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Results for “Electronics Packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS2015

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

Ghaffarian, Reza↗
NASA NTRS2004

Electronic packaging for extended Mars surface missions

Extended Mars missions will require vehicles to survive a large number of extended temperature cycles. To address this issue for electronics, previous strategies have been to locate critical electronics in a "warm electronics box" where thermal management is more easily maintained. However, that strategy limits the number and location of electronics. An alternative strategy allows electronics to be remotely located on actuator and wheel arms with no heating which has the advantage of distributed control.

Mojarradi, Mohammad M.↗
NASA NTRS1995

(abstract) Designing for Small Volume Assembly of Advanced Electronics Packages

There is a need for high reliability surface mount assembly processes for aerospace, military, and medical applications. This approach for improving design for producibility and reliability of electronic system assembly processes can be utilized as a starting framework. Described herein is a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs.

assembly processes↗
NASA NTRS2012

Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

Hoffman, James Patrick↗
DOE OSTI2026

Enhancing 300 Degree Celsius Electronic Packaging with Ceramic PCBs and Advanced Interconnection Techniques

Geothermal energy development requires downhole tools that operate reliably at temperatures up to 320 °C. While MWD tools work without thermal protection and logging tools use vacuum flasks for limited high-temperature use, Sandia National Laboratories is developing durable electronics on ceramic PCBs with protective coatings to enable long-term operation of geothermal instruments at sustained temperatures up to 300 °C.

Wright, Andrew Alexander [Sandia National Laborato↗
NASA NTRS2013

Actuator and electronics packaging for extrinsic humanoid hand

The lower arm assembly for a humanoid robot includes an arm support having a first side and a second side, a plurality of wrist actuators mounted to the first side of the arm support, a plurality of finger actuators mounted to the second side of the arm support and a plurality of electronics also located on the first side of the arm support.

Ihrke, Chris A.↗
NASA NTRS1995

Designing for Small Volume Assembly of Advanced Electronics Packages

We describe a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs. In cases where the entire volume for fabrication is less than five products, traditional Statistical Process Control (SPC) is inadequate due to reliance on statistics of much larger volumes and the Central Limit Theorem. Data acquisition for process parameter estimation from such a small sample size is difficult; however, it is critical to producing high reliability product.

Central Limit Theorem statistics high reliability ↗
DOE OSTI2023

Silicon Carbide Inverter for Off-Road Heavy-Duty Applications: The Importance of Thermal and Thermomechanical Design in Power Electronics Packaging

Electrification of drivetrain systems is now seen as a major opportunity by the transportation industry across the globe to reduce the greenhouse gas emissions and revolutionize the travel patterns of millions of people. The cumulative number of plug-in hybrid and battery electric vehicles (EVs) sold in the United States has now surpassed 2 million in 2021, according to the International Energy Agency. The introduction of EVs in different classes of passenger vehicles and the continued drop in prices spurred by government incentives have attracted the attention of consumers despite certain barriers, such as higher initial cost and range anxiety. In the United States, the EV market share is now growing at an exponential pace, with the domestic automakers allocating a lion's share of new and future car sales to EVs. Additionally, different market studies project decreasing cost and rising sales of medium- and heavy-duty electric trucks. Although electrification initiatives are strongly pursued in the on-road passenger vehicle market, off-highway sectors, such as construction, mining, and agriculture, are also gradually implementing electric drivetrain technologies in their machineries. As EVs grow in popularity on a global scale, innovative drivetrain technologies must meet the increasing energy demand by significantly increasing system efficiency.

ADVANCED PROPULSION SYSTEMS↗
NASA NTRS1970

Electronic packaging and cabling

Testing electrical, mechanical, and handling properties and environmental characteristics of small gage electrical wire for interplanetary spacecraft

Source record↗
NASA NTRS1975

Thermal control of power supplies with electronic packaging techniques

The analysis, design, and development work to reduce the weight and size of a standard modular power supply with a 350 watt output was summarized. By integrating low cost commercial heat pipes in the redesign of this power supply, weight was reduced by 30% from that of the previous design. The temperature was also appreciably reduced, increasing the environmental capability of the unit. A demonstration unit with a 100 watt output and a 15 volt regulator module, plus simulated output modules, was built and tested to evaluate the thermal performance of the redesigned power supply.

Source record↗
NASA NTRS1977

Thermal control of power supplies with electronic packaging techniques

The integration of low-cost commercial heat pipes in the design of a NASA candidate standard modular power supply with a 350 watt output resulted in a 44% weight reduction. Part temperatures were also appreciably reduced, increasing the environmental capability of the unit. A complete 350- watt modular power converter was built and tested to evaluate thermal performance of the redesigned supply.

Source record↗
NASA NTRS1999

Electronic Packaging for Space Applications Workshop 1999

This paper presents viewgraphs on the Commercial Off-The-Shelf (COTS) Program. The topics include: 1) Advocacy for COTS; 2) MARS01 Program/Requirements; 3) MARS01 COTS Screening Flow; 4) Test Results-Electrical, C-Sam, Burn-In; 5) Value Added Analysis (Risk Reduction); 6) Value Added Analysis (Cost); 7) Impact of COTS ++ Screening and 8) Summary.

Sandor, Mike↗