Microelectronic packaging
Hybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
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Hybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
Ninety-eight-channel microelectronic PCM MULTIPLEXER-ENCODER design and development qualified to Apollo spacecraft environments
NASA program for microelectronic circuit and space vehicle reliability
IR techniques for reliability enhancement of microelectronics
Implant telemetry techniques and associated problems and potential of microelectronics
The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
Advances in microelectronics technologies over the past several decades have truely revolutionized modern society in almost every aspect of human endeavor.
Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies.
Describes the New Millenium Program, including the scope of the Microelectronics Systems IPDT as well as its current membership. Also summarizes the results of the IPDT technology roadmapping process. They describe the technologies selected as well as the avionics architecture chosen for validation of the first NMP spacecraft, to be launched inJauary 1998.
Material degradation during the fabrication of microelectronic devices has plagued the space industry for many years owing to the layering of many dissimilar metals to create these devices. Often, commonly used materials and systems are overlooked as potential sources of material degradation. This technical bulletin highlights extensive research to isolate probable causes of this degradation.
Securing defense-critical supply chains, built on resilient and sustainable microelectronics fabrication and deployment, is a national imperative and one that requires an investment in basic and applied research, development, and deployment into industries in (and out of) the Defense Industrial Base (DIB). Critical next steps include the development of pilots for revolutionary concepts in a new formal verification model and the Cyber-Physical Passport (CPP) concept for chain of custody. Critical infrastructure leadership should take action with a sense of urgency. Working in conjunction with the Under Secretary for Acquisition and Sustainment, the Assistant Secretary of Defense for Research and Engineering should establish pilot programs with the Defense Advanced Research Projects Agency and the service labs to build and test both concepts in legacy and new system development.. Additionally, the Pentagon may be aware that an existing Manufacturing Innovation Institute is piloting, with the semiconductor industry, cyber innovations to provide verifiable security properties and guarantees of physical functions to build a more cyber secure, resilient and efficient micro-electronics supply chain.
Slides providing an overview of microelectronics cybersecurity and research concepts at INL.
In the past, the role of strategic planning for semiconductor industry was met by the International Technology Roadmap for Semiconductors (ITRS), serving as a guiding light that provided manufacturers, designers, equipment suppliers, and researchers with direction years in advance. By providing a common framework for coordination across semiconductor industry stakeholders, technology development efforts were efficient and aligned. However, the dissolution of the ITRS in 2015 left a void, leading to years of disjointed efforts. Recognizing the need for unified guidance, the industry rallied for the creation of a new strategic plan, the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap (2023) was developed, through the efforts of hundreds of industry, academic and government experts, to provide detailed strategies for achieving these goals. This comprehensive plan outlines ambitious goals for the industry's future.
The MicroEleX code package contains a variety of models and algorithms for physical modeling of microelectronic circuitry, including electrostatics, electrodynamics, superconducting physics, micromagnetics, multi-ferroic systems, and quantum transport. MicroEleX leverages the AMReX software framework to provide scalability on GPU-based supercomputing architectures. The code is open source and designed to be algorithmically flexible so developers can incorporate enhanced or customized physics.
Data is a valuable commodity, and it is often dispersed over multiple entities. Sharing data or models created from the data is not simple due to concerns regarding security, privacy, ownership, and model inversion. This limitation in sharing can hinder model training and development. Federated learning can enable data or model sharing across multiple entities that control local data without having to share or exchange the data themselves. Differential privacy is a conceptual framework that brings strong mathematical guarantee for privacy protection and helps provide a quantifiable privacy guarantee to any data or models shared. The concepts of federated learning and differential privacy are introduced along with possible connections. Lastly, some open discussion topics on how federated learning and differential privacy can tied to AI-Enhanced co-design of microelectronics are highlighted.
A pulsed laser testing system for rapid screening of single-event latch-up (SEL) in microelectronics with real-time visualization of sensitive nodes via photo-emission is presented. We provide a detailed overview of the system, followed by SEL threshold measurements in an analog-to-digital converter (AD9240). We find that SEL thresholds are comparable to measurements taken with a low-repetition rate, fixed beam system, and demonstrate full-die scanning speeds can be an order of magnitude faster
Design philosophy and fabrication technology of microelectronic function blocks for spacecraft electronic equipment
Microelectronic function blocks and their use in low level amplifiers for space applications