36 MATERIALS SCIENCE↗
3D Geologic Framework Modelling of the Los Alamos National Laboratory Site and Pajarito Plateau: Integrating a realistic 3D fault network and modelling subsurface relationships in a sparsely sampled and complex geologic region
The subsurface geology beneath the Pajarito Plateau is critical to understanding the seismic hazard of the Pajarito Fault System, yet our understanding of this geology is relatively poor. While previous 3D geologic framework models of the area have been created for the purposes of understanding hydrogeologic flow, they are inadequate for the purposes of understanding the Pajarito Fault System. The specific challenges of using oil and gas software for this purpose include: (1) the geologic complexities resulting from volcanism and tectonism; (2) a need for a high level of stratigraphic detail over a large area; (3) a near complete lack of seismic data; and (4) sparse wellbore data. Presented here is a workflow that handles these challenges of adapting commercially available software used by the oil and gas industries to this seismic hazard problem.
58 GEOSCIENCES↗
Low-thermal-budget synthesis of monolayer molybdenum disulfide for silicon back-end-of-line integration on a 200 mm platform
Two-dimensional (2D) materials are promising candidates for future electronics due to their excellent electrical and photonic properties. Although promising results on the wafer-scale synthesis (≤150 mm diameter) of monolayer molybdenum disulfide (MoS 2 ) have already been reported, the high-quality synthesis of 2D materials on wafers of 200 mm or larger, which are typically used in commercial silicon foundries, remains difficult. The back-end-of-line (BEOL) integration of directly grown 2D materials on silicon complementary metal–oxide–semiconductor (CMOS) circuits is also unavailable due to the high thermal budget required, which far exceeds the limits of silicon BEOL integration (<400 °C). This high temperature forces the use of challenging transfer processes, which tend to introduce defects and contamination to both the 2D materials and the BEOL circuits. Here we report a low-thermal-budget synthesis method (growth temperature < 300 °C, growth time ≤ 60 min) for monolayer MoS 2 films, which enables the 2D material to be synthesized at a temperature below the precursor decomposition temperature and grown directly on silicon CMOS circuits without requiring any transfer process. We designed a metal–organic chemical vapour deposition reactor to separate the low-temperature growth region from the high-temperature chalcogenide-precursor-decomposition region. We obtain monolayer MoS 2 with electrical uniformity on 200 mm wafers, as well as a high material quality with an electron mobility of ~35.9 cm 2 V -1 s -1 . Finally, we demonstrate a silicon-CMOS-compatible BEOL fabrication process flow for MoS 2 transistors; the performance of these silicon devices shows negligible degradation (current variation < 0.5%, threshold voltage shift < 20 mV). We believe that this is an important step towards monolithic 3D integration for future electronics.
77 NANOSCIENCE AND NANOTECHNOLOGY↗
2D material-based layer transfer: Challenges and opportunities
For future of electronics such as bioelectronics, 3D integrated electronics, and bendable electronics, needs for flexibility and stackability of electronic products have substantially grown up. However, conventional wafer-based single-crystalline semiconductors cannot catch up with such trends because they are bound to the thick rigid wafers such that they are neither flexible nor stackable. Although polymer-based organic electronic materials are more compatible as they are mechanically complaint and less costly than inorganic counterparts, their electronic/photonic performance is substantially inferior to that of single-crystalline inorganic materials. For the past few decades, many different strategies to mitigate such performance-mechanical compliance dilemma by developing methods to obtain cheap, flexible, stackable, single-crystalline inorganic systems. In today’s talk, I will discuss about various strategies to realize such a dream electronic system and how these strategies unlock new ways of manufacturing advanced electronic systems. One of the most promising approaches is to fabricate freestanding ultrathin membranes from existing functional material wafers by peeling the active layers from the top. I will overview all freestanding membrane methods and especially dive deeply into 2D materials-based layer transfer (2DLT) technique that has been recently emerging as one of the very promising options. In the 2DLT process, one can produce single-crystalline freestanding membranes from 3D materials by performing remote epitaxy or van der Waals epitaxy on 2D materials followed by peeling active single-crystalline films from the 2D materials. I will discuss about the challenges and opportunities of this technology. In addition, I will present unprecedented artificial heterostructures that can be enabled by stacking those freestanding 3D material membranes.
Kim, Jeehwan↗
Two-dimensional material based layer transfer: challenges and opportunities
For future of electronics such as bioelectronics, 3D integrated electronics, and bendable electronics, needs for flexibility and stackability of electronic products have substantially grown up. However, conventional wafer-based single-crystalline semiconductors cannot catch up with such trends because they are bound to the thick rigid wafers such that they are neither flexible nor stackable. Although polymer-based organic electronic materials are more compatible as they are mechanically complaint and less costly than inorganic counterparts, their electronic/photonic performance is substantially inferior to that of single-crystalline inorganic materials. For the past few decades, many different strategies to mitigate such performance-mechanical compliance dilemma by developing methods to obtain cheap, flexible, stackable, single-crystalline inorganic systems. In today’s talk, I will discuss about various strategies to realize such a dream electronic system and how these strategies unlock new ways of manufacturing advanced electronic systems. One of the most promising approaches is to fabricate freestanding ultrathin membranes from existing functional material wafers by peeling the active layers from the top. I will overview all freestanding membrane methods and especially dive deeply into 2D materials-based layer transfer (2DLT) technique that has been recently emerging as one of the very promising options. In the 2DLT process, one can produce single-crystalline freestanding membranes from 3D materials by performing remote epitaxy or van der Waals epitaxy on 2D materials followed by peeling active single-crystalline films from the 2D materials. I will discuss about the challenges and opportunities of this technology. In addition, I will present unprecedented artificial heterostructures that can be enabled by stacking those freestanding 3D material membranes.
KIM, JEEHWAN↗
New proposed ITER divertor design using carbon insert on tungsten to mitigate ELMs and secondary radiation effects on nearby components
Abstract Building a successful device for the magnetic fusion energy production is a great challenge. ITER is an international project of the tokamak based magnetic fusion design being developed for the demonstration of the feasibility of thermonuclear technologies for future realization of successful commercial fusion energy. A key obstacle to a successful magnetic fusion energy production is however, the performance during abnormal events including plasma disruptions and edge-localized modes (ELMs). A credible reactor design must tolerate at least a few of these transient events without serious consequences such as melting of the structure. This paper investigates and compares the performance of the current ITER tokamak design during two types of transient events, i.e., ELMs occurring at normal operation and disruptions during abnormal operation. We simulated the divertor components response using our integrated 3D HEIGHTS package. The simulations include self-consistent modeling of the interaction of the released core plasma particles with the initial solid divertor material, energy deposition processes, vaporization of divertor material, secondary plasma formation and MHD evolution, incident core particles collisions and scattering from this dense secondary plasma, photon radiation of secondary plasma, and the resulting heat loads on nearby components. Our simulations showed that using a small carbon insert around the strike point can significantly reduce the overall expected damage on the tungsten dome structure, reflector plates, and prevent tungsten vaporization and its potential core plasma contamination.
47 OTHER INSTRUMENTATION↗
Single-Cell Universal Logic-in-Memory Using 2T-nC FeRAM: An Area and Energy-Efficient Approach for Bulk Bitwise Computation
This work presents a novel approach to configure 2T-nC ferroelectric RAM (FeRAM) for performing single cell logic-in-memory operations, highlighting its advantages in energy-efficient computation over conventional DRAM-based approaches. Unlike conventional 1T-1C dynamic RAM (DRAM), which incurs refresh overhead, 2T-nC FeRAM offers a promising alternative as a non-volatile memory solution with low energy consumption. Our key findings include the potential of quasi-nondestructive readout (QNRO) sensing in 2T-nC FeRAM for logic-in-memory (LiM) applications, demonstrating its inherent capability to perform inverting logic without requiring external modifications, a feature absent in traditional 1T-1C DRAM. We successfully implement the MINORITY function within a single cell of 2T-nC FeRAM, enabling universal NAND and NOR logic, validated through SPICE simulations and experimental data. Additionally, the research investigates the feasibility of 3D integration with 2T-nC FeRAM, showing substantial improvements in storage and computational density, facilitating bulk-bitwise computation. Our evaluation of eight real-world, data-intensive applications reveals that 2T-nC FeRAM achieves 2× higher performance and 2.5× lower energy consumption compared to DRAM. Furthermore, the thermal stability of stacked 2T-nC FeRAM is validated, confirming its reliable operation when integrated on a compute die. These findings emphasize the advantages of 2T-nC FeRAM for LiM, offering superior performance and energy efficiency over conventional DRAM.
36 MATERIALS SCIENCE↗
Toward ultrafast, ultra-stable imaging arrays: Superlattice doping to enhance the performance of backside-illuminated 3D-hybridized silicon photodetectors
In this paper, the authors report the latest results on their development of superlattice-doped, thinned, backside-illuminated (BSI), 3D-integrated photodiode detectors—a step toward their ultimate goal of demonstrating ultrafast, ultrastable CMOS imaging arrays. As with most silicon-based photodetectors, backside-illumination and backside surface passivation are keys to achieve the highest performance capability. The two-dimensional (2D) doping technique developed at the Jet Propulsion Laboratory (JPL) has proved to result in a highly efficient, highly stable detector response when combined with a variety of detectors. Here, JPL's 2D-doping has been combined with Sandia's BSI photodetectors hybridized with custom fanout wafer via copper Direct Bond Interconnect (DBI®), a technology that is rapidly becoming industry standard for BSI CMOS imaging arrays. The prototype detectors were packaged and evaluated with respect to their response to low energy electrons. The authors find that the responsivity of 2D-doped BSI detectors is higher than devices prepared using other surface passivation techniques (i.e., ion implantation). The success of the work described herein verifies that the 2D-doping processes previously developed for Sandia's frontside-illuminated photodetectors are generally applicable to BSI detectors and demonstrates for the first time that JPL's 2D-doping process is compatible with the Cu-DBI® technology.
Jewell, April D.↗
Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies
Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.
36 MATERIALS SCIENCE↗
Development and Refinement of Bison Models for Higher Burnup Application
Electric Power Research Institute (EPRI) is an international research organization funded by organizations in the energy and government sectors. The company conducts research to tackle the energy challenges of its member organizations. In support of the U.S. nuclear industry, EPRI and Idaho National Laboratory were awarded a U.S. Department of Energy Technology Commercialization Fund to develop a loss of coolant accident (LOCA) analysis tool. This tool was developed to support burnup extension activities by supplementing the existing capabilities of operators of existing large light-water reactor plants. The tool couples INL developed codes Bison and RELAP5-3D for advanced simulation of LOCA behavior. The project consists of seven major tasks, one of which is the development and refinement of Bison models for higher burnup applications. This task is broken down into six targeted areas of development and refinement including: formation of high burnup structure, fuel fracture and pulverization, transient fission gas release, axial gas communication within a fuel rod, cladding ballooning and burst, and axial fuel relocation. This report summarizes the models for both the fuel and cladding in Bison for high burnup application, identifies the areas of development and refinement necessary to enhance the Bison capabilities to be used in the coupled simulation tool with RELAP5-3D. Integration and regression testing to demonstrate proper implementation of the new features in Bison is highlighted.
11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
In Situ Study on Cu-to-Cu Thermal Compression Bonding
Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength of the Cu bonds, the bonding processes generally require high temperature and high pressure, which may degrade the performance and reliability of the device. Therefore, it is imperative to investigate the processing parameters to understand the bonding mechanism and achieve effective TCB at a low temperature and low pressure. Here, we developed an in situ TCB technique inside a scanning electron microscope. The in situ TCB method enables a real-time observation of bonding development, which provides critical insights into how the texture and microstructure of Cu bumps may influence the creep and surface diffusion during the bonding process. This work features a strategy to advance our understanding of the bonding mechanisms and provides insight into tailoring the microstructure of Cu for bonding at a low temperature and low pressure.
36 MATERIALS SCIENCE↗
Observational and Modeling Studies of Radiative, Chemical, and Dynamical Interactions in the Earth''s Atmosphere
A 3-dimensional model was developed to support mechanistic studies. The model solves the global primitive equations in isentropic coordinates, which directly characterize diabatic processes forcing the Brewer-Dobson circulation of the middle atmosphere. It's numerical formulation is based on Hough harmonics, which partition horizontal motion into its rotational and divergent components. These computational features, along with others, enable 3D integrations to be performed practically on RISC computer architecture, on which they can be iterated to support mechanistic studies. The model conserves potential vorticity quite accurately under adiabatic conditions. Forced by observed tropospheric structure, in which integrations are anchored, the model generates a diabatic circulation that is consistent with satellite observations of tracer behavior and diabatic cooling rates. The model includes a basic but fairly complete treatment of gas-phase photochemistry that represents some 20 chemical species and 50 governing reactions with diurnally-varying shortwave absorption. The model thus provides a reliable framework to study transport and underlying diabatic processes, which can then be compared against chemical and dynamical structure observed and in GCM integrations. Integrations with the Langley GCM were performed to diagnose feedback between simulated convection and the tropical circulation. These were studied in relation to tropospheric properties controlling moisture convergence and environmental conditions supporting deep convection, for comparison against mechanistic integrations of wave CISK that successfully reproduce the Madden-Julian Oscillation (MJO) of the tropical circulation. These comparisons were aimed at identifying and ultimately improving aspects of the convective simulation, with the objective of recovering a successful simulation of the MJO in the Langley GCM, behavior that should be important to budgets of upper-tropospheric water vapor and chemical species.
Salby, Murry↗
NeMO-Net – The Neural Multi-Modal Observation & Training Network for Global Coral Reef Assessment
We present NeMO-Net, the Srst open-source deep convolutional neural network (CNN) and interactive learning and training software aimed at assessing the present and past dynamics of coral reef ecosystems through habitat mapping into 10 biological and physical classes. Shallow marine systems, particularly coral reefs, are under significant pressures due to climate change, ocean acidification, and other anthropogenic pressures, leading to rapid, often devastating changes, in these fragile and diverse ecosystems. Historically, remote sensing of shallow marine habitats has been limited to meter-scale imagery due to the optical effects of ocean wave distortion, refraction, and optical attenuation. NeMO-Net combines 3D cm-scale distortion-free imagery captured using NASA FluidCam and Fluid lensing remote sensing technology with low resolution airborne and spaceborne datasets of varying spatial resolutions, spectral spaces, calibrations, and temporal cadence in a supercomputer-based machine learning framework. NeMO-Net augments and improves the benthic habitat classification accuracy of low-resolution datasets across large geographic ad temporal scales using high-resolution training data from FluidCam.NeMO-Net uses fully convolutional networks based upon ResNet and ReSneNet to perform semantic segmentation of remote sensing imagery of shallow marine systems captured by drones, aircraft, and satellites, including WorldView and Sentinel. Deep Laplacian Pyramid Super-Resolution Networks (LapSRN) alongside Domain Adversarial Neural Networks (DANNs) are used to reconstruct high resolution information from low resolution imagery, and to recognize domain-invariant features across datasets from multiple platforms to achieve high classification accuracies, overcoming inter-sensor spatial, spectral and temporal variations.Finally, we share our online active learning and citizen science platform, which allows users to provide interactive training data for NeMO-Net in 2D and 3D, integrated within a deep learning framework. We present results from the PaciSc Islands including Fiji, Guam and Peros Banhos 1 1 2 1 3 1 where 24-class classification accuracy exceeds 91%.
Chirayath, Ved↗
PIXEL2020: Tenth International Workshop on Semiconductor Pixel Detectors for Particles and Imaging
This workshop covers various topics related to pixel detector technology. Development and applications will be discussed for charged particle tracking in High Energy Physics, Nuclear Physics, Astrophysics, and X-ray imaging in Astronomy, Biology, Medicine and Material Science. The conference program will also include reports on front and back end electronics, radiation effects, low mass mechanics and construction techniques, and new technologies such as monolithic and 3D integrated detectors.
Sally, Seidel↗
PHASE 1 FINAL REPORT: Scalable Micron-Sized Flexible Interconnects Analysis
Explore the source record for details and available documents.
3D microelectronics, interconnection, NP detectors↗