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Reliability through packaging design.

Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles

COOLING SYSTEM

Practical Applications of Cosmic Ray Science: Spacecraft, Aircraft, Ground Based Computation and Control Systems and Human Health and Safety

In this paper we review the discovery of cosmic ray effects on the performance and reliability of microelectronic systems as well as on human health and safety, as well as the development of the engineering and health science tools used to evaluate and mitigate cosmic ray effects in earth surface, atmospheric flight, and space flight environments. Three twentieth century technological developments, 1) high altitude commercial and military aircraft; 2) manned and unmanned spacecraft; and 3) increasingly complex and sensitive solid state micro-electronics systems, have driven an ongoing evolution of basic cosmic ray science into a set of practical engineering tools (e.g. ground based test methods as well as high energy particle transport and reaction codes) needed to design, test, and verify the safety and reliability of modern complex electronic systems as well as effects on human health and safety. The effects of primary cosmic ray particles, and secondary particle showers produced by nuclear reactions with spacecraft materials, can determine the design and verification processes (as well as the total dollar cost) for manned and unmanned spacecraft avionics systems. Similar considerations apply to commercial and military aircraft operating at high latitudes and altitudes near the atmospheric Pfotzer maximum. Even ground based computational and controls systems can be negatively affected by secondary particle showers at the Earth's surface, especially if the net target area of the sensitive electronic system components is large. Accumulation of both primary cosmic ray and secondary cosmic ray induced particle shower radiation dose is an important health and safety consideration for commercial or military air crews operating at high altitude/latitude and is also one of the most important factors presently limiting manned space flight operations beyond low-Earth orbit (LEO).

Atwell, William

Practical Applications of Cosmic Ray Science: Spacecraft, Aircraft, Ground-Based Computation and Control Systems, and Human Health and Safety

Three twentieth century technological developments, 1) high altitude commercial and military aircraft; 2) manned and unmanned spacecraft; and 3) increasingly complex and sensitive solid state micro-electronics systems, have driven an ongoing evolution of basic cosmic ray science into a set of practical engineering tools needed to design, test, and verify the safety and reliability of modern complex technological systems. The effects of primary cosmic ray particles and secondary particle showers produced by nuclear reactions with the atmosphere, can determine the design and verification processes (as well as the total dollar cost) for manned and unmanned spacecraft avionics systems. Similar considerations apply to commercial and military aircraft operating at high latitudes and altitudes near the atmospheric Pfotzer maximum. Even ground based computational and controls systems can be negatively affected by secondary particle showers at the Earth s surface, especially if the net target area of the sensitive electronic system components is large. Finally, accumulation of both primary cosmic ray and secondary cosmic ray induced particle shower radiation dose is an important health and safety consideration for commercial or military air crews operating at high altitude/latitude and is also one of the most important factors presently limiting manned space flight operations beyond low-Earth orbit (LEO). In this paper we review the discovery of cosmic ray effects on the performance and reliability of microelectronic systems as well as human health and the development of the engineering and health science tools used to evaluate and mitigate cosmic ray effects in ground-based atmospheric flight, and space flight environments. Ground test methods applied to microelectronic components and systems are used in combinations with radiation transport and reaction codes to predict the performance of microelectronic systems in their operating environments. Similar radiation transport codes are used to evaluate possible human health effects of cosmic ray exposure, however, the health effects are based on worst-case analysis and extrapolation of a very limited human exposure data base combined with some limited experimental animal data. Finally, the limitations on human space operations beyond low-Earth orbit imposed by long term exposure to galactic cosmic rays are discussed.

Atwell, William

Reliability Considerations for Ultra- Low Power Space Applications

NASA, the aerospace community, and other high reliability (hi-rel) users of advanced microelectronic products face many challenges as technology continues to scale into the deep sub- micron region and ULP devices are sought after. Technology trends, ULP microelectronics, scaling and performance tradeoffs, reliability considerations, and spacecraft environments will be presented from a ULP perspective for space applications.

reliability

Space Radiation Effects and Reliability Consideration for the Proposed Jupiter Europa Orbiter

The proposed Jupiter Europa Orbiter (JEO) mission to explore the Jovian moon Europa poses a number of challenges. The spacecraft must operate for about seven years during the transit time to the vicinity of Jupiter, and then endure unusually high radiation levels during exploration and orbiting phases. The ability to withstand usually high total dose levels is critical for the mission, along with meeting the high reliability standards for flagship NASA missions. Reliability of new microelectronic components must be sufficiently understood to meet overall mission requirements.The proposed Jupiter Europa Orbiter (JEO) mission to explore the Jovian moon Europa poses a number of challenges. The spacecraft must operate for about seven years during the transit time to the vicinity of Jupiter, and then endure unusually high radiation levels during exploration and orbiting phases. The ability to withstand usually high total dose levels is critical for the mission, along with meeting the high reliability standards for flagship NASA missions. Reliability of new microelectronic components must be sufficiently understood to meet overall mission requirements.

semiconductor devices

Impact of Device Scaling on Deep Sub-micron Transistor Reliability: A Study of Reliability Trends using SRAM

As microelectronics are scaled in to the deep sub-micron regime, users of advanced technology CMOS, particularly in high-reliability applications, should reassess how scaling effects impact long-term reliability. An experimental based reliability study of industrial grade SRAMs, consisting of three different technology nodes, is proposed to substantiate current acceleration models for temperature and voltage life-stress relationships. This reliability study utilizes step-stress techniques to evaluate memory technologies (0.25mum, 0.15mum, and 0.13mum) embedded in many of today's high-reliability space/aerospace applications. Two acceleration modeling approaches are presented to relate experimental FIT calculations to Mfr's qualification data.

CMOS integrated circuits

Design Parameters Influencing Reliability of CCGA Assembly: A Sensitivity Analysis

Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50(deg)/75(deg)C, -55(deg)/100(deg)C, and -55(deg)/125(deg)C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature da to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.

reliability

3D X-ray CT for BGA/CGA Workmanship Defect Detection

Commercial-off-the-shelf (COTS) advanced microelectronic technologies in high-reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. One of the key drawbacks of advanced electronic packages with hidden solder joint interconnections, such as the column grid array (CGA), is that inspection can be challenging—whether visually or using X-rays. In general, inspection for solder joint integrity is poor, except for identifying shorts. The new, advanced X-ray systems, especially the 3D computer tomography version, may be able to provide the three-dimensional features that are extremely difficult to resolve under the 2D systems.This report presents both 2D and 3D X-ray images along with their representative optical photomicrographs for a number of advanced electronics package assemblies including 3D stack and CGA assemblies before and after thermal cycling.

Ghaffarian, Reza

Contamination control in hybrid microcircuit modules

The influence of chemical and particulate contamination upon the reliability and service life of hybrid microelectronic systems is documented. Several coating systems used include the parylene and Dow Corning silicone (DC90-711). These passivating coatings have potential for decreasing the degradation caused by particulate contaminants in hybrid systems as well as the possible deleterious effect of trapping chemical contaminants which have long term degrading influences upon the performance of the system. The reliability of a representative hybrid microcircuit is enhanced by the coating process.

Kinser, D. L.

Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

As microelectronics is scaled into the deep sub-micron regime, space and aerospace users of advanced technology CMOS are reassessing how scaling effects impact long-term product reliability. The effects of electromigration (EM), time-dependent-dielectric-breakdown (TDDB) and hot carrier degradation (HCI and NBTI) wearout mechanisms on scaled technologies and product reliability are investigated, accelerated stress testing across several technology nodes is performed, and FA is conducted to confirm the failure mechanism(s).

CMOS integrated circuits