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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
NASA NTRS2022

A Transient Hydrodynamic Model of Screen Channel Liquid Acquisition Devices for In-Space Cryogenic Propellant Management

Screen channel liquid acquisition devices (LADs) will play a crucial role in future deep space travel. It is essential that vapor-free delivery of propellants during tank-to-tank transfer is ensured to maximize yield from storage tanks and prevent potential combustion instabilities. The screen channel LAD utilizes a fine screen wire mesh that can separate phases in a low Bond number (i.e. microgravity) environment using surface tension forces. This study presents the development and verification of a new model for transient screen compliance, one of the influential factors for screen channel LAD design. Screen compliance is crucial during LAD channel outflow transients because the slight deflection of the screen can provide needed mass to satisfy rapid outflow demands and reduce the pressure difference across the screen. The model is successfully verified against CFD simulations. In addition, the characteristic speed for the governing screen compliance equations is derived which allows for numerical stability criteria to be established. As shown in this study, the transient maximum pressure difference across the screen can greatly exceed the steady state maximum pressure difference across the screen in many cases.

Hydrodynamics Simulations↗
NASA NTRS1992

Pressure transducer and system for cryogenic environments

A silicon pressure die is bonded to a borosilicate substrate above the pneumatic port. A Wheatstone bridge circuit is formed on the silicon pressure die and has bridge elements of silicon doped with boron to a deposit density level of approximately 1 x 10(exp 19)-10(exp 21) boron/cc. A current source is provided to excite the Wheatstone bridge circuit. In addition, a temperature sensor is provided to provide temperature readings. An array may be formed of the resulting pressure transducers. This unique solution of materials permits operation of a pressure transducer in cryogenic environments.

Chapman, John J.↗
NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗
NASA NTRS1981

Testing of solar cell covers and encapsulants conducted in a simulated space environment

The materials included in the evaluation were 0211 micro-sheet, FEP-A used as a cover and as an adhesive, DC 93-500 adhesive, PFA "hard coat" used as a cover, GE 615/UV-24 used as a cover, GR 650 used as a cover, and electrostatically bonded 7070 glass. The test environments were 1 MeV electron irradiation interspersed with thermal cycling, 0.5 MeV proton irradiation interspersed with thermal cycling and UV exposure interspersed with thermal cycling. Summary data is given describing the response of the test materials both visually and electrically to the three different environments.

Russell, D. A.↗
NASA NTRS1999

Thermographic Leak Detection of the Space Shuttle Main Engine Nozzle

The Space Shuttle Main Engines Nozzles consist of over one thousand tapered Inconel coolant tubes brazed to a stainless steel structural jacket. Liquid Hydrogen flows through the tubing, from the aft to forward end of the nozzle, under high pressure to maintain a thermal balance between the rocket exhaust and the nozzle wall. Three potential problems occur within the SSME nozzle coolant tubes as a result of manufacturing anomalies and the highly volatile service environment including poor or incomplete bonding of the tubes to the structural jacket, cold wall leaks and hot wall leaks. Of these conditions the identification of cold wall leaks has been the most problematic. The methods and results presented in this summary addresses the thermographic identification of cold wall "interstitial" leaks between the structural jacket and coolant tubes of the Space Shuttle Main Engines Nozzles.

Walker, James L.↗
NASA NTRS1997

Fossilization of Coniform (Phormidium) Stromatolites In Siliceous Thermal Springs, Yellowstone National Park

We have studied fossilization processes in well-developed cyanobacterial mats present in mid-terrace ponds of silica-precipitating thermal springs of Yellowstone National Park. These mats occur over temperatures of approx.35-60 C and are dominated by species of Phormidium. Within Bonded systems two end member environments have been distinguished based temperature, depth, and the stability of spring inflows, each differing substantially in the style of stromatolite morphogenesis and fossilization. Type 1 systems include shallow, ephemeral ponds where water flow and temperature fluctuates widely on a seasonal basis; mats typically secrete rapidly up to the air-water interface, forming exposed islands. Silicification occurs primarily by the wicking of water onto the surface of exposed mats, leading to the evaporative concentration of silica near the surface. pH microelectronic measurements in partially-exposed columns show strong gradients in pH with values exceeding 10.5 in the upper am of silicifying mats, decreasing to <9.0 a few mm below the surface. High oxygen concentrations lead to the rapid oxidation of most organic materials. In Type I systems, the tops of coniform and columnar stromatolites become silicified first, followed by the bases. This typically leads to extensive fragmentation during the initial stages of burial. Case 2 systems include deeper ponds where the water flow, temperature and depth are seasonally more stable, and where mats develop larger-scale tufts and columns. Alkalinity in permanently submerged mats increases into tuft interiors from approx.9.0 near the surface to >10.0 at depth. Moderate silicification is apparent throughout mat frameworks, although there is frequently a densely silicified core near the base. In Type 2 systems, preservation of the coniform and columnar architecture of stromatoilites is much more robust. Sub-fossil examples suggest minimal fragmentation prior to burial. Comparative rapid analysis of the phone zones of submerged and exposed (silicifying) mats demonstrated the recovery of comparable levels of esterified fatty acids in both types of mats. Membrane lipids apparently remain intact during the early stages of silicification, although their fate during early diagenesis is still being evaluated.

Farmer, Jack↗
NASA NTRS2017

Contamination and Surface Preparation Effects on Composite Bonding

Results presented here demonstrate the effect of several prebond surface contaminants (hydrocarbon, machining fluid, latex, silicone, peel ply residue, release film) on bond quality, as measured by fracture toughness and failure modes of carbon fiber reinforced epoxy substrates bonded in secondary and co-bond configurations with paste and film adhesives. Additionally, the capability of various prebond surface property measurement tools to detect contaminants and potentially predict subsequent bond performance of three different adhesives is also shown. Surface measurement methods included water contact angle, Dyne solution wettability, optically stimulated electron emission spectroscopy, surface free energy, inverse gas chromatography, and Fourier transform infrared spectroscopy with chemometrics analysis. Information will also be provided on the effectiveness of mechanical and energetic surface treatments to recover a bondable surface after contamination. The benefits and drawbacks of the various surface analysis tools to detect contaminants and evaluate prebond surfaces after surface treatment were assessed as well as their ability to correlate to bond performance. Surface analysis tools were also evaluated for their potential use as in-line quality control of adhesive bonding parameters in the manufacturing environment.

Kutscha, Eileen O.↗
NASA NTRS1977

The 200 watts/kilogram solar array conceptual approach study. Phase 2: Assessment report for proof-of-concept experiments and Halley's comet concentrator array

The activities associated with the fabrication, handling, and testing of 2-mil solar cell modules on a flexible substrate are demonstrated. It is shown that 2-mil solar cells can be reliably handled, welded, and bonded to a Kapton substrate. Flexible Invar interconnects can be used to interconnect individual cells to form modules. These solar cell modules can be temperature cycled, wrapped around a 10-inch diameter drum, and vibrated to the shuttle environment with no significant damage. A bonding technique was developed to physically join adjacent modules that is stronger than the Kapton, itself. Ultraviolet radiation tests were performed on RTV - silicone as a cell cover material - with very encouraging results.

Source record↗
NASA NTRS2022

Controlling Triboelectrification Effects on Spacecraft Ethernet Cabling

Triboelectric charging of a spacecraft and launch vehicles on ascent may occur due to the process of contact and separation between the vehicle skin and aerosols, dust, ice, water droplets, smoke, and other particulates encountered in the flight path. Depending on characteristics at the atomic and molecular levels of the vehicle skin’s surface and the substances and particulates encountered, electrical charge will transfer between the vehicle and the encountered substances, resulting in an accumulation of electrical charge on the vehicle skin. If the vehicle skin is conductive and electrically bonded such that in its entirety it presents an equipotential surface, then the accumulated electrical charge will spread in a nearly uniform manner leaving all regions with a nearly equal potential with respect to each other and the surrounding environment. Regions that are not electrically bonded as described, or surfaces that have resistivity values, can reach different potentials than the surrounding surfaces. When this happens, the differing potentials may grow to very large magnitudes, leading to electrostatic discharge events between the regions. As the vehicle rises in altitude, the breakdown potential between these regions of differing potential decreases commensurate with decreases in atmospheric density and pressure. If the potential differences between surfaces of the vehicle become equal to or exceed the breakdown potential, one or more discharge events may occur, each of them generating voltage and current transients that can easily damage or interfere with the designed operation of on-board electrical, avionic, and communications and navigation systems. This lesson learned discusses an in-flight anomaly caused by triboelectric discharge events and exacerbated by the lack of adequate cable shielding that affected flight computer communication links. Also discussed are mitigations to prevent this occurrence.

Ethernet↗
NASA NTRS1981

Histidyl-histidine catalysis of glycine condensation in fluctuating clay environments

Histidyl-histidine is a remarkably effective catalyst of peptide bond formation in the reaction of glycine in a fluctuating (hot-dry, cold-wet) clay environment. It has shown turnover numbers (molecules of glycine incorporated in oligoglycines per molecule of catalyst) as high as 18 in a single cycle and as high as 52 overall. A number of other dipeptides were tested, as well as monomeric histidine, N-acetyl histidine, and imidazole, none of which showed turnover numbers greater than one. Histidyl-histidine is a model for a prebiotic protoenzyme, and implications for the development of a simple translation mechanism are discussed.

White, D. H.↗
NASA NTRS2011

Cryogenic-Compatible Winchester Connector Mount and Retaining System for Composite Tubes

A connector retainer and mounting system has been designed to replace screw-mounting of Winchester connectors. Countersunk screws are normally used to secure connectors to structures, and to keep them from coming apart. These screws are normally put into threaded or through-holes in metallic structures. This unique retainer is designed such that integral posts keep the connector halves retained, and a groove permits a cable tie to be fastened around the retainer and composite tube, thus securing the connector to the structure. The system is compatible for use on cryogenic (and conventional) bonded composite tube assemblies. Screws and tapped/through-holes needed to retain and mount Winchester connectors cannot be used on blind-access composite tubes. This system allows for rapid installation, removal, low-molecular-outgassing materials, and particulate-free installation and removal. Installation and/or changes late in the integration, and test flow with limited access in a cleanroom environment are possible. No sanding or bonding is needed.

Pontius, James↗
NASA NTRS2024

Space Rated High Voltage Plasma Generating Supply

The use of plasma for in-situ resource utilization (ISRU) applications (such as water treatment, acid production, plant seed activation, biofilm sanitization, or waste gasification) is an active area of research at the KSC Applied Chemistry Lab (ACL). The generation of plasma for experimentation has thus far been done with lab-rated power supplies which are unsuitable for space applications, and no suitable supply is readily available for purchase. This project tackled the development of a low TRL prototype 500 W power supply intended for generating plasma in space. The design was based on similar power electronic circuits used for electric propulsion systems and was adapted for use in ISRU applications. This technology will enable KSC’s plasma-based ISRU related technologies to be demonstrated in the space environment.

Nathaniel Cain↗
NASA NTRS2026

Assessing the Adhesion of Nanofibrous PVDF-HFP as Passive Thermal Control Coatings for the Extraterrestrial Storage of Cryogenic Propellants

Cryogenic propellant passive thermal management techniques in space are essential complements to active thermal management methods, helping reduce absolute dependence on the latter. Particularly, materials with superior optical properties (high solar reflectance and infrared emittance) would be beneficial for passive thermal control to reject most of the incident solar radiation and enhance thermal emission from the storage tank, leading to self-cooling. We developed a nanofibrous, porous passive thermal control material by electrospinning polyvinylidene fluoride-co-hexafluoropropylene (PVDF-HFP) co-polymer onto an aluminum foil substrate. The material exhibits a very high solar reflectance (>99%) and infrared emittance (~86%) when characterized in the ultraviolet-visible-near infrared and mid-infrared wavelengths. This study focuses on the adhesion of the nanofibrous PVDF-HFP to the substrate. We incorporated in-lab fabricated and commercial adhesives, under normal room conditions, between the nanofibers and the aluminum foil substrate to improve their adhesion. Some samples were also exposed to space-like conditions – vacuum and thermal cycling, to investigate their effects on the strengths of adhesives. Subsequently, adhesion peel tests were conducted on all the samples to assess the peel strengths of the bonds. Peel test strengths after space environment conditioning of the adhesives were generally higher than those observed in the pristine, unaged samples. The results are discussed in this study.

Chieloka Ibekwe↗
NASA NTRS2006

Laser Shearography Inspection of TPS (Thermal Protection System) Cork on RSRM (Reusable Solid Rocket Motors)

Laser Shearography is a viable inspection method for detection of de-bonds and voids within the external TPS (thermal protection system) on to the Space Shuttle RSRM (reusable solid rocket motors). Cork samples with thicknesses up to 1 inch were tested at the LTI (Laser Technology Incorporated) laboratory using vacuum-applied stress in a vacuum chamber. The testing proved that the technology could detect cork to steel un-bonds using vacuum stress techniques in the laboratory environment. The next logical step was to inspect the TPS on a RSRM. Although detailed post flight inspection has confirmed that ATK Thiokol's cork bonding technique provides a reliable cork to case bond, due to the Space Shuttle Columbia incident there is a great interest in verifying bond-lines on the external TPS. This interest provided and opportunity to inspect a RSRM motor with Laser Shearography. This paper will describe the laboratory testing and RSRM testing that has been performed to date. Descriptions of the test equipment setup and techniques for data collection and detailed results will be given. The data from the test show that Laser Shearography is an effective technology and readily adaptable to inspect a RSRM.

Lingbloom, Mike↗
NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS2004

A Novel Surface Treatment for Titanium Alloys

High-speed commercial aircraft require a surface treatment for titanium (Ti) alloy that is both environmentally safe and durable under the conditions of supersonic flight. A number of pretreatment procedures for Ti alloy requiring multi-stages have been developed to produce a stable surface. Among the stages are, degreasing, mechanical abrasion, chemical etching, and electrochemical anodizing. These treatments exhibit significant variations in their long-term stability, and the benefits of each step in these processes still remain unclear. In addition, chromium compounds are often used in many chemical treatments and these materials are detrimental to the environment. Recently, a chromium-free surface treatment for Ti alloy has been reported, though not designed for high temperature applications. In the present study, a simple surface treatment process developed at NASA/LaRC is reported, offering a high performance surface for a variety of applications. This novel surface treatment for Ti alloy is conventionally achieved by forming oxides on the surface with a two-step chemical process without mechanical abrasion. This acid-followed-by-base treatment was designed to be cost effective and relatively safe to use in a commercial application. In addition, it is chromium-free, and has been successfully used with a sol-gel coating to afford a strong adhesive bond after exposure to hot-wet environments. Phenylethynyl containing adhesives were used to evaluate this surface treatment with sol-gel solutions made of novel imide silanes developed at NASA/LaRC. Oxide layers developed by this process were controlled by immersion time and temperature and solution concentration. The morphology and chemical composition of the oxide layers were investigated using scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and Auger electron spectroscopy (AES). Bond strengths made with this new treatment were evaluated using single lap shear tests.

Lowther, S. E.↗