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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Two-dimensional material based layer transfer: challenges and opportunities

For future of electronics such as bioelectronics, 3D integrated electronics, and bendable electronics, needs for flexibility and stackability of electronic products have substantially grown up. However, conventional wafer-based single-crystalline semiconductors cannot catch up with such trends because they are bound to the thick rigid wafers such that they are neither flexible nor stackable. Although polymer-based organic electronic materials are more compatible as they are mechanically complaint and less costly than inorganic counterparts, their electronic/photonic performance is substantially inferior to that of single-crystalline inorganic materials. For the past few decades, many different strategies to mitigate such performance-mechanical compliance dilemma by developing methods to obtain cheap, flexible, stackable, single-crystalline inorganic systems. In today’s talk, I will discuss about various strategies to realize such a dream electronic system and how these strategies unlock new ways of manufacturing advanced electronic systems. One of the most promising approaches is to fabricate freestanding ultrathin membranes from existing functional material wafers by peeling the active layers from the top. I will overview all freestanding membrane methods and especially dive deeply into 2D materials-based layer transfer (2DLT) technique that has been recently emerging as one of the very promising options. In the 2DLT process, one can produce single-crystalline freestanding membranes from 3D materials by performing remote epitaxy or van der Waals epitaxy on 2D materials followed by peeling active single-crystalline films from the 2D materials. I will discuss about the challenges and opportunities of this technology. In addition, I will present unprecedented artificial heterostructures that can be enabled by stacking those freestanding 3D material membranes.

KIM, JEEHWAN↗
DOE OSTI2022

New proposed ITER divertor design using carbon insert on tungsten to mitigate ELMs and secondary radiation effects on nearby components

Abstract Building a successful device for the magnetic fusion energy production is a great challenge. ITER is an international project of the tokamak based magnetic fusion design being developed for the demonstration of the feasibility of thermonuclear technologies for future realization of successful commercial fusion energy. A key obstacle to a successful magnetic fusion energy production is however, the performance during abnormal events including plasma disruptions and edge-localized modes (ELMs). A credible reactor design must tolerate at least a few of these transient events without serious consequences such as melting of the structure. This paper investigates and compares the performance of the current ITER tokamak design during two types of transient events, i.e., ELMs occurring at normal operation and disruptions during abnormal operation. We simulated the divertor components response using our integrated 3D HEIGHTS package. The simulations include self-consistent modeling of the interaction of the released core plasma particles with the initial solid divertor material, energy deposition processes, vaporization of divertor material, secondary plasma formation and MHD evolution, incident core particles collisions and scattering from this dense secondary plasma, photon radiation of secondary plasma, and the resulting heat loads on nearby components. Our simulations showed that using a small carbon insert around the strike point can significantly reduce the overall expected damage on the tungsten dome structure, reflector plates, and prevent tungsten vaporization and its potential core plasma contamination.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Single-Cell Universal Logic-in-Memory Using 2T-nC FeRAM: An Area and Energy-Efficient Approach for Bulk Bitwise Computation

This work presents a novel approach to configure 2T-nC ferroelectric RAM (FeRAM) for performing single cell logic-in-memory operations, highlighting its advantages in energy-efficient computation over conventional DRAM-based approaches. Unlike conventional 1T-1C dynamic RAM (DRAM), which incurs refresh overhead, 2T-nC FeRAM offers a promising alternative as a non-volatile memory solution with low energy consumption. Our key findings include the potential of quasi-nondestructive readout (QNRO) sensing in 2T-nC FeRAM for logic-in-memory (LiM) applications, demonstrating its inherent capability to perform inverting logic without requiring external modifications, a feature absent in traditional 1T-1C DRAM. We successfully implement the MINORITY function within a single cell of 2T-nC FeRAM, enabling universal NAND and NOR logic, validated through SPICE simulations and experimental data. Additionally, the research investigates the feasibility of 3D integration with 2T-nC FeRAM, showing substantial improvements in storage and computational density, facilitating bulk-bitwise computation. Our evaluation of eight real-world, data-intensive applications reveals that 2T-nC FeRAM achieves 2× higher performance and 2.5× lower energy consumption compared to DRAM. Furthermore, the thermal stability of stacked 2T-nC FeRAM is validated, confirming its reliable operation when integrated on a compute die. These findings emphasize the advantages of 2T-nC FeRAM for LiM, offering superior performance and energy efficiency over conventional DRAM.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Toward ultrafast, ultra-stable imaging arrays: Superlattice doping to enhance the performance of backside-illuminated 3D-hybridized silicon photodetectors

In this paper, the authors report the latest results on their development of superlattice-doped, thinned, backside-illuminated (BSI), 3D-integrated photodiode detectors—a step toward their ultimate goal of demonstrating ultrafast, ultrastable CMOS imaging arrays. As with most silicon-based photodetectors, backside-illumination and backside surface passivation are keys to achieve the highest performance capability. The two-dimensional (2D) doping technique developed at the Jet Propulsion Laboratory (JPL) has proved to result in a highly efficient, highly stable detector response when combined with a variety of detectors. Here, JPL's 2D-doping has been combined with Sandia's BSI photodetectors hybridized with custom fanout wafer via copper Direct Bond Interconnect (DBI®), a technology that is rapidly becoming industry standard for BSI CMOS imaging arrays. The prototype detectors were packaged and evaluated with respect to their response to low energy electrons. The authors find that the responsivity of 2D-doped BSI detectors is higher than devices prepared using other surface passivation techniques (i.e., ion implantation). The success of the work described herein verifies that the 2D-doping processes previously developed for Sandia's frontside-illuminated photodetectors are generally applicable to BSI detectors and demonstrates for the first time that JPL's 2D-doping process is compatible with the Cu-DBI® technology.

Jewell, April D.↗
DOE OSTI2020

Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies

Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Development and Refinement of Bison Models for Higher Burnup Application

Electric Power Research Institute (EPRI) is an international research organization funded by organizations in the energy and government sectors. The company conducts research to tackle the energy challenges of its member organizations. In support of the U.S. nuclear industry, EPRI and Idaho National Laboratory were awarded a U.S. Department of Energy Technology Commercialization Fund to develop a loss of coolant accident (LOCA) analysis tool. This tool was developed to support burnup extension activities by supplementing the existing capabilities of operators of existing large light-water reactor plants. The tool couples INL developed codes Bison and RELAP5-3D for advanced simulation of LOCA behavior. The project consists of seven major tasks, one of which is the development and refinement of Bison models for higher burnup applications. This task is broken down into six targeted areas of development and refinement including: formation of high burnup structure, fuel fracture and pulverization, transient fission gas release, axial gas communication within a fuel rod, cladding ballooning and burst, and axial fuel relocation. This report summarizes the models for both the fuel and cladding in Bison for high burnup application, identifies the areas of development and refinement necessary to enhance the Bison capabilities to be used in the coupled simulation tool with RELAP5-3D. Integration and regression testing to demonstrate proper implementation of the new features in Bison is highlighted.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2023

In Situ Study on Cu-to-Cu Thermal Compression Bonding

Cu-to-Cu thermal compression bonding (TCB) has emerged as a promising solution for ultrafine pitch packaging in 3D integrated circuit technologies. Despite the progress made by conventional Cu-to-Cu TCB methods in achieving good mechanical strength of the Cu bonds, the bonding processes generally require high temperature and high pressure, which may degrade the performance and reliability of the device. Therefore, it is imperative to investigate the processing parameters to understand the bonding mechanism and achieve effective TCB at a low temperature and low pressure. Here, we developed an in situ TCB technique inside a scanning electron microscope. The in situ TCB method enables a real-time observation of bonding development, which provides critical insights into how the texture and microstructure of Cu bumps may influence the creep and surface diffusion during the bonding process. This work features a strategy to advance our understanding of the bonding mechanisms and provides insight into tailoring the microstructure of Cu for bonding at a low temperature and low pressure.

36 MATERIALS SCIENCE↗
DOE OSTI2023

PIXEL2020: Tenth International Workshop on Semiconductor Pixel Detectors for Particles and Imaging

This workshop covers various topics related to pixel detector technology. Development and applications will be discussed for charged particle tracking in High Energy Physics, Nuclear Physics, Astrophysics, and X-ray imaging in Astronomy, Biology, Medicine and Material Science. The conference program will also include reports on front and back end electronics, radiation effects, low mass mechanics and construction techniques, and new technologies such as monolithic and 3D integrated detectors.

Sally, Seidel↗
DOE OSTI2021

High-Resolution 3D Acoustic Borehole Integrity Monitoring (Research Performance Progress Report Q2 2021)

Real-time, in-situ, high spatial resolution (sub-cm) imaging of the near-borehole environment would revolutionize wellbore diagnostics and integrity assessment by direct observation of defects. It is becoming increasingly apparent, that better understanding of the near-wellbore environment is required to meet the safety and operational needs in challenging environments such as those present in subsurface energy extraction (geothermal) and storage (CO2 sequestration) applications. Therefore, it is important to have a more robust ability to image the near-borehole and reliably detect defects. It was proposed to further develop and improve our advanced 3D imaging system to evaluate casing defects (e.g. corrosion) and cement quality in either open- or cased-borehole with the ultimate goal to develop a commercially deployable technology. The system consists of a unique acoustic source (LANL) and advanced inversion techniques for image processing (LANL, ORNL). This system will provide comprehensive borehole integrity monitoring with improved resolution over existing techniques. As an application of this imaging system, we will characterize the effectiveness of next-generation wellbore completion technology (NETL, SNL), and will demonstrate that, unlike current technology, the proposed approach can successfully characterize foamed cements.

15 GEOTHERMAL ENERGY↗
DOE OSTI2022

High-Resolution 3D Acoustic Borehole Integrity Monitoring (Final Report)

Real-time, in-situ, high spatial resolution (sub-cm) imaging of the near-borehole environment would revolutionize wellbore diagnostics and integrity assessment by direct observation of defects. It is becoming increasingly apparent, that better understanding of the near-wellbore environment is required to meet the safety and operational needs in challenging environments such as those present in subsurface energy extraction (geothermal) and storage (CO2 sequestration) applications. Therefore, it is important to have a more robust ability to image the near-borehole and reliably detect defects. It was proposed to further develop and improve our advanced 3D imaging system to evaluate casing defects (e.g. corrosion) and cement quality in either open- or cased-borehole with the ultimate goal to develop a commercially deployable technology. The system consists of a unique acoustic source (LANL) and advanced inversion techniques for image processing (LANL, ORNL). This system will provide comprehensive borehole integrity monitoring with improved resolution over existing techniques. As an application of this imaging system, we will characterize the effectiveness of next-generation wellbore completion technology (NETL, SNL), and will demonstrate that, unlike current technology, the proposed approach can successfully characterize foamed cements.

42 ENGINEERING↗
DOE OSTI2021

Report Q3FY21 - High-Resolution 3D Acoustic Borehole Integrity Monitoring

Real-time, in-situ, high spatial resolution (sub-cm) imaging of the near-borehole environment would revolutionize wellbore diagnostics and integrity assessment by direct observation of defects. It is becoming increasingly apparent, that better understanding of the near-wellbore environment is required to meet the safety and operational needs in challenging environments such as those present in subsurface energy extraction (geothermal) and storage (CO 2 sequestration) applications. Therefore, it is important to have a more robust ability to image the near-borehole and reliably detect defects. It was proposed to further develop and improve our advanced 3D imaging system to evaluate casing defects (e.g. corrosion) and cement quality in either open- or cased-borehole with the ultimate goal to develop a commercially deployable technology. The system consists of a unique acoustic source (LANL) and advanced inversion techniques for image processing (LANL, ORNL). This system will provide comprehensive borehole integrity monitoring with improved resolution over existing techniques. As an application of this imaging system, we will characterize the effectiveness of next-generation wellbore completion technology (NETL, SNL), and will demonstrate that, unlike current technology, the proposed approach can successfully characterize foamed cements.

42 ENGINEERING↗
DOE OSTI2024

Interfacial Momentum Matching for Ohmic Van Der Waals Contact Construction

The difficulty of achieving ohmic contacts is a long-standing challenge for the development and integration of devices based on 2D materials, due to the large mismatch between their electronic properties and those of both traditional metal-based and van der Waals (vdWs) electrodes. Research has focused primarily on the electronic energy band alignment, while the effects of momentum mismatch on carrier transport across the vdWs gaps are largely neglected. Graphene-silicon junctions are utilized to demonstrate that electron momentum distribution can dominate the electronic properties of vdWs contacts. By judiciously introducing scattering centers at the interface that provide additional momentum to compensate the momentum mismatch, the junction conductivity is enhanced by more than three orders of magnitude, enabling the formation of high-quality ohmic contacts. The study establishes the framework for the design of high-performance ohmic vdWs contacts based on both energy and momentum matching, which can facilitate efficient heterogeneous integration of 2D–3D systems and the development of post-CMOS architectures.

2D-3D integration↗
DOE OSTI2023

Spatiotemporal analysis of 3D human iPSC-derived neural networks using a 3D multi-electrode array

While there is a growing appreciation of three-dimensional (3D) neural tissues (i.e., hydrogel-based, organoids, and spheroids), shown to improve cellular health and network activity to mirror brain-like activity in vivo , functional assessment using current electrophysiology techniques (e.g., planar multi-electrode arrays or patch clamp) has been technically challenging and limited to surface measurements at the bottom or top of the 3D tissue. As next-generation MEAs, specifically 3D MEAs, are being developed to increase the spatial precision across all three dimensions (X, Y, Z), development of improved computational analytical tools to discern region-specific changes within the Z dimension of the 3D tissue is needed. In the present study, we introduce a novel computational analytical pipeline to analyze 3D neural network activity recorded from a “bottom-up” 3D MEA integrated with a 3D hydrogel-based tissue containing human iPSC-derived neurons and primary astrocytes. Over a period of ~6.5 weeks, we describe the development and maturation of 3D neural activity (i.e., features of spiking and bursting activity) within cross sections of the 3D tissue, based on the vertical position of the electrode on the 3D MEA probe, in addition to network activity (identified using synchrony analysis) within and between cross sections. Then, using the sequential addition of postsynaptic receptor antagonists, bicuculline (BIC), 2-amino-5-phosphonovaleric acid (AP-5), and 6-cyano-5-nitroquinoxaline-2,3-dione (CNQX), we demonstrate that networks within and between cross sections of the 3D hydrogel-based tissue show a preference for GABA and/or glutamate synaptic transmission, suggesting differences in the network composition throughout the neural tissue. The ability to monitor the functional dynamics of the entire 3D reconstructed neural tissue is a critical bottleneck; here we demonstrate a computational pipeline that can be implemented in studies to better interpret network activity within an engineered 3D neural tissue and have a better understanding of the modeled organ tissue.

3D culture↗
DOE OSTI2022

Multiplexed Anodic Stripping Voltammetry Detection of Heavy Metals in Water Using Nanocomposites Modified Screen-Printed Electrodes Integrated With a 3D-Printed Flow Cell

In this study, we present multiplexed anodic stripping voltammetry (ASV) detection of heavy metal ions (HMIs)—As(III), Cd(II), and Pb(II)—using a homemade electrochemical cell consisting of dual working, reference and counter screen-printed electrodes (SPE) on polyimide substrate integrated with a 3D-printed flow cell. Working and counter electrodes were fabricated by the screen-printing of graphite paste while the Ag/AgCl paste was screen-printed as a reference electrode (Ag/AgCl quasi-reference electrode). The working electrodes were modified with (BiO) 2 CO 3 -reduced graphene oxide (rGO)-Nafion [(BiO) 2 CO 3 -rGO-Nafion] and Fe 3 O 4 magnetic nanoparticles (Fe 3 O 4 MNPs) decorated Au nanoparticles (AuNPs)-ionic liquid (IL) (Fe 3 O 4 -Au-IL) nanocomposites separately to enhance HMIs sensing. Electrochemical detection was achieved using square wave ASV technique. The desired structure of the flow electrochemical cell was optimized by the computational fluid dynamic (CFD). Different experimental parameters for stripping analysis of HMIs were optimized including deposition time, deposition potential and flow rate. The linear range of calibration curves with the sensing nanocomposites modified SPE for the three metal ions was from 0–50 μg/L. The limits of detection (S/N = 3) were estimated to be 2.4 μg/L for As(III), 1.2 μg/L for Pb(II) and 0.8 μg/L for Cd(II). Furthermore, the homemade flow anodic stripping sensor platform was used to detect HMIs in simulated river water with a 95–101% recovery, indicating high selectivity and accuracy and great potential for applicability even in complex matrices.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗