A simple method for preparing ''sodium-free'' thermally grown silicon dioxide on silicon.
Sodium free thermally grown silicon dioxide on silicon for MOS process, noting surface charge density characteristics
Cocca, F.↗
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Results for “preparation methods”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Develop methods for preparation of pure copper /2/ fluoride and develop analytical techniques for determination of impurities Final report
Ultrapure copper fluoride synthesis, analytical techniques, and production of one kilogram for cathode material
Lundquist, J. R.↗
Lightweight refractory insulation and method of preparing the same Patent
Preparation and characteristics of lightweight refractory insulation
Mountvala, A. J.↗
Ceramic insulation for radiant heating environments and method of preparing the same Patent
Unfired ceramic insulation for protection from radiant heating environments
Allen, R. W.↗
Novel polymers and method of preparing same
Polymers are prepared with terminal functional groups by reacting a compound selected from the group consisting of lithium p-lithiophenoxide and tetrabutylammonium p-lithiophenoxide as an initiator with material such as butadiene. The resulting functionally terminated new polymers are then capable of reacting with coupling agents to form star polymers.
Hirshfield, S. M.↗
Integrated circuit package with lead structure and method of preparing the same
A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip, and an encapsulating molded plastic is described. The lead frame array is prepared by photographically printing a lead pattern on a base metal sheet, selectively etching to remove metal between leads, and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating goldplated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.
Kennedy, B. W.↗
Reinforced polyquinoxaline gasket and method of preparing the same
A gasket or seal resistant to ionizing radiation and liquid hydrogen temperatures is made up of a laminated polyquinoxaline resin-fiberglass cloth body portion and a molded polyquinoxaline encapsulating film. The laminated body is prepared by stacking thin sheets of the resin alternately with fiberglass cloth and heating the assembly under pressure with the temperature, pressure and resin film thickness being controlled so that only partial impregnation of the fiberglass cloth is produced. The encapsulating resin film is preheated at about 300 f and applied to the laminate body by molding at a temperature of about 625 F. The molded gasket is then deflashed and post-cured by heating at 675 to 700 F.
Vanauken, R.↗
Method of preparing water purification membranes
Allyl amine and chemically related compounds are polymerized as thin films in the presence of a plasma discharge. The monomer compound can be polymerized by itself or in the presence of an additive gas to promote polymerization and act as a carrier. The polymerized films thus produced show outstanding advantages when used as reverse osmosis membranes.
Hollahan, J. R.↗
Advanced methods for preparation and characterization of infrared detector materials
Crystal growth of Hg sub 1-x Cd sub x Te and density measurements of ingot slices are discussed. Radial compositional variations are evaluated from the results of infrared transmission edge mapping. The pseudo-binary HgTe-CdTe phase diagram is examined with reference to differential thermal analysis measurements. The phase equilibria calculations, based on the 'regular association solution' theory (R.A.S.) are explained and, using the obtained R.A.S. parameters, the activities of Hg, Cd, and Te vapors and their partial pressures over the pseudo-binary melt are calculated.
Lehoczy, S. L.↗
Method for preparing addition type polyimide prepregs
A novel addition polyimide based on the use of liquid monomers wherein the essentially solventless prepreg produced therefrom retains good drape, tack and other mechanical properties.
St.clair, T. L.↗
Advanced methods for preparation and characterization of infrared detector materials
Differential thermal analysis data were obtained on mercury cadmium telluride alloys in order to establish the liquidus temperatures for the various alloy compositions. Preliminary theoretical analyses was performed to establish the ternary phase equilibrium parameters for the metal rich region of the phase diagram. Liquid-solid equilibrium parameters were determined for the pseudobinary alloy system. Phase equilibrium was calculated and Hg(l-x) Cd(x) Te alloys were directionally solidified from pseudobinary melts. Electrical resistivity and Hall coefficient measurements were obtained.
Lehoczky, S. L.↗
Glass heating panels and method for preparing the same from architectural reflective glass
Electrodes are positioned in intimate contact with an outer surface of a thin electrically insulating protecting layer of architectural reflective glass. Application of a voltage of sufficient magnitude substantially destroys the insulating layer located beneath the electrodes. A subsequent application of voltage results in a passage of current through the underlying thin, light reflective metal or metal oxide layer and in concomitant output of heat.
Shlichta, P. J.↗
Method of preparing fiber reinforced ceramic material
Alternate layers of mats of specially coated SiC fibers and silicon monotapes are hot pressed in two stages to form a fiber reinforced ceramic material. In the first stage a die is heated to about 600 C in a vacuum furnace and maintained at this temperature for about one-half hour to remove fugitive binder. In the second stage the die temperature is raised to about 1000 C and the layers are pressed at between 35 and 138 MPa. The resulting preform is placed in a reactor tube where a nitriding gas is flowed past the preform at 1100 to 1400 C to nitride the same.
Bhatt, Ramakrishna T.↗
An Innovative Method for Preparing Semiconductor Change Used in Crystal Growth and Shear Cell Diffusion Experiments
An innovative technique for machining semiconductors has been developed. This technique was used to prepare semiconductor charges for crystal growth and shear cell diffusion experiments. The technique allows brittle semiconductor materials to be quickly and accurately machined. Lightly doping the semiconductor material increases the conductivity enough to allow the material to be shaped by an electrical discharge machine (EDM).
Anrold, William A.↗
Method to Prepare Processable Polymides with Reactive Endgroups using 1,3-Bis (3-Aminophenoxy) Benzene
Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA ), 3-aminophenoxy- 4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbomene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared. The copolymers that result from using APB to enhance processability have a unique combination of properties that include low pressure processing (200 psi and below), long term melt stability (several hours at 300 C. for the phenylethynyl terminated polymers), high toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties. These copolyimides are eminently suitable as adhesives, composite matrices, moldings, films and coatings.
Jensen, Brian J.↗
Method of Preparing Polymers with Low Melt Viscosity
This invention is an improvement in standard polymerizations procedures, i.e., addition-type and step-growth type polymerizations, wherein monomers are reacted to form a growing polymer chain. The improvement includes employing an effective amount of a trifunctional monomer (such as a trifunctional amine anhydride, or phenol) in the polymerization procedure to form a mixture of polymeric materials consisting of branced polymers, star-shaped polymers, and linear polymers. This mixture of polymeric materials has a lower melt temperature and a lower melt viscosity than corresponding linear polymeric materials of equivalent molecular weight.
Jensen, Brian J.↗
Method to Prepare Processable Polyimides with Non-Reactive Endgroups Using 1,3-bis(3-Aminophenoxy) Benzene
Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of a non-reactive endcapper, such as phthalic anhydride. Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. Polyimides that are more rigid in nature require more APB to impart processability than polyimides that are less rigid in nature. The copolymers that result from using APB to enhance processability have a unique combination of properties including excellent thin film properties, low pressure processing (200 psi and below), improved toughness, improved solvent resistance, improved adhesive properties, improved composite mechanical properties, long term melt stability (several hours at 390 C), and lower melt viscosities.
Jensen, Brian J.↗
Method To Prepare Processable Polyimides With Reactive Endogroups Using 1,3-bis(3-aminophenoxy)benzene
Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbomene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared. The copolymers that result from using APB to enhance processability have a unique combination of properties that include low pressure processing (200 psi and below), long term melt stability (several hours at 300° C. for the phenylethynyl terminated polymers), high toughness, improved solvent resistance, improved adhesive properties, and improved composite mechanical properties. These copolyimides are eminently suitable as adhesives, composite matrices, moldings, films and coatings.
Brian J Jensen↗