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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

We report progress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field where semiconductor physics and electrical, thermal, and mechanical design knowledge converge to achieve a practical realization of desired targets in the form of conversion efficiency, power density, and reliability. Due to the promising nature of artificial intelligence in delivering rapid results, engineers are starting to explore the ways in which it can contribute to making power electronics more compact and reliable. Here, we conduct a brief review of the foray of artificial intelligence in three distinct subtechnologies within a power electronics system in the context of electric vehicles: semiconductor devices, power electronics module design and prognostics, and thermal management design. The intent is not to report an exhaustive literature review, but to identify the state of the art and opportunities for artificial intelligence to play a meaningful role in power electronics design from a mechanical and thermal standpoint, as well as to discuss a few promising future research directions.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2024

Power Electronics as an Enabler of the Current and Future Grid: Control Instead of Copper

Power electronics are becoming more pervasive in the power system. Solar, wind and battery energy storage systems regularly connect to the grid using power electronic interfaces. Loads are also increasingly power electronic-based. These changes, coupled with the change in the power system's operating characteristics as more and more renewable energy is integrated into the power system, offer a challenge to power electronic and power system engineers alike - how do we design and operate the power system moving forward?

direct connect↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗
DOE OSTI2021

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

In a power module the parasitic inductance limits the dynamic high-frequency performance, and the area of the cooling surfaces limits the power capability. This paper presents a new 3D power electronic design methodology based on the concept of mutual inductance cancellation and multi-sided heat transfer. New 3D prismatic packaging concepts are proposed for Wide Band Gap (WBG) power devices, where the devices can be mounted at acute angles to adjacent interconnects or other devices. Discussion is given on electrical and thermal path optimization in a 3D space. To validate the 3D prismatic packaging methodology, a 1200V/50A SiC half-bridge power module is fabricated and tested for electrical and thermal performance and results are compared with simulations. The power density calculated for the module is 12 kW/in3 (including heatsink) and shows a 31.3% inductance reduction compared to a 2D planar module. Finally, design guidance suggested for utilizing prismatic structures is provided, together with suggested future work in the area. This paper presents the first reported true 3D power module.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2025

Impact assessment of geomagnetic induced current neutral blocking devices with power electronics sources on distance relay for 230 kV transmission lines

Electrical grids increased the integration of power electronics sources onto transmission lines. In addition, recent reports show a significant rise in geomagnetic storms occurring in 2024. These geomagnetic storms can affect transmission lines by inducing electrical currents within them, potentially causing power outages due to overloaded power transformers. Geomagnetic induced current neutral blocking devices (GIC-NBDs) are capacitors on the ground of wye power transformers, to avoid damage caused by geomagnetic storms. The integration of distance relays and transmission lines with power electronics sources and GIC-NBDs needs to be studied to observe if GIC-NBDs and power electronics sources could adversely affect operation of the electrical grid. In this analysis, the effect of 2 MW power electronics sources and GIC-NBDs on distance relays is assessed for different 230 kV transmission line lengths in radial and nonradial power systems. The simulations measured the apparent impedances, with different electrical faults. Results for a typical 2,650 μF GIC-NBD application were presented on impedance plots, and the distance relay model operations were assessed. In conclusion, the tests for radial and nonradial power systems showed the behavior of the distance elements and source impedance ratios, assessing the effect of power electronics sources and GIC-NBDs on 230 kV transmission lines.

Distance relays↗
DOE OSTI2022

Interdiffusion and Formation of Intermetallic Compounds in High-Temperature Power Electronics Substrate Joints Fabricated by Transient Liquid Phase Bonding

Power electronics packages typically comprise a dielectric substrate bonded to a metal layer and attached to heat sinks using a low-thermal-conductivity solder. These multiple layers increase the effective thermal resistance of the package and are responsible for package failures under cyclic thermal loads. Bonding the aluminum nitride dielectric layer (AlN) directly to a low coefficient of thermal expansion (CTE) aluminum silicon carbide (AlSiC) cold plate using copper-aluminum (Cu-Al) transient liquid phase (TLP) bonding has been shown to improve the mechanical reliability of the power electronic packages while making the package more compact by bringing the cooling solutions closer to the devices. This study aims to characterize the Cu-Al bonds formed during the TLP bonding of AlSiC with three different power electronics substrates: pure aluminum nitride (AlN), aluminum (DBA), and copper (DBC). The material compositions and microstructures of the bonds were analyzed using scanning electron microscopy (SEM), x-ray spectroscopy (EDS), confocal scanning acoustic microscopy (C-SAM), and x-ray diffraction (XRD). ..alpha..-Al solid compound was identified as the dominant phase in AlN-AlSiC and Al-AlSiC, with a notable presence of SiC particles. In contrast, three intermetallic phases - ..theta..-CuAl2, ..eta..-CuAl, and ..gamma..'- Cu9Al4 - were observed in the Cu-AlSiC bond. A computational solid-state diffusion model was developed to predict the intermetallic compounds (IMCs) formed during Cu-Al TLP bonding in each system, which supported the observation that an initial Cu volume fraction of 20 % in the material layers produced a final bond composition of >95 % Al with minimal IMC growth. However, increased Cu concentrations produced higher concentration gradients, leading to increased growth of IMCs, Kirkendall voids, and interstitial cracks.

DIRECT ENERGY CONVERSION↗
DOE OSTI2025

Power Electronics and Electric Machines for Advanced Aircraft

Power electronics and electric machines are critical components of efficient, high-performance aircraft - from fixed-wing turbine to electric vertical takeoff and landing aircraft and beyond. Improvements to these components create enormous energy efficiencies, enable cost savings, and ensure fail-safe operations. National Renewable Energy Laboratory researchers are developing innovative power electronics, electric motors, integrated electric traction drives, and thermal management systems to build highly efficient, lightweight, ultrareliable powertrains for aircraft.

42 ENGINEERING↗
DOE OSTI2026

NREL Overview of Grid-Tied Power Electronics

This presentation focuses on the power electronics related research efforts carried out by researchers at the Power Systems Engineering Center at NREL.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2023

Power Electronics Cooling Technology Research at NREL

This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.

DIRECT ENERGY CONVERSION↗
DOE OSTI2020

Automotive Power Electronics and Electric Machine Thermal Management

The transition to modular and scalable electrified vehicle transportation requires technologies to improve power density within cost and reliability constraints to maximize vehicle platform flexibility. Key research challenges arise due to the limited packaging space, coolant distribution, electrical connections, and ambient temperatures. Challenges include thermal management for compact power-dense electric machines and the associated power electronics for power management within the vehicle. High-temperature silicon and wide-bandgap (WBG) based power electronics systems are of interest to enable compact and efficient electric drive systems. The higher temperatures present packaging challenges for thermal management and reliability. In this work, we provide an overview of research for thermal characteristics of materials, packages and thermal management approaches for enabling compact power dense automotive electric drive systems.

DIRECT ENERGY CONVERSION↗
DOE OSTI2022

Automotive Power Electronics Cooling Technology Research at NREL

This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Start-up Optimization Considering Integrated Power Electronic Systems

The startup of systems composed of power electronic systems is becoming more complex. As the systems grow, standard pre-configuration sequencing methods will struggle. This work proposes a linear programming optimization method to couple power electronic systems in a series of startup commands. This formulation is demonstrated in a real-time implementation on hardware.

Starke, Michael↗
DOE OSTI2023

Automated Design-for-Reliability of a Power Electronics Module

The design of a power electronics module is a multiphysics problem and involves electrical, thermal, and reliability targets and constraints. Although the electrical and thermal design consider multiple aspects such as materials, geometry, and energy losses, reliability design is often limited to the selection of the attachment materials and electrical interconnect types. In this paper, we incorporate reliability metrics in the design phase by investigating the impact of package geometry on the thermomechanical behavior of the die-attachment material. To this end, we conducted thermal and power cycling simulations of a commercial six-pack power module with silicon carbide devices to compute junction temperature and strain energy density per cycle, respectively. We performed multiple simulations with different geometric dimensions and established a correlation between input features and output variables using subspace-based dimension reduction. The machine learning-based dimension reduction method serves as a surrogate model, which can be employed to identify the optimal module design from a thermal and reliability standpoint.

design-for-reliability↗
DOE OSTI2022

A 1kV, 480V Power Electronics Hub for DER Integration in Commercial Buildings

Power electronic (PE) systems are increasingly being integrated into distribution and sub-distribution networks in support of distributed energy resource integration (DERs), electric vehicle (EV) charging (particularly in the case of fast charging infrastructure), and improvement in power quality for high performance computing and/or servers farms. This provides an opportunity to research and develop integrated PE systems that can function as single systems thereby bringing additional functionality and benefits to the overall system. The goal of this paper is to demonstrate foundational technologies and capabilities for a multiport power electronics energy hub that can intelligently coordinate and control integrated sources and loads. The focus for this digest is on a commercial building use case which is demonstrated in hardware.

Starke, Michael↗
DOE OSTI2024

A graphical user interface platform to support power electronic converters and integrated systems

Power Electronic Systems have grown in size and complexity over the past years. Therefore, users require interfaces to properly configure, develop, and deploy these systems. This work presents a Graphical User Interface that dynamically adapts to the system and allows the user to control and monitor its operation. This GUI uses networked communication and open-source Python libraries to allow the user to interact with the system at its different hierarchical layers, as well as visualize the interconnection of the full system. This is demonstrated by showing the user interface applied to a megawatt class charging station that consists of various energy resources.

Dean, Ben↗
DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗