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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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NASA NTRS2009

Replacement for a Flex Hose Coating at the Space Shuttle Launch Pad

Aerocoat AR-7 is a coating that has been used to protect stainless steel flex hoses at NASA's Kennedy Space Center launch complex and hydraulic lines of the mobile launch platform (MLP). This coating has great corrosion control performance and low temperature application. AR-7 was developed by NASA and produced exclusively for NASA but its production has been discontinued due to its high content of volatile organic compounds (VOC) and significant environmental impact. The purpose of this project was to select and evaluate candidate coatings to find a replacement coating that is more environmentally friendly, with similar properties to AR-7. No coatings were identified that perform the same as AR-7 in all areas. Candidate coatings failed in comparison to AR-7 in salt fog, beachside atmospheric exposure, pencil hardness, Mandrel bend, chemical compatibility, adhesion, and ease of application tests. However, two coatings were selected for further evaluation.

Whitten, Mary↗

NASA NTRS2015

Performance Evaluation of an Automotive-Grade, High Speed Gate Driver for SiC FETs, Type UCC27531, Over a Wide Temperature Range

Silicon carbide (SiC) devices are becoming widely used in electronic power circuits as replacement for conventional silicon parts due to their attractive properties that include low on-state resistance, high temperature tolerance, and high frequency operation. These attributes have a significant impact by reducing system weight, saving board space, and conserving power. In this work, the performance of an automotive-grade high speed gate driver with potential use in controlling SiC FETs (field-Effect Transistors) in converters or motor control applications was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Transistor Gate Drive↗

NASA NTRS2008

Development of a Temperature Sensor for Jet Engine and Space Mission Applications

Electronics for Distributed Turbine Engine Control and Space Exploration Missions are expected to encounter extreme temperatures and wide thermal swings. In particular, circuits deployed in a jet engine compartment are likely to be exposed to temperatures well exceeding 150 C. To meet this requirement, efforts exist at the NASA Glenn Research Center (GRC), in support of the Fundamental Aeronautics Program/Subsonic Fixed Wing Project, to develop temperature sensors geared for use in high temperature environments. The sensor and associated circuitry need to be located in the engine compartment under distributed control architecture to simplify system design, improve reliability, and ease signal multiplexing. Several circuits were designed using commercial-off-the-shelf as well as newly-developed components to perform temperature sensing at high temperatures. The temperature-sensing circuits will be described along with the results pertaining to their performance under extreme temperature.

Patterson, Richard L.↗

NASA NTRS1991

Silicon carbide, an emerging high temperature semiconductor

In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

Matus, Lawrence G.↗

NASA NTRS1971

Low temperature fluid blender

Blender supplies hydrogen at temperatures from 289 deg K to 367 deg K. Hydrogen temperature is controlled by using blender to combine flow from liquid hydrogen tank /276 deg K/ and gaseous hydrogen cylinder /550 deg K/. Blenders are applicable where flow of controlled low-temperature fluid is desired.

Repas, G. A.↗

NASA NTRS1992

Review of the physical and mechanical properties and potential applications of the B2 compound NiAl: Unabridged version of a paper published in International materials review

Considerable work has been performed on NiAl over the last three decades, with an extremely rapid growth in research on this intermetallic occurring in the last few years due to recent interest in this material for electronic and high temperature structural applications. However, many physical properties and the controlling fracture and deformation mechanisms over certain temperature regimes are still in question. Part of this problem lies in the incomplete characterization of many of the alloys previously investigated. Fragmentary data on processing conditions, chemistry, microstructure and the apparent difficulty in accurately measuring composition has made direct comparison between individual studies sometimes tenuous. Therefore, the purpose of this review is to summarize all available mechanical and pertinent physical properties on NiAl, stressing the most recent investigations, in an attempt to understand the behavior of NiAl and its alloys over a broad temperature range.

Noebe, Ronald D.↗

NASA NTRS1993

Physical and mechanical properties of the B2 compound NiAl

Noebe, R. D.↗

NASA NTRS2003

Microelectromechanical System (MEMS) Device Being Developed for Active Cooling and Temperature Control

High-capacity cooling options remain limited for many small-scale applications such as microelectronic components, miniature sensors, and microsystems. A microelectromechanical system (MEMS) using a Stirling thermodynamic cycle to provide cooling or heating directly to a thermally loaded surface is being developed at the NASA Glenn Research Center to meet this need. The device can be used strictly in the cooling mode or can be switched between cooling and heating modes in milliseconds for precise temperature control. Fabrication and assembly employ techniques routinely used in the semiconductor processing industry. Benefits of the MEMS cooler include scalability to fractions of a millimeter, modularity for increased capacity and staging to low temperatures, simple interfaces, limited failure modes, and minimal induced vibration. The MEMS cooler has potential applications across a broad range of industries such as the biomedical, computer, automotive, and aerospace industries. The basic capabilities it provides can be categorized into four key areas: 1) Extended environmental temperature range in harsh environments; 2) Lower operating temperatures for electronics and other components; 3) Precision spatial and temporal thermal control for temperature-sensitive devices; and 4) The enabling of microsystem devices that require active cooling and/or temperature control. The rapidly expanding capabilities of semiconductor processing in general, and microsystems packaging in particular, present a new opportunity to extend Stirling-cycle cooling to the MEMS domain. The comparatively high capacity and efficiency possible with a MEMS Stirling cooler provides a level of active cooling that is impossible at the microscale with current state-of-the-art techniques. The MEMS cooler technology builds on decades of research at Glenn on Stirling-cycle machines, and capitalizes on Glenn s emerging microsystems capabilities.

Beach, Duane E.↗

NASA NTRS1998

Testing of the Geoscience Laser Altimeter System (GLAS) Prototype Loop Heat Pipe

This paper describes the testing of the prototype loop heat pipe (LHP) for the Geoscience Laser Altimeter System (GLAS). The primary objective of the test program was to verify the loop's heat transport and temperature control capabilities under conditions pertinent to GLAS applications. Specifically, the LHP had to demonstrate a heat transport capability of 100 W, with the operating temperature maintained within +/-2K while the condenser sink was subjected to a temperature change between 273K and 283K. Test results showed that this loop heat pipe was more than capable of transporting the required heat load and that the operating temperature could be maintained within +/-2K. However, this particular integrated evaporator-compensation chamber design resulted in an exchange of energy between the two that affected the overall operation of the system. One effect was the high temperature the LHP was required to reach before nucleation would begin due to inability to control liquid distribution during ground testing. Another effect was that the loop had a low power start-up limitation of approximately 25 W. These Issues may be a concern for other applications, although it is not expected that they will cause problems for GLAS under micro-gravity conditions.

Douglas, Donya↗

NASA NTRS1967

Fixture tests bellows reliability through repetitive pressure/temperature cycling

Fixture explores the reliability of bellows used in precision in inertial systems. The fixture establishes the ability of the bellows to withstand repetitive over-stress pressure cycling at elevated temperatures. It is applicable in quality control and reliability programs.

Levinson, C.↗

NASA NTRS1975

Transverse header heat pipe

A novel variable-conductance heat-pipe approach has been developed that delivers high-capacity loads, while eliminating the problem of artery gas blockage present in conventional designs. The unit, known as a transverse header, uses ammonia as the working fluid and nitrogen as the control gas. Its overall cylindrical shape is 5.1 cm in diameter by 0.61 m long. Under test with a fluid heat source, the maximum load achieved as a VCHP was 3,600W. As with conventional gas-loaded pipes, good temperature control was also obtained. An application of this device as a VCHP header for a heat-pipe radiator is described.-

Edelstein, F.↗

NASA NTRS1986

Solid-State Detector for Trace Materials

Detector for trace chemicals senses as few as 10 to the 12th power molecules of given material on surface. Contains no moving parts, amenable to large-scale integration, and operates at room temperature. Potential applications in industrial process control and in environmental analysis. Characteristic signals indicate presence of certain chemicals.

Lambe, J. J.↗

NASA NTRS1994

Small UHV compatible hyperthermal oxygen atom generator

A high purity, hyperthermal, continuous beam atomic oxygen source capable of retrofitting to existing UHV systems has been developed. The instrument complements a general system capability, while its small size and simplicity of design permits tailoring the instrument for most experimental geometries. The flux level presently available is near 1 x 10 (exp 14) cm(exp -2)s(exp -1)(3P) but may be extended toward the theoretical limit of 3x10(exp 15 cm(exp -2)s(exp -1). The energy distribution of the emitted neutrals shows that the mean kinetic energy is about the same as observed for the ions or about 4 eV. The energy of the oxygen atoms may be substantially reduced for other applications by collision with a temperature controlled, non-reactive surface (with a concomitant spread in the energy distribution).

Outlaw, Ronald A.↗

NASA NTRS2001

Making the EZ Choice

Analytical Mechanics Associates, Inc. (AMA), of Hampton, Virginia, created the EZopt software application through Small Business Innovation Research (SBIR) funding from NASA's Langley Research Center. The new software is a user-friendly tool kit that provides quick and logical solutions to complex optimal control problems. In its most basic form, EZopt converts process data into math equations and then proceeds to utilize those equations to solve problems within control systems. EZopt successfully proved its advantage when applied to short-term mission planning and onboard flight computer implementation. The technology has also solved multiple real-life engineering problems faced in numerous commercial operations. For instance, mechanical engineers use EZopt to solve control problems with robots, while chemical plants implement the application to overcome situations with batch reactors and temperature control. In the emerging field of commercial aerospace, EZopt is able to optimize trajectories for launch vehicles and perform potential space station- keeping tasks. Furthermore, the software also helps control electromagnetic devices in the automotive industry.

Source record↗

NASA NTRS1979

LDEF transverse flat plate heat pipe experiment /S1005/

The paper describes the Transverse Flat Plate Heat Pipe Experiment. A transverse flat plate heat pipe is a thermal control device that serves the dual function of temperature control and mounting base for electronic equipment. In its ultimate application, the pipe would be a lightweight structure member that could be configured in a platform or enclosure and provide temperature control for large space structures, flight experiments, equipment, etc. The objective of the LDEF flight experiment is to evaluate the zero-g performance of a number of transverse flat plate heat pipe modules. Performance will include: (1) the pipes transport capability, (2) temperature drop, and (3) ability to maintain temperature over varying duty cycles and environments. Performance degradation, if any, will be monitored over the length of the LDEF mission. This information is necessary if heat pipes are to be considered for system designs where they offer benefits not available with other thermal control techniques, such as minimum weight penalty, long-life heat pipe/structural members.

Robinson, G. A., Jr.↗

NASA NTRS1992

Transverse flat plate heat pipe experiment

The Transverse Flat Plate Heat Pipe is a thermal control device that serves the dual function of temperature control and mounting base for electronic equipment. In its ultimate application, the heat pipe would be a lightweight structural member that could be configured in a platform or enclosure, and provide temperature control for large space structures, flight experiments, and equipment. The purpose of this experiment is to evaluate the zero g performance of several heat pipe modules. Performance assessment will include: (1) the systems heat transport capability; (2) temperature drop between evaporator and condensor; and (3) the ability to maintain temperature over varying duty cycles and environments. Also, performance degradation, if any, will be monitored over the length of the LDEF mission. The objective of this experiment is to demonstrate that a self-regulated heat pipe thermal control system can maintain hardware temperatures within tolerances of + or - 9 F or less with varying heat inputs, independent of vehicle payload orientation.

Shular, David↗

NASA NTRS1984

Zero-g experiments with a He II active phase separator for space application

An active phase separator (APS) for temperature control of He II space cooling systems was tested in a zero-g environment during a series of parabolic flights on a NASA KC 135 aircraft. The APS provides for liquid-gas separation and features an annular gap, a downstream heat exchanger and an upstream ball closure. The apparatus was operated during acceleration and floating and in two different heat load situations. The tests confirmed that adequate mass flow rates could be maintained using a vacuum pump to simulate space vacuum and that residual liquid could be evaporated from the heat exchanger after closing a ball valve to seal off flows.

Denner, H. D.↗

NASA NTRS1995

Minimum fan turbine inlet temperature mode evaluation

Measured reductions in turbine temperature which resulted from the application of the F-15 performance seeking control (PSC) minimum fan turbine inlet temperature (FTIT) mode during the dual-engine test phase is presented as a function of net propulsive force and flight condition. Data were collected at altitudes of 30,000 and 45,000 feet at military and partial afterburning power settings. The FTIT reductions for the supersonic tests are less than at subsonic Mach numbers because of the increased modeling and control complexity. In addition, the propulsion system was designed to be optimized at the mid supersonic Mach number range. Subsonically at military power, FTIT reductions were above 70 R for either the left or right engines, and repeatable for the right engine. At partial afterburner and supersonic conditions, the level of FTIT reductions were at least 25 R and as much as 55 R. Considering that the turbine operates at or very near its temperature limit at these high power settings, these seemingly small temperature reductions may significantly lengthen the life of the turbine. In general, the minimum FTIT mode has performed well, demonstrating significant temperature reductions at military and partial afterburner power. Decreases of over 100 R at cruise flight conditions were identified. Temperature reductions of this magnitude could significantly extend turbine life and reduce replacement costs.

Orme, John S.↗