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NASA NTRS2023

Flex-Capsule for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the Gimbal output flange. Such a mechanism had often utilized round wire bundles, or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗

NASA NTRS2011

PCB-Based Break-Out Box

Break-out boxes (BOBs) are necessary for all electrical integration/cable checkouts and troubleshooting. Because the price of a BOB is high, and no work can be done without one, often the procedure stops, simply waiting for a BOB. A less expensive BOB would take less time in the integration, testing, and troubleshooting process. The PCB-based BOB works and looks the same as a standard JPL BOB, called Gold Boxes. The only differences between the old BOB and the new PCB-based BOB is that the new one has 80 percent of its circuitry in a printed circuit board. This process reduces the time for fabrication, thus making the BOBs less expensive. Moreover, because of its unique design, the new BOBs can be easily assembled and fixed. About 80 percent of the new PCB-based BOB is in a $22 (at the time of this reporting) custom-designed, yet commercially available PCB. This device has been used successfully to verify that BOB cables were properly made. Also, upon completion, the BOB was beeped out via a multimeter to ensure that all sockets on the connectors were properly connected to the respective banana jack. When compared to the Gold Box BOBs, the new BOB has many advantages. It is much more cost efficient, it delivers equal usability at substantially lower cost of the BOB, and the Gold Box is much heavier when compared to the new BOB. The new BOB is also a bit longer and much more versatile in that connectors are easily changeable and if a banana jack is broken, it can be replaced instead of throwing away an entire BOB.

Lee, Jason H.↗

NASA NTRS1975

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.↗

DOE OSTI2026

TRIZ-Based Design Improvement for Facilitating Transmission Control Unit Remanufacturing

Design for Remanufacturing (DfRem) centers on enhancing product design and operations to facilitate remanufacturing while increasing both economic and environmental sustainability. DfRem requires a comprehensive understanding of product characteristics, production conditions, and operational constraints. Thus, DfRem requires a systematic methodology to identify and implement alternative designs. Among many critical steps in remanufacturing, disassembly is essential because it directly supports remanufacturing by separation of product components for cleaning, inspection, and other subsequent process steps. This study proposes a TRIZ-based framework to improve product design for disassembly in support of remanufacturing. The framework is applied to a transmission control unit (TCU) case study. The current TCU design prevents remanufacturing due to the sealant-based component joinery, which complicates disassembly and risks damaging the printed circuit board (PCB). After defining technical contradictions for the TCU product design and reviewing the suggested TRIZ principles to solve the conflicts, a cantilever snap-fit design alternative is developed. The economic feasibility of the snap-fit design is assessed by comparing the current and snap-fit design costs for three life cycles. The cost analysis demonstrates that the cost of the snap-fit design remains the same as the current design. Additionally, the snap-fit design offers substantial cost savings for three life cycles compared to the current design. We demonstrate how snap-fit design supports both environmental and economic sustainability.

42 ENGINEERING↗

NASA NTRS2015

Conformal and Spectrally Agile Ultra Wideband Phased Array Antenna for Communication and Sensing

There is a continuing need for reducing size and weight of satellite systems, and is also strong interest to increase the functional role of small- and nano-satellites (for instance SmallSats and CubeSats). To this end, a family of arrays is presented, demonstrating ultra-wideband operation across the numerous satellite communications and sensing frequencies up to the Ku-, Ka-, and Millimeter-Wave bands. An example design is demonstrated to operate from 3.5-18.5 GHz with VSWR2 at broadside, and validated through fabrication of an 8 x 8 prototype. This design is optimized for low cost, using Printed Circuit Board (PCB) fabrication. With the same fabrication technology, scaling is shown to be feasible up to a 9-49 GHz band. Further designs are discussed, which extend this wideband operation beyond the Ka-band, for instance from 20-80 GHz. Finally we will discuss recent efforts in the direct integration of such arrays with digital beamforming back-ends. It will be shown that using a novel on-site coding architecture, orders of magnitude reduction in hardware size, power, and cost is accomplished in this transceiver.

Ultra Wideband antenna↗

NASA NTRS2009

Microwave Temperature Profiler Mounted in a Standard Airborne Research Canister

Many atmospheric research aircraft use a standard canister design to mount instruments, as this significantly facilitates their electrical and mechanical integration and thereby reduces cost. Based on more than 30 years of airborne science experience with the Microwave Temperature Profiler (MTP), the MTP has been repackaged with state-of-the-art electronics and other design improvements to fly in one of these standard canisters. All of the controlling electronics are integrated on a single 4 ~5-in. (.10 ~13- cm) multi-layer PCB (printed circuit board) with surface-mount hardware. Improved circuit design, including a self-calibrating RTD (resistive temperature detector) multiplexer, was implemented in order to reduce the size and mass of the electronics while providing increased capability. A new microcontroller-based temperature controller board was designed, providing better control with fewer components. Five such boards are used to provide local control of the temperature in various areas of the instrument, improving radiometric performance. The new stepper motor has an embedded controller eliminating the need for a separate controller board. The reference target is heated to avoid possible emissivity (and hence calibration) changes due to moisture contamination in humid environments, as well as avoiding issues with ambient targets during ascent and descent. The radiometer is a double-sideband heterodyne receiver tuned sequentially to individual oxygen emission lines near 60 GHz, with the line selection and intermediate frequency bandwidths chosen to accommodate the altitude range of the aircraft and mission.

Mahoney, Michael J.↗

NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗

DOE OSTI2025

Enhancements to Lab-on-a-Fish Technology: Final Report for I3T Project 81245

PNNL has engaged in discussions with several organizations regarding potential future collaborations. PNNL has developed the Lab-on-a-Fish prototypes and produced video instructions for an organization conducting research on shark eggs. Several organizations have expressed interest in using the Lab-on-a-Fish for their studies. We’ve also updated two versions of the Lab-on-a-Fish to expand its applications to a wider range of animal studies and accelerate its commercialization. The new design of the Lab-on-a-Fish, which incorporates PCB-based electrodes, has demonstrated the ability to capture clear ECG signals without the need for additional needle-shaped electrodes. This innovation eliminates the need for implanting electrodes beneath the fish's skin at specific locations, which is required with the current version of Lab-on-a-Fish. This change significantly simplifies the manufacturing and implantation process. For the Lab-on-a-Fish design that uses an optical pulse oximeter, the measurement results were primarily influenced by respiratory activity rather than heart rate. This occurred because the oximeter was placed beneath the operculum. Further research and development are needed to explore more suitable locations and methods for accurate pulse oximeter measurements.

59 BASIC BIOLOGICAL SCIENCES↗

NASA NTRS2012

Boundary-Layer Instability Measurements in a Mach-6 Quiet Tunnel

Several experiments have been performed in the Boeing/AFOSR Mach-6 Quiet Tunnel at Purdue University. A 7 degree half angle cone at 6 degree angle of attack with temperature-sensitive paint (TSP) and PCB pressure transducers was tested under quiet flow. The stationary crossflow vortices appear to break down to turbulence near the lee ray for sufficiently high Reynolds numbers. Attempts to use roughness elements to control the spacing of hot streaks on a flared cone in quiet flow did not succeed. Roughness was observed to damp the second-mode waves in areas influenced by the roughness, and wide roughness spacing allowed hot streaks to form between the roughness elements. A forward-facing cavity was used for proof-of-concept studies for a laser perturber. The lowest density at which the freestream laser perturbations could be detected was 1.07 x 10(exp -2) kilograms per cubic meter. Experiments were conducted to determine the transition characteristics of a streamwise corner flow at hypersonic velocities. Quiet flow resulted in a delayed onset of hot streak spreading. Under low Reynolds number flow hot streak spreading did not occur along the model. A new shock tube has been built at Purdue. The shock tube is designed to create weak shocks suitable for calibrating sensors, particularly PCB-132 sensors. PCB-132 measurements in another shock tube show the shock response and a linear calibration over a moderate pressure range.

Berridge, Dennis C.↗

DOE OSTI2024

Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control

Princeton Fusion Systems (PFS) has designed, built, and tested a Load Switch printed circuit board (PCB) to demonstrate the capabilities of 2 kV silicon carbide (SiC) cascodes in development by Qorvo towards plasma heating and control applications. Initial tests have been conducted at low power (~100 W) for validation with thermal finite element analysis (FEA) modeling performed by the National Renewable Energy Laboratory (NREL). Comparisons of experimental data with the thermal modeling results, along with considerations for operating in plasma systems, will be discussed.

CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SU↗

DOE OSTI2024

Investigation of a Multi-Rotor Triboelectric Nanogenerator Using a Modular Flexible Circuit Board Stack

Triboelectric nanogenerators (TENGs) are a nascent class of energy harvester that are being explored for scavenging energy from small ocean waves. To date, they have been integrated in wave energy converters (WECs) designed to capture random motion caused by the perturbations of the ocean surface. Blue economy applications such as ocean observation can benefit greatly from more substantial wave-derived power, as such, the power output of existing TENG WECs must be increased several-fold to become viable. This study describes the conceptualization of a rotary TENG, and the subsequent efforts to increase its power output by stacking multiple stator and rotor pairs. In the latter part of this study, we introduce a novel means of incorporating a friction element into the design of the TENG by employing flexible printed circuit board (PCB) rotors. At rest, these flexible rotors will contact the stator, building static charges due to friction, at speed, these flexible rotors will be decoupled from the stator, reducing friction and allowing faster rotation. Initial results indicate that the power output of the flexible PCB rotor does not produce more power than a rigid, acrylic disk rotor, however the current output of the prototype is boosted, and the prototype is far more compact, allowing for a higher energy density than the rigid rotor prototype.

bench testing↗

NASA NTRS2014

Initial Field Deployment Results of Green PCB Removal from Sediment Systems (GPRSS)

Purpose of Study: (a) Develop/optimize technology capable of removing PCBs from contaminated sediments; (b) Develop design for functional GPRSS unit; (c) Produce and prove functionality of prototype units in a laboratory settings; (d) Produce fully-functional GPRSS units for testing at a demonstration site in Altavista, VA; and (e) Evaluate efficacy of GPRSS technology for the remediation of PCB-contaminated sediments.

Initial Field↗

NASA NTRS2010

FPGA-based hardware/software co-design instrument command-and-control solutions

Traditional design methodology dictates that an instrument electronics platform should consist of a printed circuit board (PCB)—often multiple boards—populated with many components and support electronics. More specifically, each subsystem is composed of numerous integrated circuits (ICs) spread across the board(s), connected with innumerable traces and wires. Additionally, it is often the case that the hardware and software design teams are quite separated—the hardware team designs a board and hands it to a software team, who must then deal with any hardware quirkiness and may need to rewrite software due to inadequately defined interfaces...

Allen, Mark A.↗

NASA NTRS2016

Space to Space Advanced EMU Radio

The main task for this project was the development of a prototype for the Space to Space Advanced EMU Radio (SSAER). The SSAER is an updated version of the Space to Space EMU Radio (SSER), which is the current radio used by EMUs (Extravehicular Mobility Unit) for communication between suits and with the ISS. The SSER was developed in 1999, and it was desired to update the design used in the system. Importantly, besides replacing out-of-production parts it was necessary to decrease the size of the radio due to increased volume constraints with the updated Portable Life Support System (PLSS) 2.5, which will be attached on future space suits. In particular, it was desired to fabricate a PCB for the front-end of the prototype SSAER system. Once this board was manufactured and all parts assembled, it could then be tested for quality of operation as well as compliancy with the SSER required specifications. Upon arrival, a small outline of the target system was provided, and it was my responsibility to take that outline to a finished, testable board. This board would include several stages, including frequency mixing, amplification, modulation, demodulation, and handled both the transmit and receive lines of the radio. I developed a new design based on the old SSER system and the outline provided to me, and found parts to fit the tasks in my design. It was also important to consider the specifications of the SSER, which included the system noise figure, gain, and power consumption. Further, all parts needed to be impedance matched, and spurious signals needed to be avoided. In order to fulfill these two requirements, it was necessary to perform some calculations using a Smith Chart and excel analysis. Once all parts were selected, I drew the schematics for the system in Altium Designer. This included developing schematic symbols, as well as layout. Once the schematic was finished, it was then necessary to lay the parts out onto a PCB using Altium. Similar to the schematic design, in order to accomplish this it was necessary to develop component land patterns and add component 3D models. All of this was achieved, and the PCB is currently in review. After it is finished being reviewed, this board will be sent out for manufacture. All electronic components used in the PCB have been acquired, and once the board arrives they will be soldered onto the board using a machine in building 44. Finally, the board will be tested for performance on-site. This will likely be accomplished by the end of the internship.

Maicke, Andrew↗

DOE OSTI2024

Ultrasound preliminary cyber-physical evaluation

In this assessment, we focused on identifying unwanted RF emissions from the subject devices. This consisted of two major approaches: 1) Monitor for emitted RF during operation and ensure it is within expected bounds. 2) Inspect circuit board construction for any geometry or design patterns that could lead to RF emissions, whether intentional or unintentional. These patterns include: a) Single-ended PCB traces that could operate as an antenna. b) Insufficient shielding around typically “noisy” components such as switching power supplies. c) Free-hanging high-speed signal wires with no shielding that could emit RF. Suspicious components and design patterns were given a plausible reason to be included in the design. Any suspicious components or patterns warranted reason for deeper investigation. After more in-depth analysis no components were found to be intentionally malicious or had unexpected functionality.

42 ENGINEERING↗

NASA NTRS2016

Advancing Small Satellite Electronics Heritage for Microfluidic Biological Experiments

DLR's Eu:CROPIS (Euglena and Combined Regenerative Organic-Food Production in Space) mission, launching in 2017, will carry multiple biological payloads into a sun-synchronous orbit, including NASA Ames' PowerCell experiment. PowerCell will attempt to characterize the viability of synthetic biology at micro-g, Lunar, and Martian gravity levels. PowerCell experiment requirements demand an electronic system similar to previous microfluidic biology payloads, but with an expanded feature set. As such, the system was based on PharmaSat (Diaz-Aguado et al. 2009), a previous successful biology payload from NASA Ames, and improved upon. Newer, more miniaturized electronics allow for greater capability with a lower part count and smaller size. Two identical PowerCell enclosures will fly. Each enclosure contains two separate and identical experiments with a 48-segment optical density measurement system, grow light system, microfluidic system for nutrient delivery and waste flushing, plus thermal control and environmental sensing/housekeeping including temperature, pressure, humidity, and acceleration. Electronics consist of a single Master PCB that interfaces to the spacecraft bus and regulates power and communication, plus LED, Detector, and Valve Manifold PCBs for each experiment. To facilitate ease of reuse on future missions, experiment electronics were designed to be compatible with a standard 3U small sat form factor and power bus, or to interface with a Master power/comm PCB for use in a larger satellite as in the case of PowerCell's flight on Eu:CROPIS.

biology↗

DOE OSTI2024

The DUNE Far Detector Vertical Drift Technology. Technical Design Report

DUNE is an international experiment dedicated to addressing some of the questions at the forefront of particle physics and astrophysics, including the mystifying preponderance of matter over antimatter in the early universe. The dual-site experiment will employ an intense neutrino beam focused on a near and a far detector as it aims to determine the neutrino mass hierarchy and to make high-precision measurements of the PMNS matrix parameters, including the CP-violating phase. It will also stand ready to observe supernova neutrino bursts, and seeks to observe nucleon decay as a signature of a grand unified theory underlying the standard model. The DUNE far detector implements liquid argon time-projection chamber (LArTPC) technology, and combines the many tens-of-kiloton fiducial mass necessary for rare event searches with the sub-centimeter spatial resolution required to image those events with high precision. The addition of a photon detection system enhances physics capabilities for all DUNE physics drivers and opens prospects for further physics explorations. Given its size, the far detector will be implemented as a set of modules, with LArTPC designs that differ from one another as newer technologies arise. In the vertical drift LArTPC design, a horizontal cathode bisects the detector, creating two stacked drift volumes in which ionization charges drift towards anodes at either the top or bottom. The anodes are composed of perforated PCB layers with conductive strips, enabling reconstruction in 3D. Light-trap-style photon detection modules are placed both on the cryostat's side walls and on the central cathode where they are optically powered. This Technical Design Report describes in detail the technical implementations of each subsystem of this LArTPC that, together with the other far detector modules and the near detector, will enable DUNE to achieve its physics goals.

47 OTHER INSTRUMENTATION↗

NASA NTRS1995

Low temperature Zn diffusion for GaSb solar cell structures fabrication

Low temperature Zn diffusion in GaSb, where the minimum temperature was 450 C, was studied. The pseudo-closed box (PCB) method was used for Zn diffusion into GaAs, AlGaAs, InP, InGaAs and InGaAsP. The PCB method avoids the inconvenience of sealed ampoules and proved to be simple and reproducible. The special design of the boat for Zn diffusion ensured the uniformality of Zn vapor pressure across the wafer surface, and thus the uniformity of the p-GaSb layer depth. The p-GaSb layers were studied using Raman scattering spectroscopy and the x-ray rocking curve method. As for the postdiffusion processing, an anodic oxidation was used for a precise thinning of the diffused GaSb layers. The results show the applicability of the PCB method for the large-scale production of the GaSb structures for solar cells.

Sulima, Oleg V.↗