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Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.
"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.
We have developed a software library (KVTP-lib) for VLBI data transmission over the network with the VDIF (VLBI Data Interchange Format), which is the newly proposed standard VLBI data format designed for electronic data transfer over the network. The software package keeps the application layer (VDIF frame) and the transmission layer separate, so that each layer can be developed efficiently. The real-time VLBI data transmission tool sudp-send is an application tool based on the KVTP-lib library. sudp-send captures the VLBI data stream from the VSI-H interface with the K5/VSI PC-board and writes the data to file in standard Linux file format or transmits it to the network using the simple- UDP (SUDP) protocol. Another tool, sudp-recv , receives the data stream from the network and writes the data to file in a specific VLBI format (K5/VSSP, VDIF, or Mark 5B). This software system has been implemented on the Wettzell Tsukuba baseline; evaluation before operational employment is under way.
The electrodynamic environment at Enceladus is often assumed to be driven exclusively by ions produced from the moon's south polar plume. In this presentation, we demonstrate that acceleration of moon-originating submicron dust by the reduced co-rotating E-field is capable of creating a substantial current perpendicular to the magnetic field. This pickup current may be comparable to the ion pickup current, and may be large enough to deflect the local magnetic field. We will analyze observations from the Langmuir Probe that is a component of Cassini's Radio and Plasma Wave Science (RPWS) package, along with associated plasma waves that reveal electron concentrations. We will especially examine the observations from the 12 March 2008 spacecraft passage by the body, where the spacecraft was moving primarily southward taking it along-side the jet/plume emitted from the south pole of the moon. The region of dust pickup is found to originate about 3-5 Enceladus radii northward of the moon, and extends to at least 10 radii southward of the moon. We attempt to quantify the dust pickup current and describe the effect the current might have on the overall magnetoplasma and E-field environment in the vicinity of the body.
A variety of mission concepts have been studied by NASA and the U. S. Department of Energy that would utilize low power Radioisotope Power Systems (RPS) for small probes, landers, rovers, and communication repeaters. These missions would contain science measuring instruments that could be distributed across planetary surfaces for operation in temporarily or permanently shadowed regions. High efficiency dynamic RPS could be mission enabling for science measurements on the moon, such as collecting real-time, event-based, or cumulative space radiation measurements including primary galactic cosmic rays (GCR), solar particle events (SPE), and secondary particles liberated during atmospheric and/or surface reactions. Small RPS would use fractional versions of the General Purpose Heat Source (GPHS) or Light Weight Radioisotope Heater Units (LWRHU), to heat the power conversion technologies. Capable of three to four times higher conversion efficiency than static technologies, dynamic RPS would provide an equal amount of power using less fuel or more power using an equal amount of fuel. Providing spacecraft with more power could decrease duty cycling of basic functions and increase the quality and abundance of science data. Low power Stirling convertors are being developed at NASA Glenn Research Center (GRC) to provide future micro spacecraft with electrical power by converting heat from one or more LWRHUs. An initial concept would convert eight Watts of heat to one Watt of electrical power output for science instruments and communication. The initial design, called Small Stirling Technology Exploration Power (smallSTEP), is 11 cm diameter X 32 cm long, weighs around 3 kg, and could be used to charge batteries or capacitors for higher power burst usage. Development of the 1-watt RPS includes maturation of a Stirling engine and linear alternator, an electronics controller, and an evacuated metal foil insulation package. Test hardware and facilities are being prepared for initial demonstration of the subassemblies in a laboratory environment.
The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.
The JPL-led CSP Consortium of enterprises representing government agencies and private companies has joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Differential charging effects observed in the electron data of the University of California, San Diego, auroral particles experiment on Applied Technology Satellite 6 are described and analyzed. An electrostatic barrier around the environmental measurements experiment (EME) package on ATS 6 is shown to be the natural result of dielectrics around the spacecraft which are more negatively charged than the mainframe of the spacecraft. In particular, the large dish antenna on ATS 6 causes the formation of a barrier which traps particles emitted from the EME package surface and returns them to the spacecraft. The insulating surface of the rotating University of Minnesota detector on the otherwise conducting EME package is shown to be the source of accelerated fluxes of electrons during charging events.
In March, 1981, electron beam experiments were conducted in a large space simulation chamber using equipment destined to be flown aboard NASA's Office of Space Science-1 pallet (OSS-1). Two major flight experiments were involved. They include the Vehicle Charging and Potential (VCAP) experiment and the Plasma Diagnostics Package (PDP). Apparatus connected with VCAP included a Fast Pulse Electron Gun (FPEG), and a Charge and Current Probe (CCP). A preliminary view is provided of the results obtained when the electron emissions were held steady over relatively long periods of time such that steady state conditions could be obtained with respect to the electron beam interaction with the neutral gases and plasma of the vacuum chamber. Of particular interest was the plasma instability feature known as the Beam Plasma Discharge. For the present experiments the FPEG was used in a dc mode with a range of currents of 2 to 80 mA at a beam energy of 970 eV. Attention is given to the emissions of VLF and HF noise associated with the dc beam.
During the Spacelab 2 mission the University of Iowa's Plasma Diagnostics Package (PDP) explored the plasma environment around the shuttle. Wideband spectrograms of plasma waves were obtained from the PDP at frequencies of 0-30 kHz and at distances up to 400 m from the shuttle. Strong low-frequency (below 10 kHz) electric field noise was observed in the wideband data during two periods in which an electron beam was ejected from the shuttle. This noise shows clear evidence of interference patterns caused by the finite (3.89 m) antenna length. The low-frequency noise was the most dominant type of noise produced by the ejected electron beam. Analysis of antenna interference patterns generated by these waves permits a determination of the wavelength, the direction of propagation, and the location of the source region. The observed waves have a linear dispersion relation very similar to that of ion acoustic waves. The waves are believed to be oblique ion acoustic or high-order ion cyclotron waves generated by a current of ambient electrons returning to the shuttle in response to the ejected electron beam.
A rocket-borne experiment package has been designed to obtain simultaneous in situ measurements of the pitch angle distributions and energy spectra of primary auroral particles, the flux of neutral hydrogen at auroral energies, the electric currents flowing in the vicinity of the auroral arc as determined from vector magnetic data, and the modulation of precipitating electrons in the frequency range 0.5-10 MHz. The experiment package was launched by a Nike-Tomahawk rocket from Poker Flat, Alaska, at 0722 UT on Feb. 25, 1972, over a bright auroral band. This paper is intended to serve as an introduction to the detailed discussion of results given in the companion papers. As such it includes a brief review of the general problem, a discussion of the rocket instrumentation, a delineation of the auroral and geomagnetic conditions at the time of launch, and comments on the overall payload performance.
Radiation belts around Planets have sufficient high energy electron flux to penetrate spacecraft skins and statically charge insulators inside the electronic boxes. For example, geosynchronous-orbit Earth spacecraft require 100 mils aluminum shielding to sufficiently attenuate the fast electron flux. Electrons are stopped and accumulate slowly in the insulated materials to produce strong electric fields. Typically the field strength achieves a threshold for occasional spontaneous discharge in the insulating material. The field strength remains high yet pulsing is infrequent. Charge can leak off if the insulator is sufficiently leaky. The conductivity of insulators is usually controlled by mobile ions such as H and OH in ground service. In space the mobile ions are eventually out-gassed. The resistivity of several insulators is known to increase over three decades after exposure to vacuum for several months. Insulators in space were seen to pulse more frequently as they aged.
The Microgravity Projects Office identified a need to develop a software package that will lead experiment developers through the development planning process, obtain necessary information, establish an electronic data exchange avenue, and allow easier manipulation/reformatting of the collected information. An MS-DOS compatible software package called the Automated Payload Experiment Tool (APET) has been developed and delivered. The objective of this task is to expand on the results of the APET work previously performed by UAH and provide versions of the software in a Macintosh and Windows compatible format.
The Microgravity Projects Office identified a need to develop a software package that will lead experiment developers through the development planning process, obtain necessary information, establish an electronic data exchange avenue, and allow easier manipulation/reformatting of the collected information. An MS-DOS compatible software package called the Automated Payload Experiment Tool (APET) has been developed and delivered. The objective of this task is to expand on the results of the APET work previously performed by University of Alabama in Huntsville (UAH) and provide versions of the software in a Macintosh and Windows compatible format. Appendix 1 science requirements document (SRD) Users Manual is attached.
This invited presentation describes demonstration of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. SiC junction field effect transistor-resistor (JFET-R) ICs with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient [1], 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber [2], and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes [3]. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C T-span) without significant change in signal (input /output) or power supply voltages [4]. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards this end, the processing that forms the SiC JFETs and resistors (without interconnect) for the NASA Glenn “Generation 12” design prototype JFET-R ICs was conducted at GE Research. Once the COVID-delayed IC interconnect and bond pad fabrication processing on these wafers is completed at NASA Glenn, the resulting chips will be packaged and oven-tested [5]. It is expected that further technology transfer to complete commercial production will lower investment and risk barriers to useful application deployment. For NASA, an initial high-value deployment is opening the Venus surface to extended missions for robotic scientific exploration.
Abstract. Changes in modern integrated circuit (IC) technologies have modified the way we approach and conduct radiation tolerance and testing of electronics. These changes include scaling of geometries, new materials, new packaging technologies, and overall speed and device complexity challenges. In this short course section, we will identify and discuss these issues as they impact radiation testing, modeling, and effects mitigation of modern integrated circuits. The focus will be on CMOS-based technologies, however, other high performance technologies will be discussed where appropriate. The effects of concern will be: Single-Event Effects (SEE) and steady state total ionizing dose (TID) IC response. However, due to the growing use of opto-electronics in space systems issues concerning displacement damage testing will also be considered. This short course section is not intended to provide detailed "how-to-test" information, but simply provide a snapshot of current challenges and some of the approaches being considered.
Electron beam deflection electric field meter for ALSEP experiments package