High Thermal Conductivity, Radiation Resistant Adhesive for High Energy Physics
High Energy Physics systems include particle detector electronics that are integrated with cooling channels and structural housings. Adhesives used to bond these devices to the cooling lines and housings should contribute to cooling by conducting heat away from the electronics and preventing hot spots from developing in either the electronics or the housing. Effective cooling can produce order of magnitude reduction in electronics failure rates. During Phase I, Surmet demonstrated feasibility of a novel radiation-tolerant high-thermal-conductivity adhesive for HEP systems. This was achieved through use of suitable high thermal conductivity fillers to resin adhesive. Feasibility of the technology was demonstrated through key processing and characterization/testing work. The novel filled adhesive was produced in thin-film form to promote heat removal performance and simplify assembly. It was shown to have thermal conductivity >35x that of conventional epoxies. It was shown to successfully withstand strong gamma and proton irradiation. This was demonstrated through density and microstructural characterization as well as thermal conductivity and strength measurement, before and after irradiation. Finally, production of the novel filled adhesive relies on mature processing techniques, simplifying the transition to scale-up and commercialization. During the course of Phase I, Surmet held discussions with a number of researchers working on DOE HEP systems, to understand requirements. These discussions guided the Phase I research, and will be used to plan out follow-on Phase II work. In Phase II research, we will optimize the filled adhesive and tailor it to various product forms to address the multiple applications. Surmet has teamed with a major filled-resin products manufacturer who sees a high commercialization potential for our technology. This team-up will promote development of technology that is well suited for commercialization beyond Phase II.