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Water boiler and water sublimator heat sink concepts, visualization test module, and sublimation mechanism
We are developing large, close-packed arrays of x-ray transition-edge sensor (TES) microcalorimeters. In such a device, sufficient heat sinking is important to to minimize thermal cross talk between pixels and to stabilize the bath temperature for all pixels. We have measured cross talk on out 8 x 8 arrays and studied the shape and amount of thermal crosstalk as a function of pixel location and efficiency of electrothermal feedback. In this presentation, we will compare measurements made on arrays with and without a backside, heat-sinking copper layer, as well as results of devices on silicon-nitride membranes and on solid substrates, and we will discuss the implications for energy resolution and maximum count rate. We will also discuss the dependence of pulse height upon bath temperature, and the measured and required stability of the bath temperature.
This technology investigation was conducted to evaluate the feasibility of a number of thermal protection systems (TPS) concepts which are alternate candidates to the space shuttle baseline TPS. Four independent tasks were performed. Task 1 consisted of an in-depth evaluation of active structural cooling of the space shuttle orbiter. In Task 2, heat sink concepts for the booster were studied to identify and postulate solutions for design problems unique to heat sink TPS. Task 3 consisted of a feasibility demonstration test of a phase change material (PCM) incorporated into a reusable surface insulation (RSI) thermal protection system for the shuttle orbiter. In Task 4 the feasibility of heat pipes for stagnation region cooling was studied for the booster and the orbiter. Designs were developed for the orbiter leading edge and used in trade studies of leading edge concepts. At the time this program was initiated, a 2-stage fully reusable shuttle system was envisioned; therefore, the majority of the tasks were focused on the fully reusable system environments. Subsequently, a number of alternate shuttle system approaches, with potential for reduced shuttle system development funding requirements, were proposed. Where practicable, appropriate shifts in emphasis and task scoping were made to reflect these changes.
The design, fabrication, and testing of a representative shuttle evaporative heat sink (RSEHS) system which vaporizes an expendable fluid to provide cooling for the shuttle heat transport fluid loop is reported. The optimized RSEHS minimum weight design meets or exceeds the shuttle flash evaporator system requirements. A cold trap which cryo-pumps flash evaporator exhaust water from the CSD vacuum chamber test facility to prevent water contamination of the chamber pumping equipment is also described.
A phase change material (PCM) heat sink using super cooled ice as a nontoxic, nonflammable PCM is being developed. The latent heat of fusion for water is approximately 70% larger than most paraffin waxes, which can provide significant mass savings. Further mass reduction is accomplished by super cooling the ice significantly below its freezing temperature for additional sensible heat storage. Expansion and contraction of the water as it freezes and melts is accommodated with the use of flexible bag and foam materials. A demonstrator unit has been designed, built, and tested to demonstrate proof of concept. Both testing and modeling results are presented along with recommendations for further development of this technology.
Astronaut cooling during extravehicular activity is a critical design issue in developing a portable life support system that meets the requirements of a space station mission. Some the requirements are that the cooling device can be easily regenerable and nonventing during operation. In response to this, a direct-interface, fusible heat sink prototpye with freezable quick-disconnects was developed. A proof-of-concept prototype was constructed and tested that consists of an elastic container filled with normal tap water and having two quick-disconnects embedded in a wall. These quick-disconnects are designed so that they may be frozen with the ice and yet still be joined to the cooling system, allowing an immediate flow path. The inherent difficulties in a direct-interface heat sink have been overcome, i.e., (1) establishing an initial flow path; (2) avoiding low-flow freeze-up; and (3) achieving adequate heat-transfer rates at the end of the melting process. The requirements, design, fabrication, and testing are discussed.
Astronaut cooling during extravehicular activity is a critical design issue in developing a portable life support system that meets the requirements of a space station mission. Some of the requirements are that the cooling device can be easily regenerable and nonventing during operation. In response to this, a direct-interface, fusible heat sink prototype with freezable quick-disconnects was developed. A proof-of-concept prototype was constructed and tested that consists of an elastic container filled with normal tap water and having two quick-disconnects embedded in a wall. These quick-disconnects are designed so that they may be frozen with the ice and yet still be joined to the cooling system, allowing an immediate flow path. The inherent difficulties in a direct-interface heat sink have been overcome, i.e., (1) establishing an initial flow path; (2) avoiding low-flow freeze-up; and (3) achieving adequate heat-transfer rates at the end of the melting process. The requirements, design, fabrication, and testing are discussed.
Material and performance tests of water boiler and water sublimator heat sink modules
Thermal path prevents voids and discontinuities which make heat sinks in electronic equipment inefficient. The thermal path combines the high thermal conductivity of copper with the resiliency of silicone rubber.
MEMS-based microchannel heat sinks are being investigated at the Jet Propulsion Laboratory for use in micro/nano spacecraft thermal control.
The x-ray calorimeter array of the Soft X-ray Spectrometer (SXS) of the Astro-H satellite will incorporate a silicon thermistor array produced during the development of the X-Ray Spectrometer (XRS) of the Suzaku satellite. On XRS, inadequate heat sinking of the array led to several non-ideal effects. The thermal crosstalk, while too small to be confused with x-ray signals, nonetheless contributed a noise term that could be seen as a degradation in energy resolution at high flux. When energy was deposited in the silicon frame around the active elements of the array, such as by a cosmic ray, the resulting pulse in the temperature of the frame resulted in coincident signal pulses on most of the pixels. In orbit, the resolution was found to depend on the particle background rate. In order to minimize these effects on SXS, heat-sinking gold was applied to areas on the front and back of the array die, which was thermally anchored to the gold of its fanout board via gold wire bonds. The thermal conductance from the silicon chip to the fanout board was improved over that of XRS by an order of magnitude. This change was sufficient for essentially eliminating frame events and allowing high-resolution to be attained at much higher counting rates. We will present the improved performance, the measured crosstalk, and the results of the thermal characterization of such arrays.
Reduction of thermal resistance between a power transistor case and a heat sink in space, through insertion of indium foils
Stagnation point velocity and pressure distribution over heat-sink shielded reentry vehicle to test boundary layer heat transfer theories
In the continuous adiabatic demagnetization refrigerator (ADR), the existence of a constant temperature stage attached to the load breaks the link between the requirements of the load (usually a detector array) and the operation of the ADR. This allows the ADR to be cycled much faster, which yields more than an order of magnitude improvement in cooling power density over single-shot ADRs. Recent effort has focused on developing compact, efficient higher temperature stages. An important part of this work has been the development of passive gas-gap heat switches that transition (from conductive to insulating) at temperatures around 1 K and 4 K without the use of an actively heated getter. We have found that by carefully adjusting available surface area and the number of He-3 monolayers, gas-gap switches can be made to operate passively. Passive operation greatly reduces switching time and eliminates an important parasitic heat load. The current four stage ADR provides 6 micro W of cooling at 50 mK (21 micro W at 100 mK) and weighs less than 8 kg. It operates from a 4.2 K heat sink, which can be provided by an unpumped He bath or many commercially available mechanical cryocoolers. Reduction in critical current with temperature in our fourth stage NbTi magnet presently limits the maximum temperature of our system to approx. 5 K. We are developing compact, low-current Nb3Sn magnets that will raise the maximum heat sink temperature to over 10 K.
Cost and weight data for space shuttle booster heat sink structural concept
Power semiconductor die placement on substrates used in high-power modules is generally optimized to minimize electrical parasitic (e.g., stray inductance, common-mode capacitance), taking into account the minimum spacing between semiconductor dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. Insulated metal substrate-based power module designs may lead to asymmetrical thermal resistance across the dies, which may cause significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to oversizing the cooling system design or underusing the semiconductor power processing capability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.
Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules.
The design, development, and test of a functional laboratory model ice pack heat sink subsystem are discussed. Operating instructions to include mechanical and electrical schematics, maintenance instructions, and equipment specifications are presented.