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At least 613 records · Page 34

All sources NASA NTRS DOE OSTI

NASA NTRS2006

Cyclic Oxidation Behavior of Cold Sprayed CuCrAl-Coated and Uncoated GRCop-84 Substrates for Space Launch Vehicles

A newly developed Cu-23 (wt %) Cr-5%Al (CuCrAl) alloy shown to resist hydridation and oxidation in an as-cast form is currently being considered as a protective coating for GRCop-84, which is an advanced copper alloy containing 8 (at.%) Cr and 4 (at.%) Nb. The coating was deposited on GRCop-84 substrates by the cold spray deposition technique. Cyclic oxidation tests conducted in air on both coated and uncoated substrates between 773 and 1073 K revealed that the coating remained intact and protected the substrate up to 1073 K. No significant weight loss of the coated specimens were observed at 773 and 873 K even after a cumulative cyclic time of 500 h. About a 10 percent weight loss observed at 973 and 1073 K was attributed to the excessive oxidation of the uncoated sides. In contrast, the uncoated substrate lost as much as 80 percent of its original weight under similar test conditions. It is concluded that the cold sprayed CuCrAl coating is suitable for protecting GRCop-84 substrates.

Raj, S. V.↗

NASA NTRS2007

Characterization of Cold Sprayed CuCrAl-Coated and Uncoated GRCop-84 Substrates for Space Launch Vehicles

A newly developed Cu-23(wt.%)Cr-5%Al (CuCrAl) alloy is currently being considered as a protective coating for GRCop-84 (Cu-8(at.%)Cr-4%Nb). The coating was deposited on GRCop-84 substrates by the cold spray deposition technique. Cyclic oxidation tests conducted in air on both coated and uncoated substrates between 773 and 1073 K revealed that the coating remained intact and protected the substrate up to 1073 K. No significant weight loss of the coated specimens were observed at 773 and 873 K even after a cumulative cyclic time of 500 h. In contrast, the uncoated substrate lost as much as 80% of its original weight under similar test conditions. Low cycle fatigue tests revealed that the fatigue lives of thinly coated GRCop-84 specimens were similar to the uncoated specimens within the limits of experimental scatter. It is concluded that the cold sprayed CuCrAl coating is suitable for protecting GRCop-84 substrates.

Raj, S. V.↗

NASA NTRS2007

Exploration of CIGAS Alloy System for Thin-Film Photovoltaics on Novel Lightweight and Flexible Substrates

Thin-film photovoltaics (TFPV) on lightweight and flexible substrates offer the potential for very high solar array specific power (W/kg). ITN Energy Systems, Inc. (ITN) is developing flexible TFPV blanket technology that has potential for specific power greater than 2000 W/kg (including space coatings) that could result in solar array specific power between 150 and 500 W/kg, depending on array size, when mated with mechanical support structures specifically designed to take advantage of the lightweight and flexible substrates.(1) This level of specific power would far exceed the current state of the art for spacecraft PV power generation, and meet the needs for future spacecraft missions.(2) Furthermore the high specific power would also enable unmanned aircraft applications and balloon or high-altitude airship (HAA) applications, in addition to modular and quick deploying tents for surface assets or lunar base power, as a result of the high power density (W/sq m) and ability to be integrated into the balloon, HAA or tent fabric. ITN plans to achieve the high specific power by developing single-junction and two-terminal monolithic tandem-junction PV cells using thin-films of high-efficiency and radiation resistant CuInSe2 (CIS) partnered with bandgap-tunable CIS-alloys with Ga (CIGS) or Al (CIAS) on novel lightweight and flexible substrates. Of the various thin-film technologies, single-junction and radiation resistant CIS and associated alloys with gallium, aluminum and sulfur have achieved the highest levels of TFPV device performance, with the best efficiency reaching 19.5% under AM1.5 illumination conditions and on thick glass substrates.(3) Thus, it is anticipated that single- and tandem-junction devices with flexible substrates and based on CIS and related alloys will achieve the highest levels of thin-film space and HAA solar array performance.

Woods, Lawrence M.↗

NASA NTRS2007

Synthesis of Poly-Silicon Thin Films on Glass Substrate Using Laser Initiated Metal Induced Crystallization of Amorphous Silicon for Space Power Application

Poly-silicon thin films on glass substrates are synthesized using laser initiated metal induced crystallization of hydrogenated amorphous silicon films. These films can be used to fabricate solar cells on low cost glass and flexible substrates. The process starts by depositing 200 nm amorphous silicon films on the glass substrates. Following this, 200 nm of sputtered aluminum films were deposited on top of the silicon layers. The samples are irradiated with an argon ion cw laser beam for annealing. Laser power densities ranging from 4 to 9 W/cm2 were used in the annealing process. Each area on the sample is irradiated for a different exposure time. Optical microscopy was used to examine any cracks in the films and loss of adhesion to the substrates. X-Ray diffraction patterns from the initial results indicated the crystallization in the films. Scanning electron microscopy shows dendritic growth. The composition analysis of the crystallized films was conducted using Energy Dispersive x-ray Spectroscopy. The results of poly-silicon films synthesis on space qualified flexible substrates such as Kapton are also presented.

Abu-Safe, Husam H.↗

NASA NTRS2003

Hot Films on Ceramic Substrates for Measuring Skin Friction

Hot-film sensors, consisting of a metallic film on an electrically nonconductive substrate, have been used to measure skin friction as far back as 1931. A hot film is maintained at an elevated temperature relative to the local flow by passing an electrical current through it. The power required to maintain the specified temperature depends on the rate at which heat is transferred to the flow. The heat transfer rate correlates to the velocity gradient at the surface, and hence, with skin friction. The hot-film skin friction measurement method is most thoroughly developed for steady-state conditions, but additional issues arise under transient conditions. Fabricating hot-film substrates using low-thermal-conductivity ceramics can offer advantages over traditional quartz or polyester-film substrates. First, a low conductivity substrate increases the fraction of heat convected away by the fluid, thus increasing sensitivity to changes in flow conditions. Furthermore, the two-part, composite nature of the substrate allows the installation of thermocouple junctions just below the hot film, which can provide an estimate of the conduction heat loss.

Noffz, Greg↗

NASA NTRS2014

Diagenetic Features in Yellowknife Bay, Gale Crater, Mars: Implications for Substrate Rheology and Potential Gas Release

Multiple diagenetic features have been observed in clay-bearing mudstone exposed within Yellowknife Bay, Gale Crater, Mars. These features occurred during at least two separate episodes: an early generation of spheroidal concretions that co-occur with a dense networks of mineralized fractures, and a later generation of mineralized veins. Concretions consist of mm-sized spheroids (0.4 to 8.0 mm, mean diameter of 1.2 mm) that are distinctly more resistant than the encompassing mudstone. Dissected spheroids suggest an origin via compaction and incipient lithification of the substrate at the perimeter of syndepositional void space. Concretions are generally patchy in their distribution within clay-‐bearing mudstone, but in places can be the dominant fabric element. Locally dense networks of mineralized fractures occur in regions of low concretion abundance. These consist of short (< 50 cm), curvilinear to planar mineralized voids that occur across a range of orientations from vertical to subhorizontal. Fractures are filled by multi-phase cement consisting of two isopachous, erosionally resistant outer bands, and a central less resistant fill. Physical relationships suggests that original fractures may have formed as both interconnected voids and as discrete cross--cutting features. Co--occurrence of early diagenetic concretions and fracture networks suggests a common origin via gas release within a subaqueous, shallow substrate. We suggest that gas release within weakly cohesive subsurface sediments resulted in substrate dewatering and an increase in the cohesive strength of the substrate. Local differences in substrate strength and rate of gas production would have result in formation of either discrete voids or fracture networks. A second generation of mineralized veins is characterized by a regionally low spatial density, predominantly vertical or horizontal orientations, and a single phase of Ca-‐sulfate mineral fill. These veins cross-cut the early diagenetic elements and intersect a greater thickness of stratigraphy within Yellowknife Bay, suggesting a later-‐diagenetic origin via hydraulic fracturing.

Kah, L. C.↗

DOE OSTI2012

Maintainable substrate carrier for electroplating

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed.

42 ENGINEERING↗

DOE OSTI2012

Edge coating apparatus with movable roller applicator for solar cell substrates

A non-contact edge coating apparatus includes an applicator for applying a coating material on an edge of a solar cell substrate and a control system configured to drive the applicator. The control system may drive the applicator along an axis to maintain a distance with an edge of the substrate as the substrate is rotated to have the edge coated with a coating material. The applicator may include a recessed portion into which the edge of the substrate is received for edge coating. For example, the applicator may be a roller with a groove. Coating material may be introduced into the groove for application onto the edge of the substrate. A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.

42 ENGINEERING↗

DOE OSTI2015

Method for forming a nano-textured substrate

A method for forming a nano-textured surface on a substrate is disclosed. An illustrative embodiment of the present invention comprises dispensing of a nanoparticle ink of nanoparticles and solvent onto the surface of a substrate, distributing the ink to form substantially uniform, liquid nascent layer of the ink, and enabling the solvent to evaporate from the nanoparticle ink thereby inducing the nanoparticles to assemble into an texture layer. Methods in accordance with the present invention enable rapid formation of large-area substrates having a nano-textured surface. Embodiments of the present invention are well suited for texturing substrates using high-speed, large scale, roll-to-roll coating equipment, such as that used in office product, film coating, and flexible packaging applications. Further, embodiments of the present invention are well suited for use with rigid or flexible substrates.

36 MATERIALS SCIENCE↗

DOE OSTI2016

Maintainable substrate carrier for electroplating

36 MATERIALS SCIENCE↗

DOE OSTI2017

Method of making an apparatus for transpiration cooling of substrates such as turbine airfoils

A method and apparatus for generating transpiration cooling using an oxidized porous HTA layer metallurgically bonded to a substrate having micro-channel architectures. The method and apparatus generates a porous HTA layer by spreading generally spherical HTA powder particles on a substrate, partially sintering under O.sub.2 vacuum until the porous HTA layer exhibits a porosity between 20% and 50% and a neck size ratio between 0.1 and 0.5, followed by a controlled oxidation generating an oxidation layer of alumina, chromia, or silica at a thickness of about 20 to about 500 nm. In particular embodiments, the oxidized porous HTA layer and the substrate comprise Ni as a majority element. In other embodiments, the oxidized porous HTA layer and the substrate further comprise Al, and in additional embodiments, the oxidized porous HTA layer and the substrate comprise .gamma.-Ni+.gamma.'-Ni.sub.3Al.

36 MATERIALS SCIENCE↗

DOE OSTI2012

Direct growth of metal nanoplates on semiconductor substrates

Metal nanoplates are grown on n-type and p-type semiconductor wafer substrates through galvanic reactions between substantially pure aqueous metal solutions and the substrates. The morphology of the resulting metal nanoplates that protrude from the substrate can be tuned by controlling the concentration of the metal solution and the reaction time of the solution with the semiconductor wafer. Nanoplate size gradually increases with prolonged growth time and the nanoplate thicknesses increases in a unique stepwise fashion due to polymerization and fusion of adjacent nanoplates. Further, the roughness of the nanoplates can also be controlled. In a particular embodiment, Ag nanoplates are grown on a GaAs substrate through reaction with a solution of AgNO3 with the substrate.

36 MATERIALS SCIENCE↗

DOE OSTI2019

Group-III nitride devices and systems on IBAD-textured substrates

A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used. The user is able to choose a substrate for its mechanical and thermal properties, such as how well its coefficient of thermal expansion matches that of the hexagonal epitaxial layer, while choosing a textured layer that more closely lattice matches that layer. Electronic devices such as LEDs can be manufactured from such structures. Because the substrate can act as both a reflector and a heat sink, transfer to other substrates, and use of external reflectors and heat sinks, is not required, greatly reducing costs. Large area devices such as light emitting strips or sheets may be fabricated using this technology.

Matias, Vladimir↗

DOE OSTI2020

Group-III nitride devices and systems on IBAD-textured substrates

36 MATERIALS SCIENCE↗

DOE OSTI2021

Distributed measurement of minimum and maximum in-situ stress in substrates

A system for performing distributed measurements of in-situ stress includes an expandable element with at least one fiber optic sensor. The expandable element can be positioned at various depths in a hole in a substrate. A pressurizing device expands (and contracts) the expandable element when the expandable element is inserted in the hole in the substrate to exert pressure on the hole wall. A pressure sensor provides a sensor output indicative of a pressure applied to the hole wall by the expandable element. The fiber optic sensor and an optical interrogator measure strain along a length of the sensor in a continuous, high spatial resolution manner Based on the measured strain and pressure sensor output, the system determines various properties of the substrate such as, minimum principal stress, maximum principal stress, and/or principal stress direction associated with one or more fractures in the substrate, as well as substrate modulus.

Ohanian, III, Osgar John↗

DOE OSTI2012

Surface Preparation of Metallic Substrates for Quality SRF Thin Films

Surface Preparation of Metallic Substrates for Quality SRF Thin Films J. Spradlin*, A.-M. Valente-Feliciano, O. Trofimova, Thomas Jefferson National Accelerator Facility, Newport News, VA U.S.A. Surface preparation is an essential prerequisite for thin film depositions. Rough or chemically impure surfaces adversely affect the nature of the thin film. Understanding the properties of the substrate and how they influence the quality of the thin film is necessary to transfer thin film deposition technologies to SRF cavity applications. A substrate that is flat, has sufficient grain size, and is chemically pure is the ideal starting point for thin film depositions. A method for copper substrate preparation is reviewed for niobium thin film deposition that provides epitaxy on large and fine grain copper as well as single crystal copper. Preliminary data on niobium and aluminum substrate preparation will also be included. *Authored by Jefferson Science Associates, LLC under U.S. DOE Contract No. DE-AC05-06OR23177.

Spradlin, Joshua↗

DOE OSTI2024

Virtual Substrates for Wide Bandgap AlyX1-yN Growth

Lattice-matched substrates are critical for growth of high quality, compositionally-targeted ternary AlyX1-yN compounds with properties suitable for a wide variety of next-generation opto- and power electronic applications. [DOI:10.1149/2.0111702jss] We have identified the (111) plane of transition metal carbides and nitrides as lattice matched "virtual" substrate layers that have additional benefits of electrical conductivity and appropriate coefficients of thermal expansion for nitride layer at both growth and operating temperatures. [arXiv:2208.11769 2022] In this work, (111)-oriented TaC and ZrN are grown by RF sputtering and optimized as substrate layers for AlyGa1-yN and AlyGd1-yN, respectively. TaC is demonstrated as a full proof of concept. (111)-stabilized TaC layers with a rock-salt crystal structure are annealed to improve surface crystal quality and surface morphology and then used as a template for growth of an Al0.7Ga0.3N layer by molecular beam epitaxy. X-ray diffraction (XRD) demonstrates epitaxial registry of the grown layer to the substrate. High resolution transmission electron microscopy (TEM) is used to investigate interface behavior, showing regions of abrupt interface transitions and nitrogen polar termination of the Al0.7Ga0.3N. We also grew (111)-oriented ZrN on Ti-Zr-N graded buffer layers as a lattice-matched virtual substrate for AlyGd1-yN. Structure, morphology, and strain are analyzed using XRD and atomic force microscopy. Structure and quality of initial Al0.8Gd0.2N thin films are investigated for both in-situ and ex-situ growths.

AlyX1-yN↗

DOE OSTI2024

Group-III nitride devices and systems on IBAD-textured substrates

A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111>oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used. The user is able to choose a substrate for its mechanical and thermal properties, such as how well its coefficient of thermal expansion matches that of the hexagonal epitaxial layer, while choosing a textured layer that more closely lattice matches that layer. Electronic devices such as LEDs can be manufactured from such structures. Because the substrate can act as both a reflector and a heat sink, transfer to other substrates, and use of external reflectors and heat sinks, is not required, greatly reducing costs. Large area devices such as light emitting strips or sheets may be fabricated using this technology.

Matias, Vladimir↗