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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 631 records · Page 35
All sourcesNASA NTRSDOE OSTI
NASA NTRS1981

Design and development of a six degree of freedom hand controller

The design objectives of a six degree of freedom manual controller are discussed with emphasis on a space environment. Details covered include problems associated with a zero-g environment, the need to accommodate both 'shirt sleeve' and space suited astronauts, the combination of both manipulator operation and spacecraft flight control in a single device, and to accommodate restraints in space. A variable configuration device designed as a development tool in which rotational axes can be moved relative to one another, is described and its limitations discussed. Two additional devices were developed for concept testing. Each device combines the need for good quality with its ability achieve a wide range of adjustments.

King, M. L.↗
NASA NTRS1992

A dynamic study of fragmentation and energy loss during high velocity impact

Research conducted under this contract can be divided into two main areas: hypervelocity (in the range up to 7 km/s) and high velocity (less than 1 km/s). Work in the former was performed at NASA-MSFC using the Light Gas Gun Facility. The lower velocity studies were conducted at Auburn University using the ballistic gun. The emphasis of the project was on the hypervelocity phenomenon especially in the characterization of the debris cloud formed by the primary impact events. Special devices were made to determine the angular distributions of momentum and energy of the debris cloud as a function of impact conditions. After several iteration processes, it was decided to concentrate on the momentum effort. Prototype devices were designed, fabricated, and tested. These devices were based on the conservation of momentum. Distributions of the debris cloud formed were measured by determining the amount of momentum transferred from the debris cloud to strategically placed pendulum measurement devices. The motion of the pendula was monitored using itegrated opto-interrupters. The distribution of momentum in the debris cloud was found to be a strong function of the impact condition. Small projectiles at high velocities were observed to produce finely dispersed debris whereas large projectiles generated discrete particles in the debris. Results also show that the momentum in the forward direction was enhanced due to the impact. This phenomenon of momentum multiplication was also observed in other studies and in computer simulations. It was initially planned to determine the energy distribution using deformation energy in a rod with strain gauges. Results from preliminary studies show that this technique is acceptable but too tedious. A new technique was explored based on measuring the heating effect of the debris cloud using an IR camera. The feasibility and sensitivity was established at Auburn University. This type of energy distribution measurement method can easily be adapted to the gas gun facility at MSFC. The objective of the lower velocity studies at Auburn was to simulate the damage produced in advanced materials by the lower energy debris cloud.

Zee, Ralph H.↗
NASA NTRS2014

Long Term Displacement Data of Woven Fabric Webbings Under Constant Load for Inflatable Structures

Inflatable modules for space applications offer weight and launch volume savings relative to current metallic modules. Limited data exist on the creep behavior of the restraint layer of inflatable modules. Long-term displacement and strain data of two high strength woven fabric webbings, Kevlar and Vectran, under constant load is presented. The creep behavior of webbings is required by designers to help determine service life parameters of inflatable modules. Four groups of different webbings with different loads were defined for this study. Group 1 consisted of 4K Kevlar webbings loaded to 33% ultimate tensile strength and 6K Vectran webbings loaded to 27% ultimate tensile strength, group 2 consisted of 6K Kevlar webbings loaded to 40% and 43% ultimate tensile strength, and 6K Vectran webbings loaded to 50% ultimate tensile strength, group 3 consisted of 6K Kevlar webbings loaded to 52% ultimate tensile strength and 6K Vectran webbings loaded to 60% ultimate tensile strength, and group 4 consisted of 12.5K Kevlar webbings loaded to 22% ultimate tensile strength, and 12.5K Vectran webbings loaded to 22% ultimate tensile strength. The uniquely designed test facility, hardware, displacement measuring devices, and test data are presented. Test data indicate that immediately after loading all webbings stretch an inch or more, however as time increases displacement values significantly decrease to fall within a range of several hundredth of an inch over the remainder of test period. Webbings in group 1 exhibit near constant displacements and strains over a 17-month period. Data acquisition was suspended after the 17th month, however webbings continue to sustain load without any local webbing damage as of the 21st month of testing. Webbings in group 2 exhibit a combination of initial constant displacement and subsequent increases in displacement rates over a 16-month period. Webbings in group 3 exhibit steady increases in displacement rates leading to webbing failure over a 3-month period. Five of six webbings experienced local damage and subsequent failure in group 3. Data from group 4 indicates increasing webbing displacements over a 7-month period. All webbings in groups 1, 2, and 4 remain suspended without any local damage as of the writing of this paper. Variations in facility temperatures over test period seem to have had limited effect on long-term webbing displacement data.

Kenner, Winfred S.↗
NASA NTRS2017

Towards a Qualification Data Set: Expanded SEE Data on the P2020 Processor

Earlier P2020 SEE data are compared and expanded to a recent die revision, significantly increasing samples tested by protons by five devices, and by heavy ions by five devices. Earlier tested SEE types are found to be fairly similar in register, L1 cache, L2 cache, and CPU crashes. New test methods give SEE performance for the flash memory controller, watchdog circuit, and a built-in Ethernet port on the P2020 processor. Results from heavy ion and proton tests are presented, with data separated over a large number of specific error types and test programs.

Vartanian, Sargeh↗
NASA NTRS1992

An optimal controller for an electric ventricular-assist device: theory, implementation, and testing

This paper addresses the development and testing of an optimal position feedback controller for the Penn State electric ventricular-assist device (EVAD). The control law is designed to minimize the expected value of the EVAD's power consumption for a targeted patient population. The closed-loop control law is implemented on an Intel 8096 microprocessor and in vitro test runs show that this controller improves the EVAD's efficiency by 15-21%, when compared with the performance of the currently used feedforward control scheme.

Therapy, Computer-Assisted/standards↗
NASA NTRS2008

Are Current SEE Test Procedures Adequate for Modern Devices and Electronics Technologies?

Believe it or not, this has been a simplistic look at starting a checklist for SEE testing. Given a memory that has 68 operating modes, when a SEU occurs that changes the mode, just how do you determine what's going on? Laser and microbeam tests can help, but not easily for modern packaged devices. Expanding this approach to other more complex devices such as ADCs or processors as well as analog devices should be considered. The recommendation is to use the existing text standards as the starting point. Just make your own checklist for the device/technology/issues being considered. At HEART 2007, we presented some of the burgeoning challenges associated with single event effect(SEE) testing of modern commercial memories: a) Package, device complexity, test fixture, and data analysis issues were discussed; b) "Complete" SEE Characterization would take 15 years; c) Qualification test costs have a greater than 4 times increase over the last decade. In this talk, we continue to explore the roles of technology with an emphasis on the existing SEE Test Procedures and some of the concerns related to modern devices. The primary objective of the briefing is to provide some overarching guidance concerning the many considerations involved in the formulation of a SEE test plan provided in a " Checklist" format.we note that there is no such thing as a complete check list and that the best approach is to develop a flexible test plan that takes into account the device type and functions, the device technology, circuit and package design, and, of course, test facility and beam characteristics.

LaBel, Kenneth A.↗
NASA NTRS1986

Potential influences of heavy rain on general aviation airplane performance

Recent NASA wind tunnel tests of airfoils in a simulated rain environment under extremely heavy rain conditions have shown reductions in maximum lift and increases in drag. Conventional airfoils were tested with and without high lift devices and tests of laminar-flow airfoils without high-lift devices were conducted. Both types of airfoils indicated performance decrements when exposed to a simulated heavy rain environment. For the laminar flow airfoil, the rain influence was observed to occur throughout the angle of attack range, whereas for the conventional airfoil in a high lift configuration, the rain influence occurred mostly at the higher angles of attack. The performance decrement for the laminar-flow airfoil appeared to be a result of laminar-to-turbulent boundary-layer transition whereas the performance penalty for the conventional airfoil appeared to be the result of premature separation. The results of these tests are presented and the implication of the results to general aviation airplanes are discussed.

Dunham, R. E., Jr.↗
DOE OSTI2026

Report on Lightning Simulation Standards and Facilities

Lightning strikes pose a significant threat to various forms of infrastructure and electrical equipment. Aircraft and high explosives are of particular interest due to the massive ramifications of the device being compromised due to exposure to lightning damage. However, due to lightning being a varying weather phenomenon, testing a device’s vulnerability to lightning is generally not as simple as simply exposing it to real world lightning. To consistently test a device’s ability to survive the worst-case scenario of lightning exposure, the effects of the most severe lightning strikes must be able to be reproduced consistently and measurably. One such facility for this purpose is the Sandia Lightning Simulator (SLS), which is designed to simulate the current waveform of a severe lightning flash. However, the SLS’s design and age lead to difficulties in its operation and inconsistencies in its output. The methodology used in other lightning simulation facilities may offer information on how to improve the SLS’s operation, or at the very least, expose the SLS’s hidden strengths. This report explores lightning simulation, lightning testing standards, and lightning simulation facilities.

42 ENGINEERING↗
NASA NTRS2013

ESD Test Apparatus for Soldering Irons

ESDA (Electrostatic Discharge Association) ESD STM 13.1-2000 requires frequent testing of the voltage leakage from the tip of a soldering iron and the resistance from the tip of the soldering iron to the common point ground. Without this test apparatus, the process is time-consuming and requires several wires, alligator clips, or test probes, as well as additional equipment. Soldering iron tips must be tested for electrostatic discharge risks frequently, and this typically takes a lot of time in setup and testing. This device enables the operator to execute the full test in one minute or less. This innovation is a simple apparatus that plugs into a digital multimeter (DMM) and the Common Point Ground (CPG) reference. It enables the user to perform two of the electrostatic discharge tests required in ESD STM 13.1-2000. The device consists of a small black box with two prongs sticking out of one end, two inputs on the opposite end (one of the inputs is used to connect the reference CPG to the DMM), and a metal tab on one side. Inside the box are wires, several washers of various materials, and assembly hardware (nuts and screws/bolts). The device is a passive electronic component that is plugged into a DMM. The operator sets the DMM to read voltage. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The voltage is read and recorded. The operator switches the DMM to read resistance. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The resistance is recorded. If the recorded voltage and resistance are below a number stated in ESDA ESD STM 13.1-2000, the test is considered to pass. The device includes all the necessary wiring internal to its body so the operator does not need to do any independent wiring, except for grounding. It uses a stack of high-thermal-resistance washers to minimize the heat transfer from the soldering iron to the wiring used to measure the resistance and voltages. This minimizes thermal error. The device allows very rapid execution of a test that is performed frequently.

Sancho, Jose↗
DOE OSTI2012

3D-FBK Pixel Sensors: Recent Beam Tests Results with Irradiated Devices

The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
NASA NTRS1974

Aerodynamic drag reduction tests on a full-scale tractor-trailer combination with several add-on devices

Aerodynamic drag tests were performed on a conventional cab-over-engine tractor with a 45-foot trailer and five commercially available or potentially available add-on devices using the coast-down method. The tests ranged in velocity from approximately 30 miles per hour to 65 miles per hour and included some flow visualization. A smooth, level runway at Edwards Air Force Base was used for the tests, and deceleration measurements were taken with both accelerometers and stopwatches. An evaluation of the drag reduction results obtained with each of the five add-on devices is presented.

Montoya, L. C.↗
DOE OSTI2015

FRONT-END ELECTRONICS FOR UNATTENDED SAFEGUARDS SYSTEMS: TESTING OF A CANDIDATE DEVICE

The International Atomic Energy Agency (IAEA) deploys unattended monitoring systems to provide continuous monitoring of nuclear material within safeguarded facilities around the world. As the number of unattended monitoring instruments increases, the IAEA is challenged to become more efficient in the implementation of those systems. In 2010, the IAEA initiated the Front-End Electronics for Unattended Measurement (FEUM) project with the goals of greater flexibility in the interfaces to various sensors and data acquisition systems, and improved capabilities for remotely located sensors (e.g., where sensor and front-end electronics might be separated by tens of meters). In consultation with the IAEA, a technical evaluation of a candidate FEUM device produced by a commercial vendor is being performed. This evaluation is assessing the device against the IAEA’s original technical specifications and a broad range of important parameters that included sensor types, cable types, and industrial electromagnetic noise that can degrade signals from remotely located detectors. Testing has been performed in a laboratory and also in environments representative of IAEA deployments. The results are expected to inform the IAEA about where and how FEUM devices might be implemented in the field. Data and preliminary findings from the testing performed to date are presented.

Smith, Leon E.↗
DOE OSTI2023

Electrodynamic Shaker Capability Estimation Through Experimental Dynamic Substructuring [Thesis]

Electrodynamic shaker systems are an essential tool in shock and vibration testing of dynamic environments. However, the specific performance capability of these systems is difficult to characterize. The dynamics of the shaker itself, the device under test and the specific test configuration used all couple to create a dynamic response unique to each test. Poorly predicted limitations in shaker capability affect the ability to achieve test specifications, delay testing schedules, and create difficulties for choosing test equipment. To predict shaker capability for a specific test configuration prior to setup, a lumped parameter model of the shaker system and a modal model of a device under test was developed. These models were then analytically coupled using LaGrange multiplier frequency based substructuring to estimate their coupled frequency response functions. The coupled frequency response functions were used to predict electrical inputs required to meet a given test specification. These input requirements were finally compared to a validation test using the specification and setup. Input requirements estimated using the substructuring estimated frequency response functions showed significant error. However, results using an ideal frequency response function showed very little error. These results indicate that with a better method of experimental dynamic substructuring employed it would be possible to accurately predict shaker capability for a given test configuration prior to setup.

42 ENGINEERING↗
NASA NTRS1989

Characterization of quantum well structures using a photocathode electron microscope

Present day integrated circuits pose a challenge to conventional electronic and mechanical test methods. Feature sizes in the submicron and nanometric regime require radical approaches in order to facilitate electrical contact to circuits and devices being tested. In addition, microwave operating frequencies require careful attention to distributed effects when considering the electrical signal paths within and external to the device under test. An alternative testing approach which combines the best of electrical and optical time domain testing is presented, namely photocathode electron microscope quantitative voltage contrast (PEMQVC).

Spencer, Michael G.↗
NASA NTRS1992

Single event phenomena: Testing and prediction

Highly integrated microelectronic devices are often used to increase the performance of satellite systems while reducing the system power dissipation, size, and weight. However, these devices are usually more susceptible to radiation than less integrated devices. In particular, the problem of sensitivity to single event upset and latchup is greatly increased as the integration level is increased. Therefore, a method for accurately evaluating the susceptibility of new devices to single event phenomena is critical to qualifying new components for use in space systems. This evaluation includes testing devices for upset or latchup and extrapolating the results of these tests to the orbital environment. Current methods for testing devices for single event effects are reviewed, and methods for upset rate prediction, including a new technique based on Monte Carlo simulation, are presented.

Kinnison, James D.↗
DOE OSTI2011

Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance

Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced 3D through-silicon-via (TSV) based technologies are outlined. The paper addresses the growing need in a simulation-based design verification flow capable to analyze a design of 3D IC stacks and to determine across-die out-of-spec variations in device electrical characteristics caused by the layout and through-silicon-via (TSV)/package-induced mechanical stress. The limited characterization/measurement capabilities for 3D IC stacks and a strict ''good die'' requirement make this type of analysis critical for the achievement of an acceptable level of functional and parametric yield and reliability. The paper focuses on the development of a design-for-manufacturability (DFM) type of methodology for managing mechanical stresses during a sequence of designs of 3D TSV-based dies, stacks and packages. A set of physics-based compact models for a multi-scale simulation to assess the mechanical stress across the device layers in silicon chips stacked and packaged with the 3D TSV technology is proposed. A calibration technique based on fitting to measured stress components and electrical characteristics of the test-chip devices is presented. A strategy for generation of a simulation feeding data and respective materials characterization approach are proposed, with the goal to generate a database for multi-scale material parameters of wafer-level and package-level structures. For model validation, high-resolution strain measurements in Si channels of the test-chip devices are needed. At the nanoscale, the transmission electron microscopy (TEM) is the only technique available for sub-10 nm strain measurements so far.

36 MATERIALS SCIENCE↗
NASA NTRS1972

Electronic test and calibration circuits, a compilation

A wide variety of simple test calibration circuits are compiled for the engineer and laboratory technician. The majority of circuits were found inexpensive to assemble. Testing electronic devices and components, instrument and system test, calibration and reference circuits, and simple test procedures are presented.

Source record↗