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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 631 records · Page 35
All sourcesNASA NTRSDOE OSTI
NASA NTRS2005

Electronic Router

Electronic Router (E-Router) is an application program for routing documents among the cognizant individuals in a government agency or other organization. E-Router supplants a prior 14 NASA Tech Briefs, May 2005 system in which paper documents were routed physically in packages by use of paper slips, packages could be lost, routing times were unacceptably long, tracking of packages was difficult, and there was a need for much photocopying. E-Router enables a user to create a digital package to be routed. Input accepted by E-Router includes the title of the package, the person(s) to whom the package is to be routed, attached files, and comments to reviewers. Electronic mail is used to notify reviewers of needed actions. The creator of the package can, at any time, see the status of the package in the routing structure. At the end of the routing process, E-Router keeps a record of the package and of approvals and/or concurrences of the reviewers. There are commercial programs that perform the general functions of E-Router, but they are more complicated. E-Router is Web-based, easy to use, and does not require the installation or use of client software.

Crusan, Jason↗
NASA NTRS1972

Testing methods and techniques: Testing electrical and electronic devices: A compilation

The methods, techniques, and devices used in testing various electrical and electronic apparatus are presented. The items described range from semiconductor package leak detectors to automatic circuit analyzer and antenna simulators for system checkout. In many cases the approaches can result in considerable cost savings and improved quality control. The testing of various electronic components, assemblies, and systems; the testing of various electrical devices; and the testing of cables and connectors are explained.

Source record↗
NASA NTRS1985

Dynamic Thermophysical Measurements in Space

The objective is to develop techniques for the dynamic measurement of selected thermophysical properties (e.g., heat of fusion, heat capacity, electrical resistivity) of solids and liquids at temperatures above 2000 K in a near zero-gravity environment. The first phase involves establishing the stability (geometrical) limits of specimens when rapidly heated to temperatures beyond their melting point. A test equipment package was designed and constructed for this purpose, consisting of removable specimen cartridge cells, a battery-bank power supply, a high-speed framing camera, a single-wavelength pyrometer, and electronic switching and control equipment. The operation of the equipment package was tested in the laboratory in preparation for near zero-gravity experiments to be performed during a KC-135 flight in September, 1984.

Cezairliyan, A.↗
NASA NTRS1990

Low cost attitude sensors for spacecraft

A review is presented of two-low cost attitude sensors developed with existing technology, but with emphasis directed to reducing the unit costs without compromising reliability or quality. The solar aspect sensor was developed to determine the angle of the sun with respect to the optical axis of the Shuttle Solar Backscatter Ultraviolet (SSBUV) Experiment Package. Using sensor readings updated every five milliseconds, signal processing electronics determine the location of the center of the sun's image on the array. An earth horizon sensor was developed to measure the nadir angle with respect to the optical axis of the SSBUV Experiment Package to an accuracy of + or - 0.5 deg. Operation of each of the sensors is described along with flight results obtained when flown onboard Atlantis as part of the SSBUV Experiment Package.

Auer, S.↗
DOE OSTI2025

Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging

Silicon carbide (SiC) power devices are playing ever- growing roles in high-power-density power electronics converters by offering benefits such as high voltage rating, fast transients, and high thermal performance. Organic direct-bonded copper (ODBC)-based packaging, due to its ductility and ease of han- dling, allows the possibility of a more flexible layout design that may better tap the potential of SiC benefits. In this work, an ODBC-based prototyping routine is developed that accelerates the iterations of packaging layout design with low cost. The properties of ODBC and its handling are briefly introduced, and tools and fabrication steps are explained. Following this routine, a 1.2-kV SiC half-bridge power module is designed and fabricated with the focus on sub-nanohenry ultra-low loop inductance. Simulation and experimental validation are also conducted.

25 ENERGY STORAGE↗
NASA NTRS1999

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗
DOE OSTI2025

AI-powered municipal solid waste management: a comprehensive review from generation to utilization

The accumulation of municipal solid waste (MSW) continues to rise due to burgeoning population, rapid global urbanization and economic growth, intensifying ecological concerns associated with landfills and greenhouse gas (GHG) emissions. Over the past 2 decades, global waste generation has surged by 50%, with one-third remaining uncollected and about 70% sent to landfills. This review examines the critical role of integrating emerging technologies, such as advanced sensors and artificial intelligence (AI), into end-to-end MSW management to alleviate landfill burdens. The suitability of various AI tools for different stages of MSW management is assessed, alongside the deployment of advanced sensors including hyperspectral cameras, computer vision systems, and internet of things (IoT) devices for material identification. Applications of genetic algorithms and reinforcement learning for optimizing collection routes, reducing costs, and lowering emissions are highlighted. Life cycle assessment (LCA) across all stages of MSW management is also reviewed, along with future trends in leveraging generative AI, natural language processing (NLP), and agent-based AI systems to analyze waste generation patterns and public sentiment. Efficient collection and handling can be enhanced through route optimization with geographic information systems and real-time bin-level monitoring. Furthermore, sensor-embedded, real-time object detection systems paired with robotics enable material characterization and automated sorting, thereby lowering costs and diverting waste from landfills into value-added products for diverse industrial sectors including packaging, chemicals, textiles, metals and glass, transportation, and electronics industries. Without intervention, global waste is projected to reach 4.54 billion tons by 2050, contributing direct economic costs of $\$$400 billion and roughly 2.38 billion tons of CO 2 -equivalent emissions annually. This review demonstrates how AI-driven, end-to-end solutions for MSW management can mitigate economic and environmental challenges, while directly supporting the United Nations Sustainable Development (UNDP) goals related to innovation and infrastructure (SDG 9), sustainable cities (SDG 11), responsible consumption and production (SDG 12), and climate action (SDG 13).

09 BIOMASS FUELS↗
NASA NTRS1978

Electronics for a focal plane crystal spectrometer

The HEAO-B program forced the usual constraints upon the spacecraft experiment electronics: high reliability, low power consumption, and tight packaging at reasonable cost. The programmable high voltage power supplies were unique in both application and simplicity of manufacture. The hybridized measurement chain is a modification of that used on the SAS-C program; the charge amplifier design in particular shows definite improvement in performance over previous work.

Goeke, R. F.↗
NASA NTRS1980

Bennett ion mass spectrometers on the Pioneer Venus Bus and Orbiter

Identical Bennett radio-frequency ion mass spectrometer instruments on the Pioneer Venus Bus and Orbiter have provided the first in-situ measurements of the detailed composition of the planet's ionosphere. The sensitivity, resolution, and dynamic range are sufficient to provide measurements of the solar-wind-induced bow-shock, the ionopause, and highly structured distributions of up to 16 thermal ion species within the ionosphere. The use of adaptive scan and detection circuits and servo-controlled logic for ion mass and energy analysis permits detection of ion concentrations as low as 5 ions/cu cm and ion flow velocities as large as 9 km/sec for O(+). A variety of commandable modes provides ion sampling rates ranging from 0.1 to 1.6 sec between measurements of a single constituent. A lightweight sensor and electronics housing are features of a compact instrument package.

Taylor, H. A., Jr.↗
NASA NTRS1990

Lightweight, Thermally Conductive Composite Material

Aluminum reinforced with carbon fibers superior to copper in some respects. Lightweight composite material has high thermal conductivity. Consists of aluminum matrix containing graphite fibers, all oriented in same direction. Available as sheets, tubes, and bars. Thermal conductivity of composite along fibers rises above that of pure copper over substantial range of temperatures. Graphite/aluminum composite useful in variety of heat-transfer applications in which reduction of weight critical. Used to conduct heat in high-density, high-speed integrated-circuit packages for computers and in base plates for electronic equipment. Also used to carry heat away from leading edges of wings in high-speed airplanes.

Sharp, G. Richard↗
NASA NTRS1991

Intelligent structures technology

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Crawley, Edward F.↗
NASA NTRS1997

A Novel Silicon Micromachined Integrated MCM Thermal Management System

"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.

Kazmierczak, M. J.↗
NASA NTRS2010

Development of an e-VLBI Data Transport Software Suite with VDIF

We have developed a software library (KVTP-lib) for VLBI data transmission over the network with the VDIF (VLBI Data Interchange Format), which is the newly proposed standard VLBI data format designed for electronic data transfer over the network. The software package keeps the application layer (VDIF frame) and the transmission layer separate, so that each layer can be developed efficiently. The real-time VLBI data transmission tool sudp-send is an application tool based on the KVTP-lib library. sudp-send captures the VLBI data stream from the VSI-H interface with the K5/VSI PC-board and writes the data to file in standard Linux file format or transmits it to the network using the simple- UDP (SUDP) protocol. Another tool, sudp-recv , receives the data stream from the network and writes the data to file in a specific VLBI format (K5/VSSP, VDIF, or Mark 5B). This software system has been implemented on the Wettzell Tsukuba baseline; evaluation before operational employment is under way.

Sekido, Mamoru↗
NASA NTRS2011

An Estimate of the Dust Pickup Currents at Enceladus

The electrodynamic environment at Enceladus is often assumed to be driven exclusively by ions produced from the moon's south polar plume. In this presentation, we demonstrate that acceleration of moon-originating submicron dust by the reduced co-rotating E-field is capable of creating a substantial current perpendicular to the magnetic field. This pickup current may be comparable to the ion pickup current, and may be large enough to deflect the local magnetic field. We will analyze observations from the Langmuir Probe that is a component of Cassini's Radio and Plasma Wave Science (RPWS) package, along with associated plasma waves that reveal electron concentrations. We will especially examine the observations from the 12 March 2008 spacecraft passage by the body, where the spacecraft was moving primarily southward taking it along-side the jet/plume emitted from the south pole of the moon. The region of dust pickup is found to originate about 3-5 Enceladus radii northward of the moon, and extends to at least 10 radii southward of the moon. We attempt to quantify the dust pickup current and describe the effect the current might have on the overall magnetoplasma and E-field environment in the vicinity of the body.

Farrell, William M.↗
NASA NTRS2018

1-Watt Radioisotope Power System for Small Spacecraft

A variety of mission concepts have been studied by NASA and the U. S. Department of Energy that would utilize low power Radioisotope Power Systems (RPS) for small probes, landers, rovers, and communication repeaters. These missions would contain science measuring instruments that could be distributed across planetary surfaces for operation in temporarily or permanently shadowed regions. High efficiency dynamic RPS could be mission enabling for science measurements on the moon, such as collecting real-time, event-based, or cumulative space radiation measurements including primary galactic cosmic rays (GCR), solar particle events (SPE), and secondary particles liberated during atmospheric and/or surface reactions. Small RPS would use fractional versions of the General Purpose Heat Source (GPHS) or Light Weight Radioisotope Heater Units (LWRHU), to heat the power conversion technologies. Capable of three to four times higher conversion efficiency than static technologies, dynamic RPS would provide an equal amount of power using less fuel or more power using an equal amount of fuel. Providing spacecraft with more power could decrease duty cycling of basic functions and increase the quality and abundance of science data. Low power Stirling convertors are being developed at NASA Glenn Research Center (GRC) to provide future micro spacecraft with electrical power by converting heat from one or more LWRHUs. An initial concept would convert eight Watts of heat to one Watt of electrical power output for science instruments and communication. The initial design, called Small Stirling Technology Exploration Power (smallSTEP), is 11 cm diameter X 32 cm long, weighs around 3 kg, and could be used to charge batteries or capacitors for higher power burst usage. Development of the 1-watt RPS includes maturation of a Stirling engine and linear alternator, an electronics controller, and an evacuated metal foil insulation package. Test hardware and facilities are being prepared for initial demonstration of the subassemblies in a laboratory environment.

Wilson, Scott↗
NASA NTRS2018

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗