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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 577 records · Page 32

High Density Chip Interconnect Technology Using High Density Glass Interposers

Demands for high density and high speed interconnect solutions are not satisfied by current technology offerings. Platforms such as printed circuit boards (PCBs), ceramic substrates and silicon interposers don’t provide the small form factor nor the I/O density to support 5G or 1Tbps gigabit ethernet solutions. Current solutions also don’t support die to die assembly with integrated tiled solutions for wide area and fanout solutions for lager data and signal processing. A solution with through vias provides an order of magnitude or smaller density supporting much higher density attach and assembly By fabricating a very fine pitch metal filled through glass via solution it’s possible to deliver the necessary improvements in performance, reliability, even higher data speed rates with smaller area and much denser geometries. There are a number of opportunities across a wide variety of industries for through glass interposers as they become the replacement for printed circuit boards (PCBs) and ceramic substrates. The broad array of opportunities include renewable energy, medical electronics (ME), defense electronics (DE)/space and consumer electronics (CE), but likely will impact every industry and market segment. Compared to PCBs, through glass via (TGV) solutions provide the next generation platform for semiconductor assembly improvements. The ability to generate lines, spaces, trenches and vias similar to wafer level geometries delivers wired solutions one to two orders of magnitude smaller than traditional organic PCB and ceramic substrate offerings. Higher density connections also include the thru vias that connect multiple metal layers, fanout. It’s possible to deliver filled metal vias that are 20um diameter with much tighter pitch than can be offered with PCB. Our goal is to provide 20um diameter and smaller via, 50um and smaller pitch, and aspect ratios at 25:1 and greater with hermetically metal filled vias. The goal of CVI is to replace or eliminate PCBs, ceramic substrate and through silicon vias (TSV) providing a glass interposer with metal filled, fiber plugged and/or optional wireless interconnectivity. The end plan is to deliver a glass substrate platform that provides improved electrical performance, versatility, inertness, and much improved cost and cycle time (development, drawing, and delivery) to performance in the form of small millimeter sized substrates or full 8” wafer substrates. Glass delivers an improvement over silicon thru vias (TSV) in the number of processing steps, cost, reliability and cycle time. In addition to metal plugged vias, our glass interposers are capable of fiber and antennae solutions providing two additional very high density and ultra-high speed data transfer capabilities.

36 MATERIALS SCIENCE↗

Monolithic short wave infrared (SWIR) detector array

A monolithic self-scanned linear detector array was developed for remote sensing in the 1.1- 2.4-micron spectral region. A high-density IRCCD test chip was fabricated to verify new design approaches required for the detector array. The driving factors in the Schottky barrier IRCCD (Pdsub2Si) process development are the attainment of detector yield, uniformity, adequate quantum efficiency, and lowest possible dark current consistent with radiometric accuracy. A dual-band module was designed that consists of two linear detector arrays. The sensor architecture places the floating diffusion output structure in the middle of the chip, away from the butt edges. A focal plane package was conceptualized and includes a polycrystalline silicon substrate carrying a two-layer, thick-film interconnecting conductor pattern and five epoxy-mounted modules. A polycrystalline silicon cover encloses the modules and bond wires, and serves as a radiation and EMI shield, thermal conductor, and contamination seal.

Source record↗

Nanotunneling Junction-based Hyperspectal Polarimetric Photodetector and Detection Method

A photodetector, detector array, and method of operation thereof in which nanojunctions are formed by crossing layers of nanowires. The crossing nanowires are separated by a few nm thick electrical barrier layer which allows tunneling. Each nanojunction is coupled to a slot antenna for efficient and frequency-selective coupling to photo signals. The nanojunctions formed at the intersection of the crossing wires defines a vertical tunneling diode that rectifies the AC signal from a coupled antenna and generates a DC signal suitable for reforming a video image. The nanojunction sensor allows multi/hyper spectral imaging of radiation within a spectral band ranging from terahertz to visible light, and including infrared (IR) radiation. This new detection approach also offers unprecedented speed, sensitivity and fidelity at room temperature.

Son, Kyung-ah↗

Magnetic shielding of large high-power-satellite solar arrays using internal currents

Present concepts for solar power satellites involve dimensions up to tens of kilometers and operating internal currents up to hundreds of kiloamperes. A question addressed is whether the local magnetic fields generated by these strong currents during normal operation can shield the array against impacts by plasma ions and electrons (and from thruster plasmas) which can cause possible losses such as power leakage and surface erosion. One of several prototype concepts was modeled by a long narrow rectangular panel 2 km wide and 20 km long. The currents flow in a parallel across the narrow dimension (sheet current) and along the edge (wire currents). The wire currents accumulate from zero to 100 kiloamp and are the dominant sources. The magnetic field is approximated analytically. The equations of motion for charged particles in this magnetic field are analyzed. The ion and electron fluxes at points on the surface are represented analytically for monoenergetic distributions and are evaluated.

Parker, L. W.↗

MEMS Applications in Aerodynamic Measurement Technology

Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.

Reshotko, E.↗

The Photicon

The Photicon is a novel imaging optical detector utilizing a conventional semitransparent photocathode, imaging electrostatic optics, microchannel plates, and a crossed-wire-grid position-sensitive charge detector. Its sensitivity to single optical photons over a two-dimensional area, high-resolution imaging, and timing capability render it useful for recording scintillations from X-ray image converters in X-ray astronomy. A digital word indicating the position of a single photon event is produced; the image can be stored in an array or serially. Spatial resolution to 20 microns in a 25 mm diam active area detector is reported, and modifications to achieve a spectral range of 120-730 nm are mentioned.

Kellogg, E.↗

Power Without Wires (POWOW)

Electric propulsion has emerged as a cost-effective solution to a wide range of satellite applications. Deep Space 1 successfully demonstrated electric propulsion as the primary propulsion source for a satellite. The POWOW concept is a solar-electric propelled spacecraft capable of significant cargo and short trip times for traveling to Mars. There it would enter areosynchronous orbit (Mars GEO equivalent) and beam power to surface installations via lasers. The concept has been developed with industrial partner expertise in high efficiency solar cells, advanced concentrator modules, innovative arrays, and high power electric propulsion systems. The present baseline spacecraft design providing 898 kW using technologies expected to be available in 2003 will be described. Areal power densities approaching 350 W/sq m at 80 C operating temperatures and wing level specific powers of over 350 W/kg are projected. Details of trip times and payloads to Mars are presented. Electric propulsion options include Hall, MPD, and ion thrusters of various power levels and trade studies have been conducted to define the most advantageous options. Because the design is modular, learning curve methodology has been applied to determine expected cost reductions and is included.

Brandhorst, Henry W., Jr.↗

Mini array of quantum Hall devices based on epitaxial graphene

Series connection of four quantum Hall effect (QHE) devices based on epitaxial graphene films was studied for realization of a quantum resistance standard with an up-scaled value. The tested devices showed quantum Hall plateaux R{sub H,2} at a filling factor v = 2 starting from a relatively low magnetic field (between 4 T and 5 T) when the temperature was 1.5 K. The precision measurements of quantized Hall resistance of four QHE devices connected by triple series connections and external bonding wires were done at B = 7 T and T = 1.5 K using a commercial precision resistance bridge with 50 μA current through the QHE device. The results showed that the deviation of the quantized Hall resistance of the series connection of four graphene-based QHE devices from the expected value of 4×R{sub H,2} = 2 h/e{sup 2} was smaller than the relative standard uncertainty of the measurement (<1 × 10{sup −7}) limited by the used resistance bridge.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Majorana zero modes in Y -shape interacting Kitaev wires

Motivated by the recent experimental realization of minimal Kitaev chains using quantum dots, we investigate the Majorana zero modes (MZM) in Y-shape Kitaev wires. We solve the associated Kitaev models analytically at the sweet spot (t h = Δ) and derive the exact form of MZM wave-functions in this geometry. We observed exotic multi-site MZMs located near the junction center, on the nearby edge sites of each leg. This result is important for potential braiding of Majoranas and the performance of Y-junctions made from arrays of quantum dots. Furthermore, we study the stability of local (single-site) and multi-site MZMs modes in the presence of Coulomb repulsion, using density matrix renormalization group theory. Our local density-of-states calculation shows that these multi-site MZMs are as equally topologically protected as the single-site MZMs when in the presence of Coulomb repulsion or when away from the sweet-spot.

36 MATERIALS SCIENCE↗

Investigation of Boundary Layer Development in Multi-Stage Low Pressure

A review of recent literature has been made in the areas of unsteady measurement in turbomachinery and LP turbine design. This has included a detailed review of methods for extracting quantitative shear stress data from surface mounted hot-film arrays. Research goals were identified on the basis of the literature survey and following interaction with the GE and NASA contracts. Progress has also been made in the detailed planning of the research program. An array of hot-film sensors has been mounted at mid-span on a second stage nozzle blade ready for installation in the current turbine buildup. A new technique of applying the hot-film array using double sided adhesive is being tested. The temperature in the vicinity of the hot-films will be monitored using a thermocouple attached to the blade pressure surface. This will increase the accuracy of the data reduction process compared with the methods applied by Halstead et at. (1995) and others. Data obtained from this first set of sensors, along with data from the hot-wire investigation will help to determine the best locations for surface hot-film instrumentation for subsequent builds of the turbine. Other LSRT instrumentation issues which have been addressed include calibration of the torque measurement system and procurement of custom design hot-wire sensors required to compensate for the slope flow path. Preliminary attempts at modeling the boundary layer transition process have been completed. A steady, coupled viscous-inviscid flow solver (the MISES code of Drela and Youngren) was used to calculate the steady-flow boundary layer transition location.

Source record↗

TAB interconnects for space concentrator solar cell arrays

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Avery, J.↗

Nanoscale Hot-Wire Probes for Boundary-Layer Flows

Hot-wire probes having dimensions of the order of nanometers have been proposed for measuring temperatures (and possibly velocities) in boundary-layer flows at spatial resolutions much finer and distances from walls much smaller than have been possible heretofore. The achievable resolutions and minimum distances are expected to be of the order of tens of nanometers much less than a typical mean free path of a molecule and much less than the thickness of a typical flow boundary layer in air at standard temperature and pressure. An additional benefit of the small scale of these probes is that they would perturb the measured flows less than do larger probes. The hot-wire components of the probes would likely be made from semiconducting carbon nanotubes or ropes of such nanotubes. According to one design concept, a probe would comprise a single nanotube or rope of nanotubes laid out on the surface of an insulating substrate between two metallic wires. According to another design concept, a nanotube or rope of nanotubes would be electrically connected and held a short distance away from the substrate surface by stringing it between two metal electrodes. According to a third concept, a semiconducting nanotube or rope of nanotubes would be strung between the tips of two protruding electrodes made of fully conducting nanotubes or ropes of nanotubes. The figure depicts an array of such probes that could be used to gather data at several distances from a wall. It will be necessary to develop techniques for fabricating the probes. It will also be necessary to determine whether the probes will be strong enough to withstand the aerodynamic forces and impacts of micron-sized particles entrained in typical flows of interest.

Tedjojuwono, Ken T.↗

Simulated Space Environmental Effects on Thin Film Solar Array Components

The Lightweight Integrated Solar Array and Transceiver (LISA-T) experiment consists of thin-film, low mass, low volume solar panels. Given the variety of thin solar cells and cover materials and the lack of environmental protection typically afforded by thick coverglasses, a series of tests were conducted in Marshall Space Flight Center's Space Environmental Effects Facility to evaluate the performance of these materials. Candidate thin polymeric films and nitinol wires used for deployment were also exposed. Simulated space environment exposures were selected based on SSP 30425 rev. B, "Space Station Program Natural Environment Definition for Design" or AIAA Standard S-111A-2014, "Qualification and Quality Requirements for Space Solar Cells." One set of candidate materials were exposed to 5 eV atomic oxygen and concurrent vacuum ultraviolet (VUV) radiation for low Earth orbit simulation. A second set of materials were exposed to 1 MeV electrons. A third set of samples were exposed to 50, 100, 500, and 700 keV energy protons, and a fourth set were exposed to >2,000 hours of near ultraviolet (NUV) radiation. A final set was rapidly thermal cycled between -55 and +125 C. This test series provides data on enhanced power generation, particularly for small satellites with reduced mass and volume resources. Performance versus mass and cost per Watt is discussed.

Finckenor, Miria↗

Simulated Space Environmental Effects on Thin Film Solar Array Components

The Lightweight Integrated Solar Array and Transceiver (LISA-T) experiment consists of thin-film, low mass, low volume solar panels. Given the variety of thin solar cells and cover materials and the lack of environmental protection afforded by typical thick coverglasses, a series of tests were conducted in Marshall Space Flight Center's Space Environmental Effects Facility to evaluate the performance of these materials. Candidate thin polymeric films and nitinol wires used for deployment were also exposed. Simulated space environment exposures were selected based on SSP 30425 rev. B, "Space Station Program Natural Environment Definition for Design" or AIAA Standard S-111A-2014, "Qualification and Quality Requirements for Space Solar Cells." One set of candidate materials were exposed to 5 eV atomic oxygen and concurrent vacuum ultraviolet (VUV) radiation for low Earth orbit simulation. A second set of materials were exposed to 1 MeV electrons. A third set of samples were exposed to 50, 500, and 750 keV energy protons, and a fourth set were exposed to >2,000 hours of ultraviolet radiation. A final set was rapidly thermal cycled between -50 and +120 C. This test series provides data on enhanced power generation, particularly for small satellites with reduced mass and volume resources. Performance versus mass and cost per Watt is discussed.

Finckenor, Miria↗

Simulated Space Environmental Effects on Thin Film Solar Array Components

The Lightweight Integrated Solar Array and Transceiver (LISA-T) experiment consists of thin-film, low mass, low volume solar panels. Given the variety of thin solar cells and cover materials and the lack of environmental protection typically afforded by thick coverglasses, a series of tests were conducted in Marshall Space Flight Center's Space Environmental Effects Facility to evaluate the performance of these materials. Candidate thin polymeric films and nitinol wires used for deployment were also exposed. Simulated space environment exposures were selected based on SSP 30425 rev. B, "Space Station Program Natural Environment Definition for Design" or AIAA Standard S-111A-2014, "Qualification and Quality Requirements for Space Solar Cells." One set of candidate materials were exposed to 5 eV atomic oxygen and concurrent vacuum ultraviolet (VUV) radiation for low Earth orbit simulation. A second set of materials were exposed to 1 MeV electrons. A third set of samples were exposed to 50, 100, 500, and 700 keV energy protons, and a fourth set were exposed to >2,000 hours of near ultraviolet (NUV) radiation. A final set was rapidly thermal cycled between -55 and +125degC. This test series provides data on enhanced power generation, particularly for small satellites with reduced mass and volume resources. Performance versus mass and cost per Watt is discussed.

Finckenor, Miria↗

Growing antiphase-domain-free GaAs thin films out of highly ordered planar nanowire arrays on exact (001) silicon

We report the use of highly ordered, dense, and regular arrays of in-plane GaAs nanowires as building blocks to produce antiphase-domain-free GaAs thin films on exact (001) silicon. High quality GaAs nanowires were grown on V-grooved Si (001) substrates using the selective aspect ratio trapping concept. The 4.1% lattice mismatch has been accommodated by the initial GaAs, a few nanometer-thick with high density stacking faults. The bulk of the GaAs wires exhibited smooth facets and a low defect density. An unusual defect trapping mechanism by a “tiara”-like structure formed by Si undercuts was discovered. As a result, we were able to grow large-area antiphase-domain-free GaAs thin films out of the nanowires without using SiO{sub 2} sidewalls for defect termination. Analysis from XRD ω-rocking curves yielded full-width-at-half-maximum values of 238 and 154 arc sec from 900 to 2000 nm GaAs thin films, respectively, indicating high crystalline quality. The growth scheme in this work offers a promising path towards integrated III-V electronic, photonic, or photovoltaic devices on large scale silicon platform.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Institute for High Heat Flux Removal (IHHFR). Phases I, II, and III

The IHHFR focused on interdisciplinary applications as it relates to high heat flux engineering issues and problems which arise due to engineering systems being miniaturized, optimized, or requiring increased high heat flux performance. The work in the IHHFR focused on water as a coolant and includes: (1) the development, design, and construction of the high heat flux flow loop and facility; (2) test section development, design, and fabrication; and, (3) single-side heat flux experiments to produce 2-D boiling curves and 3-D conjugate heat transfer measurements for single-side heated test sections. This work provides data for comparisons with previously developed and new single-side heated correlations and approaches that address the single-side heated effect on heat transfer. In addition, this work includes the addition of single-side heated circular TS and a monoblock test section with a helical wire insert. Finally, the present work includes: (1) data base expansion for the monoblock with a helical wire insert (only for the latter geometry), (2) prediction and verification using finite element, (3) monoblock model and methodology development analyses, and (4) an alternate model development for a hypervapotron and related conjugate heat transfer controlling parameters.

2-D Boiling Curves↗

Sensor for distinguishing liquid-vapor phases of superfluid helium

A small, high-accuracy, rapid-response, low-power-dissipation sensor used in determining the distribution of the liquid and vapor phases of helium in a rocket-borne cryogenic cooler is described. The device, which consists of a 6 mm constantan wire coated for about two-thirds of its length with a superconductor alloy, operates on the basis of the coating's alternation between superconductivity (during immersion in the fluid) and a normal resistive state (during immersion in the vapor). The sensor's response time upon shift from one environment to the other is found to be less than 10 milliseconds. Details of design criteria, and installation of an array of sensors in a flight dewar are also given.

Petrac, D.↗