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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2001

Effect of thermal cycling ramp rate on CSP assembly reliability

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

accelerated thermal cycle chip scale package solde↗

DOE OSTI2023

Generalized analytical and numerical modeling of optical second harmonic generation in anisotropic crystals and complex heterostructures using #SHAARP package

Optical second harmonic generation (SHG) is a nonlinear optical effect widely used for nonlinear optical microscopy and laser frequency conversion. The closed-form analytical solution of the nonlinear optical responses is essential for evaluating the optical responses of new materials whose optical properties are unknown a priori. Many approximations have therefore been employed in the existing analytical approaches, such as slowly varying approximation, weak reflection of the nonlinear polarization, transparent medium, high crystallographic symmetry, Kleinman symmetry, easy crystal orientation along a high-symmetry direction, phase matching conditions and negligible interference among nonlinear waves, which may lead to large errors in the reported material properties. To avoid these approximations, here we have developed an open-source package named Second Harmonic Analysis of Anisotropic Rotational Polarimetry (#SHAARP) for single interface (si) and in multilayers (ml) for homogeneous crystals. The reliability and accuracy are established by experimentally benchmarking with both the SHG polarimetry and Maker fringes predicted from the package using standard materials. SHAARP.si and SHAARP.ml are available through GitHub https://github.com/Rui-Zu/SHAARP and https://github.com/bzw133/SHAARP.ml, respectively.

complex systems↗

DOE OSTI2025

Polyhydroxybutyrate laminated trilayer films with enhanced barrier and mechanical properties for active food packaging

Polysaccharides such as starch and chitosan have been explored for sustainable food packaging films. However, their inherent hydrophilicity and brittleness cause poor water vapor barrier performance and limited mechanical properties. To address these issues, starch was first functionalized with acetoacetate groups and subsequently blended with chitosan. Dynamic cross-linking occurred between the acetoacetate groups and the primary amine groups of chitosan, forming vinylogous urethane linkages that reduced the water solubility of the films while preserving high mechanical strength. With 30 wt% of glycerol as a plasticizer, the resulting films showed a tensile strength of up to 24.68 MPa and an elongation at break of up to 83.96%. To improve the barrier properties, poly(3-hydroxybutyrate) (PHB), plasticized with 5-15 wt% epoxidized vegetable oil, was laminated on top of the chitosan/modified starch films, resulting in a significantly reduced water vapor transmission rate (WVTR) of 66%. Additional components, such as food colors like β-carotene were incorporated into this layer to make UV-protective films. A third layer of PHB without active additives was then coated to further reduce WVTR by 99%. Therefore, this multilayer lamination strategy effectively enhanced the barrier and mechanical properties of the polysaccharide-based packaging films.

Active packaging↗

DOE OSTI2026

A framework and tool for designing cost-effective, resilient, and circular net-zero supply chains under uncertainty with an application to multilayer plastic films

While 55% of Fortune 500 companies have committed to achieving net-zero emissions and/or zero-waste operations by 2035, only 2% are currently on track, revealing a critical gap between ambition and action. Designing supply chains that reduce both emissions and waste is a complex non-intuitive, multi-objective challenge, compounded by the high costs of new technologies and the need for resilient, profitable solutions. This paper aims to address this challenge by presenting a generic framework and multi-objective optimization formulation for designing cost-effective, circular, and resilient supply chains under uncertainty, implemented through a user-friendly decision-support tool with intuitive data visualization capabilities, enabling communication of results to both technical and non-technical stakeholders. We demonstrate the application of this framework in the context of multilayer plastic films (barrier films), which are widely used in food packaging and composite materials. The model quantifies trade-offs across three objectives: minimizing global warming potential, maximizing circularity, and minimizing cost. A key contribution of this work is the explicit modeling of technological resilience, the ability of supply chains to maintain function under disruption. In the cost-minimization case, the resilience constraint makes the design approximately three times more expensive in the short-term metric, but shifts the system from relying on a single recovery pathway to a portfolio of four recovery pathways, improving the robustness of the optimization solution under uncertainty. Lastly, we introduce TranZero, a decision-support tool that integrates material flow analysis, hotspot identification, and optimization-based scenario planning to support net-zero and circularity decisions.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗

DOE OSTI2020

Chitin- and cellulose-based sustainable barrier materials: a review

Abstract The accumulation of synthetic plastics used in packaging applications in landfills and the environment is a serious problem. This challenge is driving research efforts to develop biodegradable, compostable, or recyclable barrier materials derived from renewable sources. Cellulose, chitin/chitosan, and their combinations are versatile biobased packaging materials because of their diverse biological properties (biocompatibility, biodegradability, antimicrobial properties, antioxidant activity, non-toxicity, and less immunogenic compared to protein), superior physical properties (high surface area, good barrier properties, and mechanical properties), and they can be assembled into different forms and shapes (powders, fibers, films, beads, sponges, gels, and solutions). They can be either assembled into packaging films or used as fillers to improve the properties of other biobased polymers. Methods such as preparation of composites, multilayer coating, and alignment control are used to further improve their barrier, mechanical properties, and ameliorate their moisture sensitivity. With the growing application of cellulose and chitin-based packaging materials, their biodegradability and recyclability are also discussed in this review paper. The future trends of these biobased materials in packaging applications and the possibility of gradually replacing petroleum-based plastics are analyzed in the “Conclusions” section.

36 MATERIALS SCIENCE↗

NASA NTRS1983

Low-Cost Alternatives in Hybrid Microcircuit Packaging

Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.

Caruso, S. V.↗

NASA NTRS2017

Interconnect and Packaging Technologies for Terahertz Communication Systems

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

Micromachining↗

DOE OSTI2024

Optimal Design of Food Packaging Considering Waste Management Technologies to Achieve Circular Economy

Plastic packaging plays a fundamental role in the food industry, avoiding food waste and facilitating food access. The increasing plastic production and the lack of appropriate plastic waste management technologies represent a threat to the environmental and human welfare. Therefore, there is an urgent need to identify sustainable packaging solutions. Circular economy (CE) promotes reducing waste and increasing recycling practices to achieve sustainability. In this work, we propose a CE framework based on multi-objective optimization, considering both economic and environmental impacts, to identify optimal packaging designs and waste management technologies. Using mixed-integer linear programming (MILP), techno-economic analysis (TEA), and life cycle assessment (LCA), this work aims to build the first steps in packaging design, informing about the best packaging alternatives and the optimal technology or technologies to process packaging waste. For the economic analysis, we consider the minimum increase in price (MIP) when adding recycling to the cost of each packaging solution, while for the environmental analysis, the greenhouse gas emissions impact was considered. A case study on ground coffee packaging is used to illustrate the proposed framework. The results demonstrate that the multilayer bag option is the most convenient when considering both the chosen economic and environmental impacts.

Life Cycle Analysis↗

NASA NTRS1985

Response time for multilayered platinum resistance thermometers

Response time constants for several multilayered temperature transducers were determined numerically by using Martin Marietta's MITAS software package which is available at NASA Langley Research Center. Present results were found in close agreement with the solutions reported in the literature, thus, the capability of MITAS was justified. On the basis of experiences gained, the MITAS is recommended for use in predicting the response time constants of sensors by an in-situ technique.

Pandey, D. K.↗

NASA NTRS2012

Guidelines for Selection, Screening and Qualification of Low-Voltage Commercial Multilayer Ceramic Capacitors for Space Programs

This document has been developed in the course of NASA Electronic Parts and Packaging (NEPP) program and is not an official endorsement of the insertion of commercial capacitors in space programs or an established set of requirements for their testing. The purpose of this document is to suggest possible ways for selection, screening, and qualification of commercial capacitors for NASA projects and open discussions in the parts engineering community related to the use of COTS ceramic capacitors. This guideline is applicable to commercial surface mount chip, simple parallel plate design, multi-layer ceramic capacitors (MLCCs) rated to voltages of 100V and less. Parts with different design, e.g. low inductance ceramic capacitors (LICA), land grid array (LGA) etc., might need additional testing and tailoring of the requirements described in this document. Although the focus of this document is on commercial MLCCs, many procedures discussed below would be beneficial for military-grade capacitors

Teverovsky, Alexander A.↗

NASA NTRS2007

A Hard-X-Ray Telescope Science Enhancement Package for the Constellation-X Mission

We present a science enhancement package (SEP) for NASA's planned Constellation-X mission submitted in response to a call for white papers. The call solicited proposals for either extending the bandwidth of Con-X to higher energies or enhancing the low-energy spectral resolution. The ground rules were that enhancement package should cost no more than $100M and weigh no more than 100 kg. The nickel-replicated-optics team responded with a stand-alone hard-x-ray telescope SEP concept. This consisted of two mirror modules, each with approximately 70 multilayer and iridium-coated shells, and two corresponding cadmium-zinc-telluride-based focal plane detectors. Addition of this package permits measurement of the hard-x-ray continuum up to 30-40 keV, which is essential for a quantitative measurement of the spectrum of gravitationally broadened iron lines that appear in the spectra of many black hole candidates. Full details of the instrument will be presented showing trades in energy bandwidth and effective area together with the full science justification for the enhancement package.

Ramsey, Brian↗

NASA NTRS1977

Reliability evaluation of hermetic dual in-line flat microcircuit packages

The relative strengths and weaknesses of 35 commonly used hermetic flat and dual in-line packages were determined and used to rank each of the packages according to a numerical weighting scheme for package attributes. The list of attributes included desirable features in five major areas: lead and lead seal, body construction, body materials, lid and lid seal, and marking. The metal flat pack and multilayer integral ceramic flat pack and DIP received the highest rankings, and the soft glass Cerdip and Cerpak types received the lowest rankings. Loss of package hermeticity due to lead and lid seal problems was found to be the predominant failure mode from the literature/data search. However, environmental test results showed that lead and lid seal failures due to thermal stressing was only a problem with the hard glass (Ceramic) body DIP utilizing a metal lid and/or bottom. Insufficient failure data were generated for the other package types tested to correlate test results with the package ranking.

Johnson, G. M.↗

DOE OSTI2024

Toward Mass-Production of Transition Metal Dichalcogenide Solar Cells: Scalable Growth of Photovoltaic-Grade Multilayer WSe2 by Tungsten Selenization

Semiconducting transition metal dichalcogenides (TMDs) are promising for high-specific-power photovoltaics due to their desirable band gaps, high absorption coefficients, and ideally dangling-bond-free surfaces. Despite their potential, the majority of TMD solar cells to date are fabricated in a nonscalable fashion, with exfoliated materials, due to the lack of high-quality, large-area, multilayer TMDs. Here, we present the scalable, thickness-tunable synthesis of multilayer WSe2 films by selenizing prepatterned tungsten with either solid-source selenium at 900 degrees C or H2Se precursors at 650 degrees C. Both methods yield photovoltaic-grade, wafer-scale WSe2 films with a layered van der Waals structure and superior characteristics, including charge carrier lifetimes up to 144 ns, over 14x higher than those of any other large-area TMD films previously demonstrated. Simulations show that such carrier lifetimes correspond to ~22% power conversion efficiency and ~64 W g-1 specific power in a packaged solar cell, or ~3 W g-1 in a fully packaged solar module. The results of this study could facilitate the mass production of high-efficiency multilayer WSe2 solar cells at low cost.

carrier lifetime↗

NASA NTRS1989

Design of a Thermal and Micrometeorite Protection System for an Unmanned Lunar Cargo Lander

The first vehicles to land on the lunar surface during the establishment phase of a lunar base will be unmanned lunar cargo landers. These landers will need to be protected against the hostile lunar environment for six to twelve months until the next manned mission arrives. The lunar environment is characterized by large temperature changes and periodic micrometeorite impacts. An automatically deployable and reconfigurable thermal and micrometeorite protection system was designed for an unmanned lunar cargo lander. The protection system is a lightweight multilayered material consisting of alternating layers of thermal and micrometeorite protection material. The protection system is packaged and stored above the lander common module. After landing, the system is deployed to cover the lander using a system of inflatable struts that are inflated using residual fuel (liquid oxygen) from the fuel tanks. Once the lander is unloaded and the protection system is no longer needed, the protection system is reconfigured as a regolith support blanket for the purpose of burying and protecting the common module, or as a lunar surface garage that can be used to sort and store lunar surface vehicles and equipment. A model showing deployment and reconfiguration of the protection system was also constructed.

Hernandez, Carlos A.↗

NASA NTRS1983

A basic design fault in ceramic flat packs

Drotman, B.↗

NASA NTRS1983

A basic design fault in ceramic flat packs

Recent moisture resistance tests of various multilayer top brazed ceramic flat packs and leaded and unleaded chip carriers has revealed a serious design defect. These packages, which utilize a tungsten interconnect system, in the presence of high humidity, suffer a galvanic corrosion which anodically consumes the tungsten. This process can continue until the package suffers an open circuit. The test results indicate that the lead plating system does not adequately seal off the interface area where the tungsten stripe egresses from the inside of the package. Leaded and leadless chip carrier packages were also subjected to the moisture resistance test. The familiar red and green corrosion products were visible after the test was completed. Careful sectioning of the chip carriers has revealed that the tungsten interconnect stripe instead of exiting under the castellations, exits at the top of the castellation and is thus vulnerable to the attack of moisture. These basic design faults severely impact the reliability of these packages.

Drotman, B.↗

NASA NTRS1975

LK39F1 S/N U-1 infrared detector

A multilayered (Hg,Cd)Te detector is described with three infrared bands. Nominal cut-off wavelengths for each band are as follows: (1) Channel 1 - 3 microns, (2) Channel 2 - 6 microns, and (3) Channel 3 - 11 microns. The multilayered detector is mounted in a Honeywell LK39 glass dewar. Accompanying the detector/dewar assembly is a three-channel preamplifier package capable of switching each detector to the single channel input of the HRB Singer Reconfax 4 Mark 4 Infrared Scanner.

Source record↗

DOE OSTI2024

QuTree: A tree tensor network package

Here we present QuTree, a C++ library for tree tensor network approaches. QuTree provides class structures for tensors, tensor trees, and related linear algebra functions that facilitate the fast development of tree tensor network approaches such as the multilayer multiconfigurational time-dependent Hartree approach or the density matrix renormalization group approach and its various extensions. We investigate the efficiency of relevant tensor and tensor network operations and show that the overhead for managing the network structure is negligible, even in cases with a million leaves and small tensors. QuTree focuses on providing simple, high-level routines while retaining easy access to the backend to facilitate novel developments. We demonstrate the capabilities of the package by computing the eigenstates of coupled harmonic oscillator Hamiltonians and performing random circuit simulations on a virtual quantum computer.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗