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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 55 records · Page 3

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and the New Tenets for Cost Conscious Mission Assurance on Electrical, Electronic, and Electromechanical (EEE) Parts

The NEPP Program focuses on the reliability aspects of electronic devices (integrated circuits such as a processor in a computer). There are three principal aspects of this reliability: 1) Lifetime, inherent failure and design issues related to the EEE parts technology and packaging; 2) Effects of space radiation and the space environment on these technologies, and; 3) Creation and maintenance of the assurance support infrastructure required for mission success. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment, and to ensure that appropriate EEE parts research is performed to meet NASA mission assurance needs. NEPPs FY15 goals are to represent the NASA voice to the greater aerospace EEE parts community including supporting anti-counterfeit and trust, provide relevant guidance to cost-effective missions, aid insertion of advanced (and commercial) technologies, resolve unexpected parts issues, ensure access to appropriate radiation test facilities, and collaborate as widely as possible with external entities. In accordance with the changing mission profiles throughout NASA, the NEPP Program has developed a balanced portfolio of efforts to provide agency-wide assurance for not only traditional spacecraft developments, but also those in-line with the new philosophies emerging worldwide. In this presentation, we shall present an overview of this program and considerations for EEE parts assurance as applied to cost conscious missions.

space radiation↗

Long life assurance study for manned spacecraft long life hardware. Volume 2: Long life assurance studies of EEE parts and packaging

Guidelines for the design, development, and fabrication of electronic components and circuits for use in spacecraft construction are presented. The subjects discussed involve quality control procedures and test methodology for the following subjects: (1) monolithic integrated circuits, (2) hybrid integrated circuits, (3) transistors, (4) diodes, (5) tantalum capacitors, (6) electromechanical relays, (7) switches and circuit breakers, and (8) electronic packaging.

Source record↗

Electron-proton spectrometer quality assurance procedures for equipment and parts

Quality control procedures are established for personnel who are concerned with receiving, storage, transfer, inspection, and use of flight or mission related hardware for the electron/proton spectrometer (EPS) program. While general guidelines, designed to cover all situations, exist, this document provides guidelines and procedures specifically designed to supplement the quality assurance activity on the EPS Program. It is the purpose of this document to insure that all equipment, parts and other hardware received and/or used in the EPS program meet or surpass the standards and requirements established by cognizant authorities.

Gleeson, P.↗

TIMED Doppler Interferometer

The Timed Doppler Interferometer (TIDI) will accurately and precisely determine the global vector MLTI (Mesosphere and Lower Thermosphere) wind, temperature, and density profiles. It will measure characteristics of the gravity wave and planetary wave spectra. The tidal characteristics of temperature, density, and wind in the MLTI will be determined. The neutral and ion winds will be measured to characterize the electrodynamical behavior of the MLTI. Oxygen and O2 abundances and nocticulent cloud activity will be measured. This review goes into the calibration and error sources, optical design, mechanisms design, detector design, electronics design, microprocessor and flight software design, and quality assurance and parts.

Killeen, Timothy L.↗

Propulsion Health Management System Development for Affordable and Reliable Operation of Space Exploration Systems

The constraints of future Exploration Missions will require unique integrated system health management capabilities throughout the mission. An ambitious launch schedule, human-rating requirements, long quiescent periods, limited human access for repair or replacement, and long communication delays, all require an integrated approach to health management that can span distinct, yet interdependent vehicle subsystems, anticipate failure states, provide autonomous remediation and support the Exploration Mission from beginning to end. Propulsion is a critical part of any space exploration mission, and monitoring the health of the propulsion system is an integral part of assuring mission safety and success. Health management is a somewhat ubiquitous technology that encompasses a large spectrum of physical components and logical processes. For this reason, it is essential to develop a systematic plan for propulsion health management system development. This paper provides a high-level perspective of propulsion health management systems, and describes a logical approach for the future planning and early development that are crucial to planned space exploration programs. It also presents an overall approach, or roadmap, for propulsion health management system development and a discussion of the associated roadblocks and challenges.

Melcher, Kevin J.↗

Space Shuttle Main Engine - The Relentless Pursuit of Improvement

The Space Shuttle Main Engine (SSME) is the only reusable large liquid rocket engine ever developed. The specific impulse delivered by the staged combustion cycle, substantially higher than previous rocket engines, minimized volume and weight for the integrated vehicle. The dual pre-burner configuration permitted precise mixture ratio and thrust control while the fully redundant controller and avionics provided a very high degree of system reliability and health diagnosis. The main engine controller design was the first rocket engine application to incorporate digital processing. The engine was required to operate at a high chamber pressure to minimize engine volume and weight. Power level throttling was required to minimize structural loads on the vehicle early in flight and acceleration levels on the crew late in ascent. Fatigue capability, strength, ease of assembly and disassembly, inspectability, and materials compatibility were all major considerations in achieving a fully reusable design. During the multi-decade program the design evolved substantially using a series of block upgrades. A number of materials and manufacturing challenges were encountered throughout SSME s history. Significant development was required for the final configuration of the high pressure turbopumps. Fracture control was implemented to assess life limits of critical materials and components. Survival in the hydrogen environment required assessment of hydrogen embrittlement. Instrumentation systems were a challenge due to the harsh thermal and dynamic environments within the engine. Extensive inspection procedures were developed to assess the engine components between flights. The Space Shuttle Main Engine achieved a remarkable flight performance record. All flights were successful with only one mission requiring an ascent abort condition, which still resulted in an acceptable orbit and mission. This was achieved in large part via extensive ground testing to fully characterize performance and to establish acceptable life limits. During the program over a million seconds of accumulated test and flight time was achieved. Post flight inspection and assessment was a key part of assuring proper performance of the flight hardware. By the end of the program the predicted reliability had improved by a factor of four. These unique challenges, evolution of the design, and the resulting reliability will be discussed in this paper.

VanHooser, Katherine P.↗

NASA Electronic Parts and Packaging (NEPP) Program

Recent Findings from Audits, New Technology Data Reviews a) Disabled Chip Burn-ins A recent audit for a QML device discovered that the chip was disabled during the static burn-in, thus it was not drawing any current. Recommendation: For new SMDs add a statement within the burn-in paragraphs stating that the parts shall be kept in their enabled state during the burn-in. b) Class Q 160-hr/125oC Burn-in This is being interpreted as a static burn-in (even for CMOS technology). Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. c) At Frequency (Dynamic) Burn-ins Test equipment limitation is being cited for not doing burn-ins at the application frequency. Recommendation: The burn-in task group to discuss and provide guidance. When the SMD says that the part can be used at 200 MHz, then doing burn-in at 6 MHz (cited as burn-in equipment limitation frequency) is not going to be meaningful! d) Two Static Burn-ins Some manufacturers are doing electrical testing between the two static burn-ins, whereas others do electricals after completing both static burn-ins. Recommendation: Provide clarification in MIL-STD-883, Test Method 5004. e) Thermal Imaging For a device with hot spots, the thermal resistance, junction-to-case, would be much higher than the guidelines given in MIL-STD-1835. One of the suppliers used thermal imaging to find hot spots on the die. Recommendation: Assign a task group to evaluate the effectiveness of thermal imaging at the product development stage.

Class Y↗

Complex Parts, Complex Data: Why You Need to Understand What Radiation Single Event Testing Data Does and Doesn't Show and the Implications Thereof

Electronic parts (integrated circuits) have grown in complexity such that determining all failure modes and risks from single particle event testing is impossible. In this presentation, the authors will present why this is so and provide some realism on what this means. Its all about understanding actual risks and not making assumptions.

NASA Electronic Parts and Packaging (NEPP) Program↗